AD S1 274 ADS1274 ADS1278 AD S1 278 www.ti.com SBAS367 – JUNE 2007 Quad/Octal, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters FEATURES 1 • • • 234 • • • • • • • • • Simultaneously Measure Four/Eight Channels Up to 128kSPS Data Rate AC Performance: 62kHz Bandwidth 111dB SNR (High-Resolution Mode) –108dB THD DC Accuracy: 0.8μV/°C Offset Drift 1.3ppm/°C Gain Drift Selectable Operating Modes: High-Speed: 128kSPS, 106dB SNR High-Resolution: 52kSPS, 111dB SNR Low-Power: 52kSPS, 31mW/ch Low-Speed: 10kSPS, 7mW/ch Linear Phase Digital Filter SPI™ or Frame-Sync Serial Interface Low Sampling Aperture Error Modulator Output Option (digital filter bypass) Analog Supply: 5V Digital Core: 1.8V I/O Supply: 1.8V to 3.3V APPLICATIONS • • • • Input1 DS Input2 DS Input3 DS Input4 DS AGND AVDD DVDD Four Digital Filters Based on the single-channel ADS1271, the ADS1274 (quad) and ADS1278 (octal) are 24-bit, delta-sigma (ΔΣ) analog-to-digital converters (ADCs) with data rates up to 128k samples per second (SPS), allowing simultaneous sampling of four or eight channels. The devices are offered in identical packages, permitting drop-in expandability. Traditionally, industrial delta-sigma ADCs offering good drift performance use digital filters with large passband droop. As a result, they have limited signal bandwidth and are mostly suited for dc measurements. High-resolution ADCs in audio applications offer larger usable bandwidths, but the offset and drift specifications are significantly weaker than respective industrial counterparts. The ADS1274 and ADS1278 combine these types of converters, allowing high-precision industrial measurement with excellent dc and ac specifications. The high-order, chopper-stabilized modulator achieves very low drift with low in-band noise. The onboard decimation filter suppresses modulator and signal out-of-band noise. These ADCs provide a usable signal bandwidth up to 90% of the Nyquist rate with less than 0.005dB of ripple. Four operating modes allow for optimization of speed, resolution, and power. All operations are controlled directly by pins; there are no registers to program. The devices are fully specified over the extended industrial range (–40°C to +105°C) and are available in an HTQFP-64 PowerPAD™ package. Vibration/Modal Analysis Multi-Channel Data Acquisition Acoustics/Dynamic Strain Gauges Pressure Sensors VREFP VREFN DESCRIPTION IOVDD VREFP VREFN AVDD SPI and FrameSync Interface DRDY/FSYNC SCLK DOUT[4:1] DIN Control Logic TEST[1:0] FORMAT[2:0] CLK SYNC PWDN[4:1] CLKDIV MODE[1:0] DGND ADS1274 Input1 DS Input2 DS Input3 DS Input4 DS Input5 DS Input6 DS Input7 DS Input8 DS AGND DVDD IOVDD SPI and FrameSync Interface DRDY/FSYNC SCLK DOUT[8:1] DIN Control Logic TEST[1:0] FORMAT[2:0] CLK SYNC PWDN[8:1] CLKDIV MODE[1:0] Eight Digital Filters DGND ADS1278 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments, Inc. SPI is a trademark of Motorola, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range unless otherwise noted (1) ADS1274, ADS1278 UNIT AVDD to AGND –0.3 to +6.0 V DVDD, IOVDD to DGND –0.3 to +3.6 V AGND to DGND –0.3 to +0.3 V Momentary 100 mA Continuous 10 mA Analog input to AGND –0.3 to AVDD + 0.3 V Digital input or output to DGND –0.3 to DVDD + 0.3 V Input current +150 °C ADS1274 –40 to +125 °C ADS1278 –40 to +105 °C –60 to +150 °C Maximum junction temperature Operating temperature range Storage temperature range (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 2 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 ELECTRICAL CHARACTERISTICS All specifications at TA = –40°C to +105°C, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, VREFN = 0V, and all channels active, unless otherwise noted. ADS1274, ADS1278 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Analog Inputs Full-scale input voltage (FSR (1)) VIN = (AINP – AINN) Absolute input voltage AINP or AINN to AGND Common-mode input voltage (VCM) VCM = (AINP + AINN)/2 Differential input impedance ±VREF AGND – 0.1 V AVDD + 0.1 V 2.5 V High-Speed mode 14 kΩ High-Resolution mode 14 kΩ Low-Power mode 28 kΩ Low-Speed mode 140 kΩ DC Performance Resolution No missing codes Bits 128,000 SPS fCLK = 27MHz 105,469 SPS (3) High-Resolution mode 52,734 SPS Low-Power mode 52,734 SPS Low-Speed mode 10,547 High-Speed mode Data rate (fDATA) 24 fCLK = 32.768MHz (2) Integral nonlinearity (INL) (4) SPS ±0.0003 ±0.0012 Offset error 0.25 2 Offset drift 0.8 Gain error 0.1 Gain drift 1.3 Noise Differential input, VCM = 2.5V % FSR ppm/°C Shorted input 8.5 16 μV, rms Shorted input 5.5 12 μV, rms Low-Power mode Shorted input 8.5 16 μV, rms Low-Speed mode Shorted input 8.0 16 μV, rms fCM = 60Hz DVDD fPS = 60Hz IOVDD VCOM output voltage (3) (4) 0.5 High-Resolution mode AVDD (1) (2) mV μV/°C High-Speed mode Common-mode rejection Power-supply rejection % FSR (1) No load 90 108 dB 80 dB 85 dB 105 dB AVDD/2 V FSR = full-scale range = 2VREF. fCLK = 32.768MHz max for High-Speed mode, and 27MHz max for all other modes. When fCLK > 27MHz, operation is limited to Frame-Sync mode and VREF ≤ 2.6V. SPS = samples per second. Best fit method. 3 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 ELECTRICAL CHARACTERISTICS (continued) All specifications at TA = –40°C to +105°C, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, VREFN = 0V, and all channels active, unless otherwise noted. ADS1274, ADS1278 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT AC Performance f = 1kHz, –0.5dBFS (5) Crosstalk High-Speed mode Signal-to-noise ratio (SNR) (6) (unweighted) High-Resolution mode VREF = 2.5V –107 dB 101 106 dB 103 110 dB 111 dB dB VREF = 3V Low-Power mode 101 106 Low-Speed mode 101 107 Total harmonic distortion (THD) (7) VIN = 1kHz, –0.5dBFS –108 Spurious-free dynamic range 109 Passband ripple –3dB Bandwidth Stop band Group delay Settling time (latency) High-Resolution mode dB 0.453 fDATA Hz 0.49 fDATA Hz 95 All other modes dB dB ±0.005 Passband Stop band attenuation dB –96 dB 100 High-Resolution mode 0.547 fDATA 127.453 fDATA Hz All other modes 0.547 fDATA 63.453 fDATA Hz High-Resolution mode 39/fDATA s All other modes 38/fDATA s High-Resolution mode Complete settling 78/fDATA s All other modes Complete settling 76/fDATA s Voltage Reference Inputs Reference input voltage (VREF) (VREF = VREFP – VREFN) fCLK = 27MHz 0.5 2.5 3.1 V fCLK = 32.768MHz (8) 0.5 2.5 2.6 V V Negative reference input (VREFN) AGND – 0.1 AGND + 0.1 Positive reference input (VREFP) VREFN + 0.5 AVDD + 0.1 ADS1274 Reference Input impedance ADS1278 Reference Input impedance V High-Speed mode 1.3 kΩ High-Resolution mode 1.3 kΩ Low-Power mode 2.6 kΩ Low-Speed mode 13 kΩ High-Speed mode 0.65 kΩ High-Resolution mode 0.65 kΩ Low-Power mode 1.3 kΩ Low-Speed mode 6.5 kΩ Digital Input/Output (IOVDD = 1.8V to 3.6V) VIH 0.7 IOVDD IOVDD V VIL DGND 0.3 IOVDD V V VOH IOH = 4mA 0.8 IOVDD IOVDD VOL IOL = 4mA DGND 0.2 IOVDD V ±10 μA Input leakage Master clock rate (fCLK) (5) (6) (7) (8) 0 < VIN DIGITAL < IOVDD High-Speed mode (8) 0.1 32.768 MHz Other modes 0.1 27 MHz Worst-case channel crosstalk between one or more channels. Minimum SNR is ensured by the limit of the DC noise specification. THD includes the first nine harmonics of the input signal; Low-Speed mode includes the first five harmonics. fCLK = 32.768MHz max for High-Speed mode, and 27MHz max for all other modes. When fCLK > 27MHz, operation is limited to Frame-Sync mode and VREF ≤ 2.6V. 4 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 ELECTRICAL CHARACTERISTICS (continued) All specifications at TA = –40°C to +105°C, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, VREFN = 0V, and all channels active, unless otherwise noted. ADS1274, ADS1278 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power Supply AVDD 4.75 5 5.25 V DVDD 1.65 1.8 1.95 V IOVDD 1.65 Power-down current 3.6 V AVDD 1 10 μA DVDD 1 15 μA IOVDD 1 10 μA High-Speed mode 50 75 mA High-Resolution mode 50 75 mA Low-Power mode 23 35 mA Low-Speed mode 5 9 mA High-Speed mode 18 24 mA High-Resolution mode 12 17 mA ADS1274 ADS1274 AVDD current ADS1274 DVDD current ADS1274 IOVDD current ADS1274 Power dissipation Low-Power mode 10 15 mA Low-Speed mode 2.5 4.5 mA High-Speed mode 0.15 0.5 mA High-Resolution mode 0.075 0.3 mA Low-Power mode 0.075 0.3 mA Low-Speed mode 0.02 0.15 mA High-Speed mode 285 420 mW High-Resolution mode 275 410 mW Low-Power mode 135 210 mW Low-Speed mode 30 55 mW High-Speed mode 97 145 mA High-Resolution mode 97 145 mA Low-Power mode 44 64 mA Low-Speed mode 9 14 mA High-Speed mode 23 30 mA High-Resolution mode 16 20 mA Low-Power mode 12 17 mA Low-Speed mode 2.5 4.5 mA High-Speed mode 0.25 1 mA High-Resolution mode 0.125 0.5 mA Low-Power mode 0.125 0.5 mA Low-Speed mode 0.035 0.2 mA High-Speed mode 530 785 mW High-Resolution mode 515 765 mW Low-Power mode 245 355 mW Low-Speed mode 50 80 mW ADS1278 ADS1278 AVDD current ADS1278 DVDD current ADS1278 IOVDD current ADS1278 Power dissipation 5 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 ADS1274/ADS1278 PIN ASSIGNMENTS AVDD AINN5(1) AINP5(1) AINN6(1) AINP6(1) 51 50 49 AGND 54 53 VCOM 55 52 VREFN VREFP AGND 58 56 AGND 59 57 AINP4 AVDD AINN4 60 AINP3 63 62 61 AINN3 64 PAP PACKAGE HTQFP-64 (TOP VIEW) AINP2 1 48 AINN7(1) AINN2 2 47 AINP7(1) AINP1 3 46 AINN8(1) AINN1 4 45 AINP8(1) AVDD 5 44 AVDD AGND 6 43 AGND DGND 7 42 PWDN1 TEST0 8 41 PWDN2 40 PWDN3 39 PWDN4 ADS1274/ADS1278 TEST1 9 CLKDIV 10 SYNC 11 38 PWDN5(1) DIN 12 37 PWDN6(1) DOUT8(1) 13 36 PWDN7(1) DOUT7(1) 14 35 PWDN8(1) DOUT6(1) 15 34 MODE0 DOUT5(1) 16 33 MODE1 NOTE: (1) Boldface pin names indicate additional pins for the ADS1278; see pin descriptions. 