HSMx-A46x-xxxxx SMT LED Surface Mount LED Indicator Data Sheet Description Features The Power PLCC-4 SMT LED with Lens are high performance PLCC-4 package size SMT LEDs targeted mainly in Automotive & Electronics Signs and Signals (ESS) markets. These top-mount single-chip packages with focused radiation offer high brightness in beam direction and are excellent for interior automotive, indoor and outdoor sign and industrial applications. With additional lens in 50° variants, these products are especially fitting to applications for Mono-color Text Display, CHMSL and displays. • Industry standard PLCC-4 The PLCC-4 package family is able to dissipate heat better compared to the PLCC-2 packages. In proportion to this increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. As an extension of the standard flat top PLCC-4 SMT LEDs, the Power PLCC-4 with Lens device is able to provide focused beams within narrow viewing angles (50°) meeting the market’s requirements for focused radiation and high brightness in beam directions. The Power PLCC-4 SMT LED with 50° is ideal for panel, push button, general backlighting, automotive interior & exterior (cluster backlighting, side repeaters, brake lights), sign and symbol illumination, office equipment, industrial equipment and home appliances applications. This package design coupled with careful selection of component materials allow the Power PLCC-4 SMT LED with Lens to perform with higher reliability in a larger temperature range -40°C to 100°C. This high reliability feature is crucial to allow the Power PLCC-4 SMT LED with Lens to do well in harsh environments such as its target Automotive & ESS markets. The Power PLCC4 SMT LED with Lens package is also designed to be compatible with both IR-solder re-flow and throughthe-wave soldering. • High reliability LED package • High brightness using AlInGaP dice technologies • High optical efficiency • Narrow Viewing angle at 50° • Available in 8mm carrier tape on 7-inch reel Applications • Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting – Navigation and audio system – Dome lighting – Push button backlighting • Exterior automotive – Turn signals – CHMSL – Rear combination lamp – Side repeaters • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting Package Drawing Note: 1. All Dimensions in millimeters. 2. Terminal Finish: Ag plating 3. Electrical connection between all cathode is recommended Figure 1. Package Drawing Pin HSMx-A46x Lead Configuration 1 Cathode 2 Anode 3 Cathode 4 Cathode Table 1. Device Selection Guide Luminous Intensity, FV [1] (mcd) Color Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology Amber HSMA-A460-W50M1 1125 2100 3550 50 AlInGaP Amber HSMA-A461-X83M1 2240 3300 5600 50 AlInGaP Red HSMC-A460-U30M1 450 580 900 50 AlInGaP Red HSMC-A461-V00M1 715 1750 - 50 AlInGaP Orange HSML-A461-W40M1 1125 1850 2850 50 AlInGaP Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ±12% Part Numbering System H S M x 1 − A x 2 x3 x4 − x5 x6 x7 x8 x9 Packaging Option Color Bin Selection Intensity Bin Selection Device Specific Configuration Package Type LED Chip Color Table 2. Absolute Maximum Ratings (TA = 25 °C) Parameters HSMA/C/L DC Forward Current [1] 70 mA Peak Forward Current [2] 200 mA Power Dissipation 180 mW Reverse Voltage 5V Junction Temperature 110°C Operating Temperature -40 °C to +100 °C Storage Temperature -40 °C to +100 °C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TA = 25 °C) Dice Technology Peak Wavelength lPEAK (nm) Dominant Wavelength lD [1] (nm) Viewing Angle 2q½ [2] (Degrees) Luminous Efficacy hV [3] (lm/W) Luminous Efficiency he (lm/W) Luminous Intensity/ Total Flux [4, 5] IV (cd) / FV (lm) Typ. Typ. Typ. Typ. Typ. Typ. Color Part Number Amber HSMA-A46x AlInGaP 592 590 50 480 22 1.35 Red HSMC-A46x AlInGaP 635 626 50 150 19 1.15 Orange HSML-A46x AlInGaP 609 605 50 320 23 1.05 Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt. 4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions. Table 4. Electrical Characteristics (TA = 25 °C) Reverse Voltage VR @ 100mA Part Number Typ. Max. Min. Thermal Resistance RqJ-P (°C/W) HSMA-A46x 2.20 2.50 5 110 HSMC-A46x 2.20 2.50 5 110 HSML-A46x 2.20 2.50 5 110 Forward Voltage VF (Volts) @ IF = 50 mA 1.0 0.9 AlInGaP Orange RELATIVE INTENSITY 0.8 AlInGaP Amber 0.7 AlInGaP Red 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm 80 1.6 70 1.4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 50 mA) FORWARD CURRENT - mA Figure 2. Relative Intensity Vs. Wavelength 60 50 HSMA/C/L 40 30 20 0 0.5 1 1.5 2 2.5 Figure 3. Forward Current Vs. Forward Voltage. 