31 32 FORMAT1 FORMAT0 30 27 CLK FORMAT2 26 DVDD 28 25 DGND 29 24 DGND SCLK 23 IOVDD DRDY/FSYNC 22 21 DGND IOVDD 20 DOUT1 18 19 DOUT3 DOUT2 17 DOUT4 (PowerPAD Outline) ADS1274/ADS1278 PIN DESCRIPTIONS PIN NAME NO. FUNCTION AGND 6, 43, 54, 58, 59 Analog ground AINP1 3 Analog input AINP2 1 Analog input AINP3 63 Analog input AINP4 61 Analog input AINP5 51 Analog input AINP6 49 Analog input AINP7 47 Analog input AINP8 45 Analog input DESCRIPTION Analog ground; connect to DGND using a single plane. ADS1278: AINP[8:1] Positive analog input, channels 8 through 1. ADS1274: AINP[8:5] Connected to internal ESD rails. The inputs may float. AINP[4:1] Positive analog input, channels 4 through 1. 6 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 ADS1274/ADS1278 PIN DESCRIPTIONS (continued) PIN NAME NO. FUNCTION AINN1 4 Analog input AINN2 2 Analog input AINN3 64 Analog input AINN4 62 Analog input AINN5 52 Analog input AINN6 50 Analog input AINN7 48 Analog input AINN8 46 Analog input AVDD 5, 44, 53, 60 Analog power supply DESCRIPTION ADS1278: AINN[8:1] Negative analog input, channels 8 through 1. ADS1274: AINN[8:5] Connected to internal ESD rails. The inputs may float. AINN[4:1] Negative analog input, channels 4 through 1. Analog power supply (4.75V to 5.25V). VCOM 55 Analog output VREFN 57 Analog input Negative reference input. VREFP 56 Analog input Positive reference input. CLK 27 Digital input Master clock input. CLKDIV 10 Digital input DGND 7, 21, 24, 25 Digital ground DIN 12 Digital input Daisy-chain data input. DOUT1 20 Digital output DOUT1 is TDM data output (TDM mode). DOUT2 19 Digital output DOUT3 18 Digital output DOUT4 17 Digital output DOUT5 16 Digital output DOUT6 15 Digital output DOUT7 14 Digital output DOUT8 13 Digital output DRDY/ FSYNC 29 Digital input/output DVDD 26 Digital power supply FORMAT0 32 Digital input FORMAT1 31 Digital input FORMAT2 30 Digital input IOVDD 22, 23 Digital power supply MODE0 34 Digital input MODE1 33 Digital input PWDN1 42 Digital input PWDN2 41 Digital input PWDN3 40 Digital input PWDN4 39 Digital input PWDN5 38 Digital input PWDN6 37 Digital input PWDN7 36 Digital input PWDN8 35 Digital input AVDD/2 Unbuffered voltage output. CLK input divider control: 1 = 32.768MHz (High-Speed mode only) / 27MHz 0 = 13.5MHz (low-power) / 5.4MHz (low-speed) Digital ground power supply. ADS1278: DOUT[8:1] Data output for channels 8 through 1. ADS1274: DOUT[8:5] Internally connected to active circuitry; outputs are driven. DOUT[4:1] Data output for channels 4 through 1. Frame-Sync protocol: frame clock input; SPI protocol: data ready output. Digital core power supply (+1.65V to +1.95V). FORMAT[2:0] Selects Frame-Sync/SPI protocol, TDM/discrete data outputs, fixed/dynamic position TDM data, and modulator mode/normal operating mode. I/O power supply (+1.65V to +3.6V). MODE[1:0] Selects High-Speed, High-Resolution, Low-Power, or Low-Speed mode operation. ADS1278: PWDN[8:1] Power-down control for channels 8 through 1. ADS1274: PWDN[8:5] must = 0V. PWDN[4:1] Power-down control for channels 4 through 1. SCLK 28 Digital input/output SYNC 11 Digital input Serial clock input, Modulator clock output. Synchronize input (all channels). TEST0 8 Digital input TEST[1:0] Test mode select: TEST1 9 Digital input 00 = Normal operation 11 = Boundary scan test mode 01 = Do not use 10 = Do not use 7 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TIMING CHARACTERISTICS: SPI FORMAT tCLK tCPW CLK · · · tCPW tCD tCONV DRDY tSD tDS tSPW tSCLK SCLK tSPW tMSBPD DOUT Bit 23 (MSB) tDOPD tDOHD Bit 22 tDIST Bit 21 tDIHD DIN TIMING REQUIREMENTS: SPI FORMAT For TA = –40°C to +105°C, IOVDD = 1.65V to 3.6V, and DVDD = 1.65V to 1.95V. SYMBOL PARAMETER MIN (1) tCLK CLK period (1/fCLK) tCPW CLK positive or negative pulse width tCONV Conversion period (1/fDATA) (2) tCD (3) Falling edge of CLK to falling edge of DRDY tDS (3) Falling edge of DRDY to rising edge of first SCLK to retrieve data tMSBPD DRDY falling edge to DOUT MSB valid (propagation delay) tSD (3) SCLK period tSPW tDOHD (3) (5) tDOPD 37 (3) MAX 10,000 15 UNIT ns ns 256 2560 22 tCLK ns 1 tCLK 16 Falling edge of SCLK to rising edge of DRDY tSCLK (4) TYP 18 ns ns 1 tCLK SCLK positive or negative pulse width 0.4 tCLK SCLK falling edge to new DOUT invalid (hold time) 10 ns SCLK falling edge to new DOUT valid (propagation delay) 32 ns tDIST New DIN valid to falling edge of SCLK (setup time) 6 ns tDIHD (5) Old DIN valid to falling edge of SCLK (hold time) 6 ns (1) (2) (3) (4) (5) fCLK = 27MHz maximum. Depends on MODE[1:0] and CLKDIV selection. See Table 6 (fCLK/fDATA). Load on DRDY and DOUT = 20pF. For best performance, limit fSCLK/fCLK to ratios of 1, 1/2, 1/4, 1/8, etc. tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is >4ns. 8 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TIMING CHARACTERISTICS: FRAME-SYNC FORMAT tCPW tCLK CLK tCPW tCS tFRAME tFPW tFPW FSYNC tFS tSCLK tSPW tSF SCLK tSPW tMSBPD DOUT tDOHD Bit 23 (MSB) Bit 22 tDIST tDOPD Bit 21 tDIHD DIN TIMING REQUIREMENTS: FRAME-SYNC FORMAT For TA = –40°C to +105°C, IOVDD = 1.65V to 3.6V, and DVDD = 1.65V to 1.95V. SYMBOL PARAMETER tCLK CLK period (1/fCLK) tCPW CLK positive or negative pulse width tCS Falling edge of CLK to falling edge of SCLK tFRAME Frame period (1/fDATA) (1) tFPW FSYNC positive or negative pulse width 1 tSCLK tFS Rising edge of FSYNC to rising edge of SCLK 5 ns tSF Rising edge of SCLK to rising edge of FSYNC 5 ns tSCLK SCLK period (2) 1 tCLK SCLK positive or negative pulse width 0.4 tCLK SCLK falling edge to old DOUT invalid (hold time) 10 tSPW tDOHD (3) (4) MIN All modes High-Speed mode only 37 TYP MAX UNIT 10,000 ns 30.5 ns 12 ns –0.25 0.25 256 2560 tCLK tCLK ns tDOPD (4) SCLK falling edge to new DOUT valid (propagation delay) 31 ns tMSBPD FSYNC rising edge to DOUT MSB valid (propagation delay) 31 ns tDIST New DIN valid to falling edge of SCLK (setup time) 6 ns tDIHD (3) Old DIN valid to falling edge of SCLK (hold time) 6 ns (1) (2) (3) (4) Depends on MODE[1:0] and CLKDIV selection. See Table 6 (fCLK/fDATA). SCLK must be continuously running and limited to ratios of 1, 1/2, 1/4, and 1/8 of fCLK. tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is >4ns. Load on DOUT = 20pF. 9 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. OUTPUT SPECTRUM 0 OUTPUT SPECTRUM 0 High-Speed Mode fIN = 1kHz, -0.5dBFS 32,768 Points -20 -40 -40 Amplitude (dB) Amplitude (dB) High-Speed Mode fIN = 1kHz, -20dBFS 32,768 Points -20 -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 10 100 1k Frequency (Hz) 10k 100k 10 100 1k Frequency (Hz) Figure 1. NOISE HISTOGRAM 25k Number of Occurrences High-Speed Mode Shorted Input 262,144 Points -20 -40 Amplitude (dB) 100k Figure 2. OUTPUT SPECTRUM 0 10k -60 -80 -100 -120 -140 High-Speed Mode Shorted Input 262,144 Points 20k 15k 10k 5k -160 35 28 21 OUTPUT SPECTRUM 0 High-Resolution Mode fIN = 1kHz, -0.5dBFS 32,768 Points -20 High-Resolution Mode fIN = 1kHz, -20dBFS 32,768 Points -40 Amplitude (dB) -40 Amplitude (dB) 14 Figure 4. OUTPUT SPECTRUM -20 7 Output (mV) Figure 3. 0 0 100k -7 10k -14 100 1k Frequency (Hz) -21 10 -35 1 -28 0 -180 -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 10 100 1k Frequency (Hz) 10k 100k 10 Figure 5. 100 1k Frequency (Hz) 10k 100k Figure 6. 10 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. OUTPUT SPECTRUM 0 NOISE HISTOGRAM 25k Number of Occurrences High-Resolution Mode Shorted Input 262,144 Points -20 Amplitude (dB) -40 -60 -80 -100 -120 -140 High-Resolution Mode Shorted Input 262,144 Points 20k 15k 10k 5k OUTPUT SPECTRUM 24.5 17.5 21.0 14.0 10.5 Low-Power Mode fIN = 1kHz, -20dBFS 32,768 Points -20 -40 Amplitude (dB) Amplitude (dB) 3.5 OUTPUT SPECTRUM 0 -40 -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 10 100 1k Frequency (Hz) 10k 100k 10 100 1k Frequency (Hz) Figure 9. 100k NOISE HISTOGRAM 25k Low-Power Mode Shorted Input 262,144 Points Number of Occurrences -20 10k Figure 10. OUTPUT SPECTRUM 0 -40 Amplitude (dB) 7.0 Figure 8. Low-Power Mode fIN = 1kHz, -0.5dBFS 32,768 Points -20 0 Output (mV) Figure 7. 0 -3.5 100k -7.0 10k -10.5 100 1k Frequency (Hz) -14.0 10 -17.5 1 -21.0 0 -180 -24.5 -160 -60 -80 -100 -120 -140 20k Low-Power Mode Shorted Input 262,144 Points 15k 10k 5k 37 32 21 26 16 5 11 0 -5 100k -11 10k -21 100 1k Frequency (Hz) -26 10 -32 1 -37 0 -180 -16 -160 Output (mV) Figure 11. Figure 12. 11 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. OUTPUT SPECTRUM 0 OUTPUT SPECTRUM 0 Low-Speed Mode fIN = 100Hz, -0.5dBFS 32,768 Points -20 -40 Amplitude (dB) -40 Amplitude (dB) Low-Speed Mode fIN = 100Hz, -20dBFS 32,768 Points -20 -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 1 10 100 Frequency (Hz) 1k 10k 1 10 100 Frequency (Hz) Figure 13. NOISE HISTOGRAM 25k Number of Occurrences Low-Speed Mode Shorted Input 262,144 Points -20 -40 Amplitude (dB) 10k Figure 14. OUTPUT SPECTRUM 0 1k -60 -80 -100 -120 -140 20k Low-Speed Mode Shorted Input 262,144 Points 15k 10k 5k -160 THD, THD+N (dB) -20 35 28 21 14 7 0 -7 10k -14 1k -28 10 100 Frequency (Hz) Output (mV) Figure 15. Figure 16. TOTAL HARMONIC DISTORTION vs FREQUENCY TOTAL HARMONIC DISTORTION vs INPUT AMPLITUDE 0 High-Speed Mode VIN = -0.5dBFS -20 THD, THD+N (dB) 0 1 -35 0.1 -21 0 -180 -40 -60 -80 THD+N -100 High-Speed Mode fIN = 1kHz -40 -60 -80 THD+N -100 THD -120 -120 THD -140 10 100 1k Frequency (Hz) 10k 100k -140 -120 -100 Figure 17. -80 -60 -40 Input Amplitude (dBFS) -20 0 Figure 18. 12 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. TOTAL HARMONIC DISTORTION vs FREQUENCY THD, THD+N (dB) -20 0 High-Resolution Mode VIN = -0.5dBFS -20 THD, THD+N (dB) 0 TOTAL HARMONIC DISTORTION vs INPUT AMPLITUDE -40 -60 -80 THD+N -100 THD -120 -140 10 THD, THD+N (dB) -20 1k Frequency (Hz) 10k -100 THD+N -120 THD -100 -80 -60 -40 Input Amplitude (dBFS) TOTAL HARMONIC DISTORTION vs INPUT AMPLITUDE 0 Low-Power Mode VIN = -0.5dBFS -20 -80 THD+N -40 -60 -80 THD+N THD THD -120 -120 -140 100 0 Low-Power Mode fIN = 1kHz -100 10 -20 TOTAL HARMONIC DISTORTION vs FREQUENCY -100 1k Frequency (Hz) 10k -140 -120 100k -100 -80 -60 -40 Input Amplitude (dBFS) -20 Figure 21. Figure 22. TOTAL HARMONIC DISTORTION vs FREQUENCY TOTAL HARMONIC DISTORTION vs INPUT AMPLITUDE 0 Low-Speed Mode VIN = -0.5dBFS 0 Low-Speed Mode -20 THD, THD+N (dB) THD, THD+N (dB) -80 Figure 20. -60 -20 -60 Figure 19. -40 0 -40 -140 -120 100k THD, THD+N (dB) 0 100 High-Resolution Mode fIN = 1kHz -40 -60 -80 THD+N -100 -40 -60 -80 THD+N -100 THD THD -120 -120 -140 10 100 1k 10k -140 -120 -100 Frequency (Hz) Figure 23. -80 -60 -40 Input Amplitude (dBFS) -20 0 Figure 24. 13 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. OFFSET DRIFT HISTOGRAM Multi-lot data based on 20°C intervals over the range -40°C to +105°C. 25 units based on 20°C intervals over the range -40°C to +105°C. 800 700 Number of Occurrences 350 Number of Occurrences GAIN DRIFT HISTOGRAM 900 300 250 200 150 100 600 500 400 300 200 100 0 0 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 50 Outliers: T < -20°C -15 -14 -13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 400 Offset Drift (mV/°C) Gain Drift (ppm/°C) Figure 25. Figure 26. OFFSET WARMUP DRIFT RESPONSE BAND GAIN WARMUP DRIFT RESPONSE BAND 40 40 ADS1278 High-Speed and High-Resolution Modes ADS1274/78 High-Speed and High-Resolution Modes Normalized Gain Error (ppm) Normalized Offset (mV) 30 ADS1278 Low-Power Mode 20 10 0 -10 -20 ADS1278 Low-Speed Mode -30 30 ADS1278 Low-Power Mode 20 10 0 -10 -20 ADS1278 Low-Speed Mode -30 ADS1274 High-Speed and High-Resolution Modes -40 -40 0 50 100 150 200 250 Time (s) 300 350 400 0 50 100 Figure 27. 350 400 Number of Occurrences 80 30 25 20 15 10 High-Speed Mode 25 Units 70 60 50 40 30 20 5 10 0 0 -4000 -3600 -3200 -2800 -2400 -2000 -1600 -1200 -800 -400 0 400 800 1200 1600 2000 2400 2800 3200 3600 4000 High-Speed Mode 25 Units Offset (mV) 300 GAIN ERROR HISTOGRAM 90 -1000 -900 -800 -700 -600 -500 -400 -300 -200 -100 0 100 200 300 400 500 600 700 800 900 1000 Number of Occurrences 35 200 250 Time (s) Figure 28. OFFSET ERROR HISTOGRAM 40 150 Gain Error (ppm) Figure 29. Figure 30. 14 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. CHANNEL GAIN MATCH HISTOGRAM High-Speed Mode 10 Units 60 80 Number of Occurrences 70 60 50 40 30 20 50 40 30 20 10 10 0 -1500 -1400 -1300 -1200 -1100 -1000 -900 -800 -700 -600 -500 -400 -300 -200 -100 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 0 High-Speed Mode 10 Units Channel Gain Match (ppm) Channel Offset Match (mV) Figure 31. Figure 32. OFFSET AND GAIN vs TEMPERATURE 20 50 250 18 0 200 -50 150 Gain 100 -150 50 -200 0 -250 -50 0 -20 20 40 60 Temperature (°C) 100 10 8 6 4 0 -100 120 125 VCOM Voltage Output (V) ADS1274/ADS1278 SAMPLING MATCH ERROR HISTOGRAM ADS1274 REFERENCE INPUT DIFFERENTIAL IMPEDANCE vs TEMPERATURE 30 units over 3 production lots, inter-channel combinations. 30 ADS1278 25 ADS1274 20 15 10 ADS1278 700 650 550 600 500 400 450 350 250 300 200 100 150 5 50 12 Figure 34. 35 0 14 Figure 33. 40 Number of Occurrences 80 16 2 Reference Input Impedance (kW) -300 -40 AVDD = 5V 25 Units, No Load 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.51 2.52 2.53 2.54 2.55 2.56 2.57 2.58 2.59 2.60 -100 Number of Occurrences Offset Normalized Gain Error (ppm) Normalized Offset (mV) VCOM VOLTAGE OUTPUT HISTOGRAM 300 100 1.36 13.6 1.34 13.4 1.32 13.2 1.30 13.0 1.28 1.26 12.8 High-Speed and High-Resolution Modes Low-Speed Mode 12.4 1.24 1.22 -40 12.6 -20 0 Sampling Match Error (ps) Figure 35. 20 40 60 Temperature (°C) 80 100 Reference Input Impedance (kW) Number of Occurrences 90 CHANNEL OFFSET MATCH HISTOGRAM 70 - 1500 - 1400 - 1300 - 1200 - 1100 - 1000 - 900 - 800 - 700 - 600 - 500 - 400 - 300 - 200 - 100 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 100 12.2 120 125 Figure 36. 15 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. 6.8 0.67 6.7 6.6 0.66 6.5 0.65 High-Speed and High-Resolution Modes 0.64 6.4 Low-Speed Mode 6.3 0.63 0.62 -40 0 20 40 60 Temperature (°C) 80 100 28.8 14.3 28.6 14.2 28.4 14.1 28.2 14.0 28.0 13.9 27.8 High-Speed and High-Resolution Modes 13.8 27.6 27.4 13.7 27.2 13.6 Low-Power Mode 13.5 6.2 120 125 13.4 -40 0 -20 20 40 60 Temperature (°C) 80 100 Figure 37. Figure 38. ANALOG INPUT DIFFERENTIAL IMPEDANCE vs TEMPERATURE INTEGRAL NONLINEARITY vs TEMPERATURE 27.0 26.8 120 125 10 Low-Speed Mode 150 8 145 INL (ppm of FSR) 140 135 130 125 6 4 2 120 115 -40 -20 0 20 40 60 Temperature (°C) 80 100 0 -40 120 125 100 120 125 LINEARITY AND TOTAL HARMONIC DISTORTION vs REFERENCE VOLTAGE 14 -100 THD: fIN = 1kHz, VIN = -0.5dBFS 12 T = +105°C Linearity (ppm) Linearity Error (ppm) 80 LINEARITY ERROR vs INPUT LEVEL 6 T = +25°C 0 -2 -4 -6 20 40 60 Temperature (°C) Figure 40. 8 2 0 Figure 39. 10 4 -20 -104 10 -108 THD 8 -112 6 -116 4 T = -40°C T = +125°C -8 -10 -2.5 -2.0 -1.5 -1.0 -0.5 1.0 -120 Linearity 2 -124 See Electrical Characteristics for VREF Operating Range. 0 0 0.5 VIN (V) 1.5 2.0 2.5 THD (dB) Analog Input Impedance (kW) 155 -20 14.4 Analog Input Impedance (kW) 0.68 Analog Input Impedance (kW) ANALOG INPUT DIFFERENTIAL IMPEDANCE vs TEMPERATURE Reference Input Impedance (kW) Reference Input Impedance (kW) ADS1278 REFERENCE INPUT DIFFERENTIAL IMPEDANCE vs TEMPERATURE -128 0 0.5 Figure 41. 1.0 1.5 2.0 VREF (V) 2.5 3.0 3.5 Figure 42. 16 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. NOISE vs TEMPERATURE 14 14 12 12 12 10 8 8 6 6 Linearity 8 Low-Speed Mode 6 4 4 4 2 2 2 0 0 0 -0.5 0 High-Resolution Mode 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Input Common-Mode Voltage (V) -40 0 -20 20 40 60 Temperature (°C) 80 100 120 125 Figure 43. Figure 44. NOISE vs REFERENCE VOLTAGE TOTAL HARMONIC DISTORTION AND NOISE vs CLK 12 0 14 High-Speed Low-Power 10 THD: fIN = fCLK/5120, VIN = -0.5dBFS Noise: Shorted Input All Channels Plotted -20 12 10 -40 THD (dB) 8 Noise (mV) High-Speed Mode Low-Speed 6 8 -60 Noise 6 -80 THD 4 High-Resolution 2 -100 4 -120 2 Noise RMS (mV) Noise RMS Noise (mV) 10 10 Low-Power Mode INL (ppm of FSR) RMS Noise (mV) NOISE AND LINEARITY vs INPUT COMMON-MODE VOLTAGE See Electrical Characteristics for VREF Operating Range. 0 -140 0 0.5 1.0 1.5 2.0 VREF (V) 2.5 3.0 3.5 10k 1M CLK (Hz) 10M Figure 45. Figure 46. COMMON-MODE REJECTION vs INPUT FREQUENCY POWER-SUPPLY REJECTION vs POWER-SUPPLY FREQUENCY 0 100M 0 Power-Supply Rejection (dB) 0 Common-Mode Rejection (dB) 100k -20 -40 -60 -80 -100 -20 -40 -60 AVDD -80 DVDD -100 IOVDD -120 -120 10 100 1k 10k Input Frequency (Hz) 100k 1M 10 100 1k 10k 100k Power-Supply Modulation Frequency (Hz) Figure 47. 1M Figure 48. 17 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. ADS1274 AVDD CURRENT vs TEMPERATURE ADS1274 DVDD CURRENT vs TEMPERATURE 70 High-Speed and High-Resolution Modes High-Speed Mode 20 DVDD Current (mA) AVDD Current (mA) 60 25 50 40 30 Low-Power Mode 20 15 High-Resolution Mode 10 Low-Power Mode 5 10 Low-Speed Mode Low-Speed Mode 0 -40 -20 0 20 40 60 Temperature (°C) 80 100 0 -40 120 125 0 -20 ADS1274 IOVDD CURRENT vs TEMPERATURE ADS1274 POWER DISSIPATION vs TEMPERATURE Power Dissipation (mW) IOVDD Current (mA) 0.15 High-Speed Mode High-Resolution Mode Low-Power Mode -20 Low-Speed Mode 0 20 40 60 Temperature (°C) 80 100 Low-Power Mode 150 100 Low-Speed Mode -20 0 20 40 60 Temperature (°C) 80 Figure 52. ADS1278 AVDD CURRENT vs TEMPERATURE ADS1278 DVDD CURRENT vs TEMPERATURE 100 120 125 100 120 125 30 25 High-Speed and High-Resolution Modes 60 Low-Power Mode 40 0 -40 High-Resolution Mode 200 Figure 51. 80 20 250 0 -40 120 125 DVDD Current (mA) AVDD Current (mA) 100 High-Speed Mode 300 50 140 120 120 125 400 350 0 -40 100 Figure 50. 0.20 0.05 80 Figure 49. 0.25 0.10 20 40 60 Temperature (°C) 20 High-Resolution Mode 15 5 0 20 40 60 Temperature (°C) 80 100 120 125 Low-Power Mode 10 Low-Speed Mode -20 High-Speed Mode 0 -40 Low-Speed Mode -20 Figure 53. 0 20 40 60 Temperature (°C) 80 Figure 54. 18 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, High-Speed mode, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V, and VREFN = 0V, unless otherwise noted. ADS1278 IOVDD CURRENT vs TEMPERATURE ADS1278 POWER DISSIPATION vs TEMPERATURE 0.5 800 IOVDD Current (mA) 0.3 High-Speed Mode 0.2 Low-Power Mode 0.1 High-Resolution Mode 0 -40 -20 0 Low-Speed Mode 20 40 60 Temperature (°C) 80 100 Power Dissipation (mW) 700 0.4 600 500 400 300 High-Resolution Mode Low-Power Mode 200 100 120 125 High-Speed Mode 0 -40 Low-Speed Mode -20 Figure 55. 0 20 40 60 Temperature (°C) 80 100 120 125 Figure 56. 19 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 OVERVIEW High-Speed, High-Resolution, Low-Power, and Low-Speed. Table 1 summarizes the performance of each mode. The ADS1274 (quad) and ADS1278 (octal) are 24-bit, delta-sigma ADCs based on the single-channel ADS1271. They offer the combination of outstanding dc accuracy and superior ac performance. Figure 57 shows the block diagram. Note that both devices are functionally the same, except that the ADS1274 has four ADCs and the ADS1278 has eight ADCs. The packages are identical, and the ADS1274 pinout is compatible with the ADS1278, permitting true drop-in expandability. The converters are comprised of four (ADS1274) or eight (ADS1278) advanced, 6th-order, chopper-stabilized, delta-sigma modulators followed by low-ripple, linear phase FIR filters. The modulators measure the differential input signal, VIN = (AINP – AINN), against the differential reference, VREF = (VREFP – VREFN). The digital filters receive the modulator signal and provide a low-noise digital output. To allow tradeoffs among speed, resolution, and power, four operating modes are supported: VREFP AVDD VREFN The ADS1274/78 is configured by simply setting the appropriate I/O pins—there are no registers to program. Data are retrieved over a serial interface that supports both SPI and Frame-Sync formats. The ADS1274/78 has a daisy-chainable output and the ability to synchronize externally, so it can be used conveniently in systems requiring more than eight channels. DVDD IOVDD Mod 