0.8 0.6 0.4 NORMALIZED LUMINOUS INTENSITY 2 AlInGaP Amber AlInGaP Orange 1.5 AlInGaP Red 1 0.5 -25 0 0 25 50 75 AMBIENT TEMPERATURE - °C Figure 5. Relative Intensity Vs. Temperature 0 10 20 30 40 100 125 50 60 DC FORWARD CURRENT - mA Figure 4. Relative Intensity Vs. Forward Current 2.5 1 0 FORWARD VOLTAGE - V -50 HSMA 1.2 0.2 10 0 HSMC/L 70 80 80 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 80 Rθ JA = 300°C/W 60 Rθ JA= 350°C/W 40 Rθ JA= 470°C/W 20 0 0 20 40 60 80 AMBIENT TEMPERATURE - °C 100 40 20 0 120 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 110°C, RqJ-A= 300°C/W, 350°C/W and 470°C/W. 60 0 20 0.15 DOMINANT WAVELENGTH - nm FORWARD VOLTAGE SHIFT - V AlInGaP Red 625 620 615 610 AlInGaP Orange 605 600 595 AlInGaP Amber 590 0 10 20 30 40 50 FORWARD CURRENT - mA 60 70 80 Figure 7. Dominant Wavelength Vs. Forward Current. 1 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 9. Radiation Pattern 0.1 0.05 -50 -25 0 0 25 90 50 -0.05 -0.1 -0.15 JUNCTION TEMPERATURE - °C Figure 8. Forward Voltage Shift Vs. Temperature. 0.9 0 120 Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 110°C, RqJ-P = 110°C/W. 630 585 40 60 80 100 SOLDER POINT TEMPERATURE (°C) 75 100 TEMPERATURE 10 to 20 SEC. 255 ˚C +5˚C -0˚C 217˚C -6˚C/SEC MAX. 3˚C/SEC MAX. 125˚C +/- 25˚C 60-150 SEC. MAX. 120 SEC. TIME Figure 10. Recommended Pb-free Reflow Soldering Profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. X 2.60 (0.103) X 0.40 (0.016) 1.10 (0.043) 0.50 (0.020) Y 4.50 (0.178) 1.50 (0.059) Y DIMENSIONS IN mm (INCHES). SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Thermal Resistance Solder pad area (xy) 300°C/W >16mm2 350°C/W >12mm2 470°C/W >8mm2 Figure 11a. Recommended Soldering Pad Patter X X 0.5 (0.020) 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) DIMENSIONS IN mm (INCHES). Figure 11b. Recommended Soldering Pad Patter (TTW) 1.0 (0.039) 2.0 (0.079) Y SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Figure 12. Soft Tip Vacuum Pick-up Tool for extracting SMT LED Components from Carrier Tape. TRAILER 200 mm MIN. FOR ∅ 180 REEL. 200 mm MIN. FOR ∅ 330 REEL. COMPONENT LEADER 480 mm MIN. FOR ∅ 180 REEL. 960 mm MIN. FOR ∅ 330 REEL. C A USER FEED DIRECTION Figure 13. Tape Leader and Trailer Dimensions. Figure 14. Tape Dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 15. Reeling Orientation. Moisture Sensitivity This product is qualified as Moisture Sensitive Level xx per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - “10%” or “15%” HIC indicator turns pink. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60±5°C for 20 hours. Intensity Bin Select (X5X6) Color Bin Select (X7) Individual reel will contain parts from one half bin only Individual reel will contain parts from one full bin only. X5 X7 Min IV Bin X6 0 Full Distribution 0 Full Distribution Z A and B only 2 2 half bins starting from X51 Y B and C only 3 3 half bins starting from X51 W C and D only 4 4 half bins starting from X51 V D and E only 5 5 half bins starting from X51 U E and F only 6 2 half bins starting from X52 Q A, B and C only 7 3 half bins starting from X52 P B, C and D only 8 4 half bins starting from X52 N C, D and E only 9 5 half bins starting from X52 M D, E and F only 1 A, B, C and D only 3 B, C, D and E only C, D, E and F only Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) 4 U1 450.00 560.00 5 A, B, C, D and E only U2 560.00 715.00 6 B, C, D, E, and F only V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 Amber Min. (nm) Max. (nm) W2 1400.00 1800.00 A 582.0 584.5 X1 1800.00 2240.00 B 584.5 587.0 X2 2240.00 2850.00 C 587.0 589.5 Y1 2850.00 3550.00 D 589.5 592.0 Y2 3550.00 4500.00 E 592.0 594.5 Z1 4500.00 5600.00 F 594.5 597.0 Z2 5600.00 7150.00 11 7150.00 9000.00 Orange Min. (nm) Max. (nm) 12 9000.00 11250.00 A 597.0 600.0 21 11250.00 14000.00 B 600.0 603.0 22 14000.00 18000.00 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 Red Min. (nm) Max. (nm) Full Distribution 620.0 635.0 Tolerance of each bin limit = ± 12% Color Bin Limits Tolerance of each bin limit = ±1nm Packaging Option (X8 X9) Option Test Current Package Type Reel Size M1 50mA Top Mount 7 VF Bin Limits Bin ID Min. Max. VA 1.9 2.2 VB 2.2 2.5 VC 2.5 2.8 VD 2.8 3.1 VE 3.1 3.4 Tolerance of each bin limit = ±0.1V For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0529EN - June 26, 2007