1 Mod 2 S R In High-Speed mode, the maximum data rate is 128kSPS (when operating at 128kSPS, Frame-Sync format must be used). In High-Resolution mode, the SNR = 111dB (VREF = 3.0V); in Low-Power mode, the power dissipation is 31mW/channel; and in Low-Speed mode, the power dissipation is only 7mW/channel at 10.5kSPS. The digital filters can be bypassed, enabling direct access to the modulator output. Modulator Output VCOM VREF R AINP1 AINN1 AINP2 AINN2 S S VIN1 Mod 8 DS Modulator1 VIN2 Digital Filter1 DS Modulator2 DRDY/FSYNC SPI and Frame-Sync Interface SCLK DOUT[4:1]/[8:1](1) DIN Digital Filter2 TEST[1:0] FORMAT[2:0] CLK Control Logic AINP4/8(1) AINN4/8(1) S VIN4/8 DS Modulator4/8(1) SYNC PWDN[4:1]/[8:1](1) Digital Filter4/8(1) CLKDIV MODE[1:0] AGND DGND NOTE: (1) The ADS1274 has four channels; the ADS1278 has eight channels. Figure 57. ADS1274/ADS1278 Block Diagram Table 1. Operating Mode Performance Summary MODE MAX DATA RATE (SPS) PASSBAND (kHz) SNR (dB) NOISE(μVRMS) POWER/CHANNEL (mW) High-Speed 128,000 57,984 106 8.5 70 High-Resolution 52,734 23,889 110 5.5 64 Low-Power 52,734 23,889 106 8.5 31 Low-Speed 10,547 4,798 107 8.0 7 20 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 FUNCTIONAL DESCRIPTION The ADS1274/78 is a delta-sigma ADC consisting of four/eight independent converters that digitize four/eight input signals in parallel. The converter is composed of two main functional blocks to perform the ADC conversions: the modulator and the digital filter. The modulator samples the input signal together with sampling the reference voltage to produce a 1's density output stream. The density of the output stream is proportional to the analog input level relative to the reference voltage. The pulse stream is filtered by the internal digital filter where the output conversion result is produced. In operation, the input signal is sampled by the modulator at a high rate (typically 64x higher than the final output data rate). The quantization noise of the modulator is moved to a higher frequency range where the internal digital filter removes it. Oversampling results in very low levels of noise within the signal passband. Since the input signal is sampled at a very high rate, input signal aliasing does not occur until the input signal frequency is at the modulator sampling rate. This architecture greatly relaxes the requirement of external antialiasing filters because of the high modulator sampling rate. SAMPLING APERTURE MATCHING The ADS1274/78 converters operate from the same CLK input. The CLK input controls the timing of the modulator sampling instant. The converter is designed such that the sampling skew, or modulator sampling aperture match between channels, is controlled. Furthermore, the digital filters are synchronized to start the convolution phase at the same modulator clock cycle. This design results in excellent phase match among the ADS1274/78 channels. Figure 35 shows the inter-device channel sample matching for the ADS1274 and ADS1278. The phase match of one 4-channel ADS1274 to that of another ADS1274 (eight or more channels total) may not have the same degree of sampling match. As a result of manufacturing variations, differences in internal propagation delay of the internal CLK signal coupled with differences of the arrival of the external CLK signal to each device may cause larger sampling match errors. Equal length CLK traces or external clock distribution devices can be used to reduce the sampling match error between devices. FREQUENCY RESPONSE The digital filter sets the overall frequency response. The filter uses a multi-stage FIR topology to provide linear phase with minimal passband ripple and high stop band attenuation. The filter coefficients are identical to the coefficients used in the ADS1271. The oversampling ratio of the digital filter (that is, the ratio of the modulator sampling to the output data rate, or fMOD/fDATA) is a function of the selected mode, as shown in Table 2. Table 2. Oversampling Ratio versus Mode MODE SELECTION OVERSAMPLING RATIO (fMOD/fDATA) High-Speed 64 High-Resolution 128 Low-Power 64 Low-Speed 64 21 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 High-Speed, Low-Power, and Low-Speed Modes -2 Amplitude (dB) The digital filter configuration is the same in High-Speed, Low-Power, and Low-Speed modes with the oversampling ratio set to 64. Figure 58 shows the frequency response in High-Speed, Low-Power, and Low-Speed modes normalized to fDATA. Figure 59 shows the passband ripple. The transition from passband to stop band is shown in Figure 60. The overall frequency response repeats at 64x multiples of the modulator frequency fMOD, as shown in Figure 61. 0 -1 -3 -4 -5 -6 -7 -8 -9 -10 0.45 0 0.47 0.49 0.51 0.53 0.55 Normalized Input Frequency (fIN/fDATA) Amplitude (dB) -20 Figure 60. Transition Band Response for High-Speed, Low-Power, and Low-Speed Modes -40 -60 -80 20 -100 0 -120 -20 0 0.2 0.4 0.6 0.8 1.0 Normalized Input Frequency (fIN/fDATA) Gain (dB) -40 -140 -60 -80 -100 Figure 58. Frequency Response for High-Speed, Low-Power, and Low-Speed Modes -120 -140 -160 0.02 0 16 32 48 64 Input Frequency (fIN/fDATA) Amplitude (dB) 0 Figure 61. Frequency Response Out to fMOD for High-Speed, Low-Power, and Low-Speed Modes -0.02 -0.04 -0.06 -0.08 -0.10 0 0.1 0.2 0.3 0.4 0.5 0.6 Normalized Input Frequency (fIN/fDATA) Figure 59. Passband Response for High-Speed, Low-Power, and Low-Speed Modes These image frequencies, if present in the signal and not externally filtered, will fold back (or alias) into the passband, causing errors. The stop band of the ADS1274/78 provides 100dB attenuation of frequencies that begin just beyond the passband and continue out to fMOD. Placing an antialiasing, low-pass filter in front of the ADS1274/78 inputs is recommended to limit possible high-amplitude, out-of-band signals and noise. Often, a simple RC filter is sufficient. Table 3 lists the image rejection versus external filter order. Table 3. Antialiasing Filter Order Image Rejection IMAGE REJECTION (dB) (f–3dB at fDATA) ANTIALIASING FILTER ORDER HS, LP, LS HR 1 39 45 2 75 87 3 111 129 22 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 High-Resolution Mode 0 -2 Amplitude (dB) The oversampling ratio is 128 in High-Resolution mode. Figure 62 shows the frequency response in High-Resolution mode normalized to fDATA. Figure 63 shows the passband ripple, and the transition from passband to stop band is shown in Figure 64. The overall frequency response repeats at multiples of the modulator frequency fMOD (128 × fDATA), as shown in Figure 65. The stop band of the ADS1274/78 provides 100dB attenuation of frequencies that begin just beyond the passband and continue out to fMOD. Placing an antialiasing, low-pass filter in front of the ADS1274/78 inputs is recommended to limit possible high-amplitude out-of-band signals and noise. Often, a simple RC filter is sufficient. Table 3 lists the image rejection versus external filter order. -1 -3 -4 -5 -6 -7 -8 -9 -10 0.45 0.47 0.49 0.51 0.53 0.55 Normalized Input Frequency (fIN/fDATA) Figure 64. Transition Band Response for High-Resolution mode 0 20 0 -40 -20 -60 -40 -80 Gain (dB) Amplitude (dB) -20 -100 -120 -60 -80 -100 -120 -140 0 0.50 0.25 0.75 1 Normalized Input Frequency (fIN/fDATA) -140 -160 0 Figure 62. Frequency Response for High-Resolution Mode 32 64 96 128 Normalized Input Frequency (fIN/fDATA) Figure 65. Frequency Response Out to fMOD for High-Resolution Mode 0.02 Amplitude (dB) 0 -0.02 -0.04 -0.06 -0.08 -0.10 0 0.1 0.2 0.3 0.4 0.5 0.6 Normalized Input Frequency (fIN/fDATA) Figure 63. Passband Response for High-Resolution Mode 23 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 Table 4. Ideal Output Code versus Input Signal PHASE RESPONSE The ADS1274/78 incorporates a multiple stage, linear phase digital filter. Linear phase filters exhibit constant delay time versus input frequency (constant group delay). This characteristic means the time delay from any instant of the input signal to the same instant of the output data is constant and is independent of input signal frequency. This behavior results in essentially zero phase errors when analyzing multi-tone signals. Final Value Settling (%) 100 7FFFFFh 000001h 0 000000h * VREF 2 23 * 1 FFFFFFh Initial Value 0 30 40 50 60 70 23 23 800000h (1) Excludes effects of noise, INL, offset, and gain errors. ANALOG INPUTS (AINP, AINN) The ADS1274/78 measures each differential input signal VIN = (AINP – AINN) against the common differential reference VREF = (VREFP – VREFN). The most positive measurable differential input is +VREF, which produces the most positive digital output code of 7FFFFFh. Likewise, the most negative measurable differential input is –VREF, which produces the most negative digital output code of 800000h. For optimum performance, the inputs of the ADS1274/78 are intended to be driven differentially. For single-ended applications, one of the inputs (AINP or AINN) can be driven while the other input is fixed (typically to AGND or +2.5V). Fixing the input to 2.5V permits bipolar operation, thereby allowing full use of the entire converter range. Fully Settled Data at 76 Conversions (78 Conversions for High-Resolution mode) 20 ≥ +VREF ) VREF 2 23 * 1 ǒ2 2* 1Ǔ As with frequency and phase response, the digital filter also determines settling time. Figure 66 shows the output settling behavior after a step change on the analog inputs normalized to conversion periods. The X-axis is given in units of conversion. Note that after the step change on the input occurs, the output data change very little prior to 30 conversion periods. The output data are fully settled after 76 conversion periods for High-Speed and Low-Power modes, and 78 conversion periods for High-Resolution mode. 10 IDEAL OUTPUT CODE(1) v −VREF SETTLING TIME 0 INPUT SIGNAL VIN (AINP – AINN) 80 Conversions (1/fDATA) Figure 66. Step Response DATA FORMAT The ADS1274/78 outputs 24 bits of data in two’s complement format. A positive full-scale input produces an ideal output code of 7FFFFFh, and the negative full-scale input produces an ideal output code of 800000h. The output clips at these codes for signals exceeding full-scale. Table 4 summarizes the ideal output codes for different input signals. While the ADS1274/78 measures the differential input signal, the absolute input voltage is also important. This value is the voltage on either input (AINP or AINN) with respect to AGND. The range for this voltage is: –0.1V < (AINN or AINP) < AVDD + 0.1V If either input is taken below –0.4V or above (AVDD + 0.4), ESD protection diodes on the inputs may turn on. If these conditions are possible, external Schottky clamp diodes or series resistors may be required to limit the input current to safe values (see the Absolute Maximum Ratings table). The ADS1274/78 is a very high-performance ADC. For optimum performance, it is critical that the appropriate circuitry be used to drive the ADS1274/78 inputs. See the Application Information section for several recommended circuits. 24 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 The ADS1274/78 uses switched-capacitor circuitry to measure the input voltage. Internal capacitors are charged by the inputs and then discharged. Figure 67 shows a conceptual diagram of these circuits. Switch S2 represents the net effect of the modulator circuitry in discharging the sampling capacitor; the actual implementation is different. The timing for switches S1 and S2 is shown in Figure 68. The sampling time (tSAMPLE) is the inverse of modulator sampling frequency (fMOD) and is a function of the mode, the CLKDIV input, and CLK frequency, as shown in Table 5. Zeff = 14kW ´ (6.75MHz/fMOD) AINN Figure 69. Effective Input Impedances VOLTAGE REFERENCE INPUTS (VREFP, VREFN) AVDD AGND S1 AINP AINP 9pF S2 AINN S1 AGND AVDD ESD Protection Figure 67. Equivalent Analog Input Circuitry The voltage reference for the ADS1274/78 ADC is the differential voltage between VREFP and VREFN: VREF = (VREFP – VREFN). The voltage reference is common to all channels. The reference inputs use a structure similar to that of the analog inputs with the equivalent circuitry on the reference inputs shown in Figure 70. As with the analog inputs, the load presented by the switched capacitor can be modeled with an effective impedance, as shown in Figure 71. However, the reference input impedance depends on the number of active (enabled) channels in addition to fMOD. As a result of the change of reference input impedance caused by enabling and disabling channels, the regulation and setting time of the external reference should be noted, so as not to affect the readings. tSAMPLE = 1/fMOD S1 VREFP ON VREFN OFF S2 ON AGND AGND AVDD AVDD OFF Figure 68. S1 and S2 Switch Timing for Figure 67 ESD Protection Table 5. Modulator Frequency (fMOD) Mode Selection MODE SELECTION CLKDIV fMOD High-Speed 1 fCLK/4 High-Resolution 1 fCLK/4 1 fCLK/8 Low-Power Low-Speed 0 fCLK/4 1 fCLK/40 0 fCLK/8 Figure 70. Equivalent Reference Input Circuitry VREFP The average load presented by the switched capacitor input can be modeled with an effective differential impedance, as shown in Figure 69. Note that the effective impedance is a function of fMOD. Zeff = VREFN 5.2kW ´ (6.75MHz/fMOD) N N = number of active channels. Figure 71. Effective Reference Impedance 25 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 ESD diodes protect the reference inputs. To keep these diodes from turning on, make sure the voltages on the reference pins do not go below AGND by more than 0.4V, and likewise do not exceed AVDD by 0.4V. If these conditions are possible, external Schottky clamp diodes or series resistors may be required to limit the input current to safe values (see the Absolute Maximum Ratings table). Note that the valid operating range of the reference inputs is limited to the following parameters: Table 6. Clock Input Options MODE SELECTION MAX fCLK (MHz) CLKDIV fCLK/fDATA DATA RATE (SPS) High-Speed 32.768 1 256 128,000 High-Resolution 27 1 512 52,734 27 1 512 13.5 0 256 27 1 2,560 5.4 0 512 Low-Power Low-Speed 52,734 10,547 –0.1V ≤ VREFN ≤ +0.1V MODE SELECTION (MODE) VREFN + 0.5V ≤ VREFP ≤ AVDD + 0.1V The ADS1274/78 supports four modes of operation: High-Speed, High-Resolution, Low-Power, and Low-Speed. The modes offer optimization of speed, resolution, and power. Mode selection is determined by the status of the digital input MODE[1:0] pins, as shown in Table 7. The ADS1274/78 continually monitors the status of the MODE pin during operation. A high-quality reference voltage with the appropriate drive strength is essential for achieving the best performance from the ADS1274. Noise and drift on the reference degrade overall system performance. See the Application Information section for example reference circuits. CLOCK INPUT (CLK) Table 7. Mode Selection The ADS1274/78 requires a clock input for operation. The individual converters of the ADS1274/78 operate from the same clock input. At the maximum data rate, the clock input can be either 27MHz or 13.5MHz for Low-Power mode, or 27MHz or 5.4MHz for Low-Speed mode, determined by the setting of the CLKDIV input. For High-Speed mode, the maximum CLK input frequency is 32.768MHz. For High-Resolution mode, the maximum CLK input frequency is 27MHz. The selection of the external clock frequency (fCLK) does not affect the resolution of the ADS1274/78. Use of a slower fCLK can reduce the power consumption of an external clock buffer. The output data rate scales with clock frequency, down to a minimum clock frequency of fCLK = 100kHz. Table 6 summarizes the ratio of the clock input frequency (fCLK) to data rate (fDATA), maximum data rate and corresponding maximum clock input for the four operating modes. MODE SELECTION MAX fDATA(1) 00 High-Speed 128,000 01 High-Resolution 52,734 10 Low-Power 52,734 11 Low-Speed 10,547 MODE[1:0] (1) fCLK = 27MHz max (32.768MHz max in High-Speed mode). When using the SPI protocol, DRDY is held high after a mode change occurs until settled (or valid) data are ready; see Figure 72 and Table 8. In Frame-Sync protocol, the DOUT pins are held low after a mode change occurs until settled data are ready; see Figure 72 and Table 8. Data can be read from the device to detect when DOUT changes to logic 1, indicating that the data are valid. As with any high-speed data converter, a high-quality, low-jitter clock is essential for optimum performance. Crystal clock oscillators are the recommended clock source. Make sure to avoid excess ringing on the clock input; keeping the clock trace as short as possible, and using a 50Ω series resistor placed close to the source end, often helps. 26 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 MODE[1:0] Pins ADS1274/78 Mode Previous Mode New Mode tNDR-SPI SPI Protocol DRDY New Mode Valid Data Ready tNDR-FS Frame-Sync DOUT Protocol New Mode Valid Data on DOUT Figure 72. Mode Change Timing Table 8. New Data After Mode Change SYMBOL DESCRIPTION MIN tNDR-SPI Time for new data to be ready (SPI) tNDR-FS Time for new data to be ready (Frame-Sync) SYNCHRONIZATION (SYNC) The ADS1274/78 can be synchronized by pulsing the SYNC pin low and then returning the pin high. When the pin goes low, the conversion process stops, and the internal counters used by the digital filter are reset. When the SYNC pin returns high, the conversion process restarts. Synchronization allows the conversion to be aligned with an external event, such as the changing of an external multiplexer on the analog inputs, or by a reference timing pulse. Because the ADS1274/78 converters operate in parallel from the same master clock and use the same SYNC input control, they are always in synchronization with each other. The aperture match among internal channels is typically less than 500ps. However, the synchronization of multiple devices is somewhat different. At device power-on, variations in internal reset thresholds from device to device may result in uncertainty in conversion timing. The SYNC pin can be used to synchronize multiple devices to within the same CLK cycle. Figure 73 illustrates the timing requirement of SYNC and CLK in SPI format. 127 TYP MAX UNITS 129 Conversions (1/fDATA) 128 Conversions (1/fDATA) See Figure 74 for the Frame-Sync format timing requirement. After synchronization, indication of valid data depends on whether SPI or Frame-Sync format was used. In the SPI format, DRDY goes high as soon as SYNC is taken low; see Figure 73. After SYNC is returned high, DRDY stays high while the digital filter is settling. Once valid data are ready for retrieval, DRDY goes low. In the Frame-Sync format, DOUT goes low as soon as SYNC is taken low; see Figure 74. After SYNC is returned high, DOUT stays low while the digital filter is settling. Once valid data are ready for retrieval, DOUT begins to output valid data. For proper synchronization, FSYNC, SCLK, and CLK must be established before taking SYNC high, and must then remain running. If the clock inputs (CLK, FSYNC or SCLK) are subsequently interrupted or reset, re-assert the SYNC pin. For consistent performance, re-assert SYNC after device power-on when data first appear. 27 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 tCSHD CLK tSCSU tSYN SYNC tNDR DRDY Figure 73. Synchronization Timing (SPI Protocol) Table 9. SPI Protocol SYMBOL DESCRIPTION MIN TYP MAX UNITS tCSHD CLK to SYNC hold time 10 ns tSCSU SYNC to CLK setup time 5 ns tSYN Synchronize pulse width 1 CLK periods tNDR Time for new data to be ready 129 Conversions (1/fDATA) tCSHD CLK tSCSU tSYN SYNC FSYNC tNDR Valid Data DOUT Figure 74. Synchronization Timing (Frame-Sync Protocol) Table 10. Frame-Sync Protocol SYMBOL DESCRIPTION MIN TYP MAX UNITS tCSHD CLK to SYNC hold time 10 tSCSU SYNC to CLK setup time 5 ns tSYN Synchronize pulse width 1 CLK periods tNDR Time for new data to be ready 127 28 ns 128 Conversions (1/fDATA) Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 POWER-DOWN (PWDN) 2. Delay 129/fDATA or 130/fDATA after taking the PWDN pins high, then read data. 3. Detect for non-zero data in the powered-up channel. The channels of the ADS1274/78 can be independently powered down by use of the PWDN inputs. To enter the power-down mode, hold the respective PWDN pin low for at least two CLK cycles. To exit power-down, return the corresponding PWDN pin high. Note that when all channels are powered down, the ADS1274/78 enters a microwatt (μW) power state where all internal biasing is disabled. In this state, the TEST[1:0] input pins must be driven; all other input pins can float. The ADS1274/78 outputs remain driven. After powering up one or more channels, the channels are synchronized to each other. It is not necessary to use the SYNC pin to synchronize them. When a channel is powered down in TDM data format, the data for that channel are either forced to zero (fixed-position TDM data mode) or replaced by shifting the data from the next channel into the vacated data position (dynamic-position TDM data mode). As shown in Figure 75 and Table 11, a maximum of 130 conversion cycles must elapse for SPI interface, and 129 conversion cycles must elapse for Frame-Sync, before reading data after exiting power-down. Data from channels already running are not affected. The user software can perform the required delay time in any of the following ways: 1. Count the number of data conversions after taking the PWDN pin high. ··· CLK ··· tPWDN PWDN DRDY/FSYNC In Discrete data format, the data are always forced to zero. When powering-up a channel in dynamic-position TDM data format mode, the channel data remain packed until the data are ready, at which time the data frame is expanded to include the just-powered channel data. See the Data Format section for details. tNDR (1) DOUT (Discrete Data Output Mode) Post Power-Up Data DOUT1 (TDM Mode, Dynamic Position) Normal Position Data Shifts Position Normal Position DOUT1 (TDM Mode, Fixed Position) Normal Position Data Remains in Position Normal Position NOTE: (1) In SPI protocol, the timing occurs on the falling edge of DRDY/FSYNC. Powering down all channels forces DRDY/FSYNC high. Figure 75. Power-Down Timing Table 11. Power-Down Timing SYMBOL tPWDN DESCRIPTION MIN PWDN pulse width to enter Power-Down mode TYP MAX 2 UNITS CLK periods tNDR Time for new data ready (SPI) 129 130 Conversions (1/fDATA) tNDR Time for new data ready (Frame-Sync) 128 129 Conversions (1/fDATA) 29 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 FORMAT[2:0] Data can be read from the ADS1274/78 with two interface protocols (SPI or Frame-Sync) and several options of data formats (TDM/Discrete and Fixed/Dynamic data positions). The FORMAT[2:0] inputs are used to select among the options. Table 12 lists the available options. See the DOUT Modes section for details of the DOUT Mode and Data Position. Table 12. Data Output Format FORMAT[2:0] INTERFACE PROTOCOL DOUT MODE DATA POSITION 000 SPI TDM Dynamic 001 SPI TDM Fixed 010 SPI Discrete — 011 Frame-Sync TDM Dynamic 100 Frame-Sync TDM Fixed 101 Frame-Sync Discrete — 110 Modulator Mode — — SERIAL INTERFACE PROTOCOLS Data are retrieved from the ADS1274/78 using the serial interface. Two protocols are available: SPI and Frame-Sync. The same pins are used for both interfaces: SCLK, DRDY/FSYNC, DOUT[4:1] (DOUT[8:1] for ADS1278), and DIN. The FORMAT[2:0] pins select the desired interface protocol. Even though the SCLK input has hysteresis, it is recommended to keep SCLK as clean as possible to prevent glitches from accidentally shifting the data. SCLK may be run as fast as the CLK frequency. SCLK may be either in free-running or stop-clock operation between conversions. Note that one fCLK is required after the falling edge of DRDY until the first rising edge of SCLK. For best performance, limit fSCLK/fCLK to ratios of 1, 1/2, 1/4, 1/8, etc. When the device is configured for modulator output, SCLK becomes the modulator clock output (see the Modulator Output section). DRDY/FSYNC (SPI Format) In the SPI format, this pin functions as the DRDY output. It goes low when data are ready for retrieval and then returns high on the falling edge of the first subsequent SCLK. If data are not retrieved (that is, SCLK is held low), DRDY pulses high just before the next conversion data are ready, as shown in Figure 76. The new data are loaded within one CLK cycle before DRDY goes low. All data must be shifted out before this time to avoid being overwritten. 1/fDATA 1/fCLK DRDY SCLK Figure 76. DRDY Timing with No Readback SPI SERIAL INTERFACE DOUT The SPI-compatible format is a read-only interface. Data ready for retrieval are indicated by the falling DRDY output and are shifted out on the falling edge of SCLK, MSB first. The interface can be daisy-chained using the DIN input when using multiple devices. See the Daisy-Chaining section for more information. The conversion data are output on DOUT[4:1]/[8:1]. The MSB data are valid on DOUT[4:1]/[8:1] after DRDY goes low. Subsequent bits are shifted out with each falling edge of SCLK. If daisy-chaining, the data shifted in using DIN appear on DOUT after all channel data have been shifted out. When the device is configured for modulator output, DOUT[4:1]/[8:1] becomes the modulator data output for each channel (see the Modulator Output section). NOTE: The SPI format is limited to a CLK input frequency of 27MHz, maximum. For CLK input operation above 27MHz (High-Speed mode only), use Frame-Sync format. SCLK The serial clock (SCLK) features a Schmitt-triggered input and shifts out data on DOUT on the falling edge. It also shifts in data on the falling edge on DIN when this pin is being used for daisy-chaining. The device shifts data out on the falling edge and the user normally shifts this data in on the rising edge. DIN This input is used when multiple ADS1274/78s are to be daisy-chained together. The DOUT1 pin of the first device connects to the DIN pin of the next, etc. It can be used with either the SPI or Frame-Sync formats. Data are shifted in on the falling edge of SCLK. When using only one ADS1274/78, tie DIN low. See the Daisy-Chaining section for more information. 30 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 FRAME-SYNC SERIAL INTERFACE DOUT Frame-Sync format is similar to the interface often used on audio ADCs. It operates in slave fashion—the user must supply framing signal FSYNC (similar to the left/right clock on stereo audio ADCs) and the serial clock SCLK (similar to the bit clock on audio ADCs). The data are output MSB first or left-justified on the rising edge of FSYNC. When using Frame-Sync format, the FSYNC and SCLK inputs must be continuously running with the relationships shown in the Frame-Sync Timing Requirements. The conversion data are shifted out on DOUT[4:1]/[8:1]. The MSB data become valid on DOUT[4:1]/[8:1] after FSYNC goes high. The subsequent bits are shifted out with each falling edge of SCLK. If daisy-chaining, the data shifted in using DIN appear on DOUT[4:1]/[8:1] after all channel data have been shifted out. When the device is configured for modulator output, DOUT becomes the modulator data output (see the Modulator Output section). DIN This input is used when multiple ADS1274/78s are to be daisy-chained together. It can be used with either SPI or Frame-Sync formats. Data are shifted in on the falling edge of SCLK. When using only one ADS1274/78, tie DIN low. See the Daisy-Chaining section for more information. SCLK The serial clock (SCLK) features a Schmitt-triggered input and shifts out data on DOUT on the falling edge. It also shifts in data on the falling edge on DIN when this pin is being used for daisy-chaining. Even though SCLK has hysteresis, it is recommended to keep SCLK as clean as possible to prevent glitches from accidentally shifting the data. When using Frame-Sync format, SCLK must run continuously. If it is shut down, the data readback will be corrupted. The number of SCLKs within a frame period (FSYNC clock) can be any power-of-2 ratio of CLK cycles (1, 1/2, 1/4, etc), as long as the number of cycles is sufficient to shift the data output from all channels within one frame. When the device is configured for modulator output, SCLK becomes the modulator clock output (see the Modulator Output section). DOUT MODES For both SPI and Frame-Sync interface protocols, the data are shifted out either through individual channel DOUT pins, in a parallel data format (Discrete mode), or the data for all channels are shifted out, in a serial format, through a common pin, DOUT1 (TDM mode). TDM Mode In TDM (time-division multiplexed) data output mode, the data for all channels are shifted out, in sequence, on a single pin (DOUT1). As shown in Figure 77, the data from channel 1 are shifted out first, followed by channel 2 data, etc. After the data from the last channel are shifted out, the data from the DIN input follow. The DIN is used to daisy-chain the data output from an additional ADS1274/78 or other compatible device. Note that when all channels of the ADS1274/78 are disabled, the interface is disabled, rendering the DIN input disabled as well. When one or more channels of the device are powered down, the data format of the TDM mode can be fixed or dynamic. DRDY/FSYNC (Frame-Sync Format) In Frame-Sync format, this pin is used as the FSYNC input. The frame-sync input (FSYNC) sets the frame period, which must be the same as the data rate. The required number of fCLK cycles to each FSYNC period depends on the mode selection and the CLKDIV input. Table 6 indicates the number of CLK cycles to each frame (fCLK/fDATA). If the FSYNC period is not the proper value, data readback will be corrupted. SCLK 1 2 23 24 25 47 48 49 71 72 73 95 96 97 DOUT1 (ADS1274) CH1 CH2 CH3 CH4 DIN DOUT1 (ADS1278) CH1 CH2 CH3 CH4 CH5 167 168 CH7 169 191 CH8 192 193 194 195 DIN DRDY (SPI) FSYNC (Frame-Sync) Figure 77. TDM Mode (All Channels Enabled) 31 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 TDM Mode, Fixed-Position Data Discrete Data Output Mode In this TDM data output mode, the data position of the channels remain fixed, regardless of whether the channels are powered down. If a channel is powered down, the data are forced to zero but occupy the same position within the data stream. Figure 78 shows the data stream with channel 1 and channel 3 powered down. In Discrete data output mode, the channel data are shifted out in parallel using individual channel data output pins DOUT[4:1]/[8:1]. After the 24th SCLK, the channel data are forced to zero. The data are also forced to zero for powered down channels. Figure 80 shows the discrete data output format. TDM Mode, Dynamic Position Data In this TDM data output mode, when a channel is powered down, the data from higher channels shift one position in the data stream to fill the vacated data slot. Figure 79 shows the data stream with channel 1 and channel 3 powered down. SCLK 1 2 23 25 24 47 48 49 71 72 73 95 96 97 167 DOUT1 (ADS1274) CH1 CH2 CH3 CH4 DIN DOUT1 (ADS1278) CH1 CH2 CH3 CH4 CH5 168 169 CH7 191 192 193 CH8 194 195 DIN DRDY (SPI) FSYNC (Frame-Sync) Figure 78. TDM Mode, Fixed-Position Data (Channels 1 and 3 Shown Powered Down) SCLK 1 2 23 24 25 47 48 49 50 DOUT1 (ADS1274) CH2 CH4 DIN DOUT1 (ADS1278) CH2 CH4 CH5 119 120 CH7 121 143 CH8 144 145 145 146 DIN DRDY (SPI) FSYNC (Frame- Sync) Figure 79. TDM Mode, Dynamic Position Data (Channels 1 and 3 Shown Powered Down) 32 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 SCLK 1 2 22 DOUT1 CH1 DOUT2 CH2 DOUT3 CH3 DOUT4 CH4 DOUT5 CH5 DOUT6 CH6 DOUT7 CH7 DOUT8 CH8 23 24 25 26 ADS1278 Only DRDY (SPI) FSYNC (Frame-Sync) Figure 80. Discrete Data Output Mode DAISY-CHAINING Multiple ADS1274/78s can be daisy-chained together to output data on a single pin. The DOUT1 data output pin of one device is connected to the DIN of the next device. As shown in Figure 81, the DOUT1 pin of device 1 provides the output data to a controller, and the DIN of device 2 is grounded. Figure 82 shows the data format when reading back data. The maximum number of channels that may be daisy-chained in this way is limited by the frequency of fSCLK, the mode selection, and the CLKDIV input. The frequency of fSCLK must be high enough to completely shift the data out from all channels within one fDATA period. Table 13 lists the maximum number of daisy-chained channels when fSCLK = fCLK. To increase the number of data channels possible in a chain, a segmented DOUT scheme may be used, producing two data streams. Figure 83 illustrates four ADS1274/78s, with pairs of ADS1274/78s daisy-chained together. The channel data of each daisy-chained pair are shifted out in parallel and received by the processor through independent data channels. Table 13. Maximum Channels in a Daisy-Chain (fSCLK = fCLK) MODE SELECTION CLKDIV MAXIMUM NUMBER OF CHANNELS High-Speed 1 10 High-Resolution 1 21 1 21 0 10 1 106 0 21 Low-Power Low-Speed Whether the interface protocol is SPI or Frame-Sync, it is recommended to synchronize all devices by tying the SYNC inputs together. When synchronized in SPI protocol, it is only necessary to monitor the DRDY output of one ADS1274/78. In Frame-Sync interface protocol, the data from all devices are ready after the rising edge of FSYNC. Since DOUT1 and DIN are both shifted on the falling edge of SCLK, the propagation delay on DOUT1 creates a setup time on DIN. Minimize the skew in SCLK to avoid timing violations. 33 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 SYNC CLK ADS1274/78 U2 SYNC ADS1274/78 U1 SYNC CLK CLK DIN SCLK Note: DOUT1 DRDY DRDY Output from Device 1 DOUT1 DOUT from Devices 1 and 2 DIN SCLK SCLK The number of chained devices is limited by the SCLK rate and device mode. Figure 81. Daisy-Chaining of Two Devices, SPI Protocol (FORMAT[2:0] = 011 or 100) SCLK 1 DOUT1 2 25 CH1, U1 26 49 CH2, U1 50 CH3, U1 73 74 97 CH4, U1 98 CH5, U1 193 194 217 CH1, U2 218 CH2, U2 385 386 DIN2 DRDY (SPI) FSYNC (Frame-Sync) Figure 82. Daisy-Chain Data Format of Figure 81 (ADS1278 shown) SYNC CLK Serial Data Devices 3 and 4 ADS1274/78 U4 ADS1274/78 U3 ADS1274/78 U2 ADS1274/78 U1 SYNC SYNC SYNC SYNC CLK CLK CLK CLK DIN DOUT1 DIN DOUT1 DIN DOUT1 DIN FSYNC FSYNC FSYNC FSYNC SCLK SCLK SCLK SCLK DOUT1 Serial Data Devices 1 and 2 SCLK FSYNC Note: The number of chained devices is limited by the SCLK rate and device mode. Figure 83. Segmented DOUT Daisy-Chain, Frame-Sync Protocol (FORMAT[2:0] = 000 or 001) 34 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 POWER-UP SEQUENCE The ADS1274/78 has three power supplies: AVDD, DVDD, and IOVDD. AVDD is the analog supply that powers the modulator, DVDD is the digital supply that powers the digital core, and IOVDD is the digital I/O power supply. The IOVDD and DVDD power supplies can be tied together if desired (+1.8V). To achieve rated performance, it is critical that the power supplies are bypassed with 0.1μF and 10μF capacitors placed as close as possible to the supply pins. A single 10μF ceramic capacitor may be substituted in place of the two capacitors. Figure 84 shows the power-up sequence of the ADS1274/78. The power supplies can be sequenced in any order. Each supply has an internal reset circuit whose outputs are summed together to generate a global power-on reset. After the supplies have exceeded the reset thresholds, 218 fCLK cycles are counted before the converter initiates the conversion process. Following the CLK cycles, the data for 129 conversions are suppressed by the ADS1274/78 to allow output of fully-settled data. In SPI protocol, DRDY is held high during this interval. In frame-sync protocol, DOUT is forced to zero. The power supplies should be applied before any analog or digital pin is driven. For consistent performance, assert SYNC after device power-on when data first appear. output, tie FORMAT[2:0], as shown in Figure 85. DOUT[4:1]/[8:1] then becomes the modulator data stream outputs for each channel and SCLK becomes the modulator clock output. The DRDY/FSYNC pin becomes an unused output and can be ignored. The normal operation of the Frame-Sync and SPI interfaces is disabled, and the functionality of SCLK changes from an input to an output, as shown in Figure 85. Table 14. Modulator Output Clock Frequencies MODE [1:0] CLKDIV MODULATOR CLOCK OUTPUT (SCLK) 00 1 fCLK/4 4.5 8 01 1 fCLK/4 4.0 7 1 fCLK/8 2.5 4 0 fCLK/4 2.5 4 1 fCLK/40 1.0 1 0 fCLK/8 0.5 1 10 11 DOUT1 DOUT2 ADS1274 DVDD (mA) ADS1278 DVDD (mA) Modulator Data Channel 1 Modulator Data Channel 2 IOVDD DIN FORMAT0 AVDD 3.0V nom DVDD 1V nom IODVDD 1V nom (1) (1) (1) FORMAT1 DOUT4/8(1) Modulator Data Channel 4/8(1) FORMAT2 Modulator Clock Output SCLK NOTE: (1) ADS1274 has four channels; ADS1278 has eight channels. Internal Reset Figure 85. Modulator Output CLK 18 2 fCLK In modulator output mode, the frequency of the modulator clock output (SCLK) depends on the mode selection of the ADS1274/78. Table 14 lists the modulator clock output frequency and DVDD current versus device mode. 129 (max) tDATA DRDY (SPI Protocol) DOUT (Frame-Sync Protocol) Valid Data (1) The power-supply reset thresholds are approximate. Figure 84. Power-Up Sequence MODULATOR OUTPUT The ADS1274/78 incorporates a 6th-order, single-bit, chopper-stabilized modulator followed by a multi-stage digital filter that yields the conversion results. The data stream output of the modulator is available directly, bypassing the internal digital filter. The digital filter is disabled, reducing the DVDD current, as shown in Table 14. In this mode, an external digital filter implemented in an ASIC, FPGA, or similar device is required. To invoke the modulator Figure 86 shows the timing relationship of the modulator clock and data outputs. The data output is a modulated 1's density data stream. When VIN = +VREF, the 1's density is approximately 80% and when VIN = –VREF, the 1's density is approximately 20%. Modulator Clock Output SCLK Modulator Data Output DOUT (13ns max) Figure 86. Modulator Output Timing 35 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 BOUNDARY SCAN TEST[1:0] INPUTS VCOM OUTPUT The Boundary Scan test mode feature of the ADS1274/78 allows continuity testing of the digital I/O pins. In this mode, the normal functions of the digital pins are disabled and routed to each other as pairs through internal logic, as shown in Table 15. Note that some of the digital input pins become outputs. Therefore, if using boundary scan tests, the ADS1274/78 digital I/O should connect to a JTAG-compatible device. The analog input, power supply, and ground pins remain connected as normal. The test mode is engaged by the setting the pins TEST[1:0] = 11. For normal converter operation, set TEST[1:0] = 00. Do not use '01' or '10'. The VCOM pin provides a voltage output equal to AVDD/2. The intended use of this output is to set the output common-mode level of the analog input drivers. The drive capability of the output is limited; therefore, the output should only be used to drive high-impedance nodes (> 1MΩ). In some cases, an external buffer may be necessary. A 0.1μF bypass capacitor is recommended to reduce noise pickup. ADS1274/78 OPA350 VCOM » (AVDD/2) 0.1mF Table 15. Test Mode Pin Map (TEST[1:0] = 11) TEST MODE PIN MAP INPUT PINS OUTPUT PINS PWDN1 DOUT1 PWDN2 DOUT2 PWDN3 DOUT3 PWDN4 DOUT4 PWDN5 DOUT5 PWDN6 DOUT6 PWDN7 DOUT7 PWDN8 DOUT8 MODE0 DIN MODE1 SYNC FORMAT0 CLKDIV FORMAT1 FSYNC/DRDY FORMAT2 SCLK Figure 87. VCOM Output 36 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 APPLICATION INFORMATION To obtain the specified performance from the ADS1274, the following layout and component guidelines should be considered. 1. Power Supplies: The device requires three power supplies for operation: DVDD, IOVDD, and AVDD. The allowed range for DVDD is 1.65V to 1.95V; the range of IOVDD is 1.65V to 3.6V; AVDD is restricted to 4.75V to 5.25V. For all supplies, use a 10μF tantalum capacitor, bypassed with a 0.1μF ceramic capacitor, placed close to the device pins. Alternatively, a single 10μF ceramic capacitor can be used. The supplies should be relatively free of noise and should not be shared with devices that produce voltage spikes (such as relays, LED display drivers, etc.). If a switching power-supply source is used, the voltage ripple should be low (< 2mV) and the switching frequency outside the passband of the converter. The power supplies may be sequenced in any order. 2. Ground Plane: A single ground plane connecting both AGND and DGND pins can be used. If separate digital and analog grounds are used, connect the grounds together at the converter. 3. Digital Inputs: It is recommended to source-terminate the digital inputs to the device with 50Ω series resistors. The resistors should be placed close to the driving end of digital source (oscillator, logic gates, DSP, etc.) This placement helps to reduce ringing on the digital lines (ringing may lead to degraded ADC performance). 4. Analog/Digital Circuits: Place analog circuitry (input buffer, reference) and associated tracks together, keeping them away from digital circuitry (DSP, microcontroller, logic). Avoid crossing digital tracks across analog tracks to reduce noise coupling and crosstalk. 5. Reference Inputs: It is recommended to use a minimum 10μF tantalum with a 0.1μF ceramic capacitor directly across the reference inputs, VREFP and VREFN. The reference input should be driven by a low-impedance source. For best performance, the reference should have less than 3μVRMS in-band noise. For references with noise higher than this level, external reference filtering may be necessary. 6. Analog Inputs: The analog input pins must be driven differentially to achieve specified performance. A true differential driver or transformer (ac applications) can be used for this purpose. Route the analog inputs tracks (AINP, AINN) as a pair from the buffer to the converter using short, direct tracks and away from digital tracks. A 1nF to 10nF capacitor should be used directly across the analog input pins, AINP and AINN. A low-k dielectric (such as COG or film type) should be used to maintain low THD. Capacitors from each analog input to ground can be used. They should be no larger than 1/10 the size of the difference capacitor (typically 100pF) to preserve the ac common-mode performance. 7. Component Placement: Place the power supply, analog input, and reference input bypass capacitors as close as possible to the device pins. This layout is particularly important for small-value ceramic capacitors. Larger (bulk) decoupling capacitors can be located farther from the device than the smaller ceramic capacitors. Figure 88 to Figure 90 illustrate basic connections and interfaces that can be used with the ADS1274. 37 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 OPA1632 (1) +3.3V ADS1274 AINP1 TMS320VC5509 DVDD (I/O) IOVDD (2) IN1 2.2nF (3) 10mF AINN1 50W AINP2 CLK AINN2 DRDY/FSYNC IN2 2.2nF (3) SCLK AINP3 DOUT1 AINN3 DOUT2 IN3 2.2nF (3) CLKOUT (27MHz) 50W 50W McBSP PORT 50W CVDD (CORE) 200MHz DOUT3 AINP4 IN4 +5V 2.2nF + (3) AVDD 10mF DVDD +1.8V (2) 1kW 10mF 1kW REF1004 100mF + I/O PWDN2 PWDN4 0.1mF 100W VREFP OPA350 + 10mF VREFN 0.1mF VCOM (2) 100W JTAG (4) Device OPA350 +3.3V (27MHz clock input selected) (2) 0.1mF (2) 0.1mF Buffered VCOM Output SYNC PWDN1 PWDN3 20kW See Note (5) 100W DOUT4 AINN4 (2) +1.6V TEST0 TEST1 DIN AGND DGND CLKDIV MODE1 MODE0 FORMAT2 FORMAT1 (High-Speed, Frame-Sync, TDM, and Fixed-Position data selected.) FORMAT0 +3.3V NOTES: (1) External Schottky clamp diodes or series resistors may be needed to prevent overvoltage on the inputs. See Analog Inputs section. (2) Indicates ceramic capacitors. (3) Indicates COG ceramic capacitors. (4) Optional. For boundary scan test, the ADS1274 digital I/O should connect to a JTAG-compatible device (5) The op amp and input RC components filter the REF1004 noise. Figure 88. ADS1274 Basic Connection Drawing 1kW 1kW 1kW 249W VIN 1.5nF Buffered VCOM Output +12V 5.6nF AINP OPA1632 0.1mF 49.9W AINN -12V +12V VOCM (1) AINP OPA1632 0.1mF (1) 5.6nF (2) 1kW 49.9W AINN -12V 1kW (2) 49.9W (1) 1.5nF 1kW Buffered VCOM Output (1) 49.9W VOCM VIN (2) VO DIFF = 0.25 ´ VIN VO COMM = VREF (2) 249W NOTES: (1) Bypass with 10mF and 0.1mF capacitors. (2) 2.7nF for Low-Power mode; 15nF for Low-Speed mode. NOTES: (1) Bypass with 10mF and 0.1mF capacitors. (2) 10nF for Low-Power mode; 56nF for Low-Speed mode. Figure 89. Basic Differential Input Signal Interface Figure 90. Basic Single-Ended Input Signal Interface 38 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 PowerPAD THERMALLY-ENHANCED PACKAGING The PowerPAD concept is implemented in standard epoxy resin package material. The integrated circuit is attached to the leadframe die pad using thermally conductive epoxy. The package is molded so that the leadframe die pad is exposed at a surface of the package. This design provides an extremely low thermal resistance to the path between the IC junction and the exterior case. The external surface of the leadframe die pad is located on the printed circuit board (PCB) side of the package, allowing the IC Die die pad to be attached to the PCB using standard flow soldering techniques. This configuration allows efficient attachment to the PCB and permits the board structure to be used as a heatsink for the package. Using a thermal pad identical in size to the die pad and vias connected to the PCB ground plane, the board designer can now implement power packaging without additional thermal hardware (for example, external heatsinks) or the need for specialized assembly instructions. Figure 91 illustrates a cross-section view of a PowerPAD package. Mold Compound (Epoxy) Wire Bond Wire Bond Leadframe Die Pad Exposed at Base of Package Die Attach Epoxy (thermally conductive) Leadframe Figure 91. Cross-Section View of a PowerPAD Thermally-Enhanced Package 39 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com SBAS367 – JUNE 2007 PowerPAD PCB Layout Considerations Figure 92 shows the recommended layer structure for thermal management when using a PowerPad package on a 4-layer PCB design. Note that the thermal pad is placed on both the top and bottom sides of the board. The ground plane is used as the heatsink, while the power plane is thermally isolated from the thermal vias. Figure 93 shows the required thermal pad etch pattern for the HTQFP-64 package used for the ADS1274. Nine 13mil (0.33mm) thermal vias plated with 1 ounce of copper are placed within the thermal pad area for the purpose of connecting the pad to the ground plane layer. The ground plane is used as a heatsink in this application. It is very important that the thermal via diameter be no larger than 13mils in order to avoid solder wicking during the reflow process. Solder wicking results in thermal voids that reduce heat dissipation efficiency and hampers heat flow away from the IC die. The via connections to the thermal pad and internal ground plane should be plated completely around the hole, as opposed to the typical web or spoke thermal relief connection. Plating entirely around the thermal via provides the most efficient thermal connection to the ground plane. Additional PowerPAD Package Information Texas Instruments publishes the PowerPAD Thermally Enhanced Package Application Report (TI literature number SLMA002), available for download at www.ti.com, that provides a more detailed discussion of PowerPAD design and layout considerations. Before attempting a board layout with the ADS1274, it is recommended that the hardware engineer and/or layout designer be familiar with the information contained in this document. Package Thermal Pad Component Traces 13mils (0.33mm) Component (top) Side Thermal Via Ground Plane Power Plane Thermal Isolation (power plane only) Solder (bottom) Side Package Thermal Pad (bottom trace) Figure 92. Recommended PCB Structure for a 4-Layer Board 40 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 ADS1274 ADS1278 www.ti.com 118mils (3mm) 40mils (1mm) 40mils (1mm) SBAS367 – JUNE 2007 Package Outline Thermal Pad 40mils (1mm) 40mils (1mm) 118mils (3mm) 316mils (8mm) Thermal Via 13mils (0.33mm) 316mils (8mm) Figure 93. Thermal Pad Etch and Via Pattern for the HTQFP-64 Package 41 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS1274 ADS1278 PACKAGE OPTION ADDENDUM www.ti.com 23-Jul-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ADS1274IPAPR ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1274IPAPRG4 ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1274IPAPT ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1274IPAPTG4 ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1278IPAPR ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1278IPAPRG4 ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1278IPAPT ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1278IPAPTG4 ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jun-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 28-Jun-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS1274IPAPR PAP 64 TAI 330 24 13.0 13.0 1.4 16 24 NONE ADS1274IPAPT PAP 64 TAI 330 24 13.0 13.0 1.4 16 24 NONE ADS1278IPAPR PAP 64 TAI 330 24 13.0 13.0 1.4 16 24 NONE ADS1278IPAPT PAP 64 TAI 330 24 13.0 13.0 1.4 16 24 NONE TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) ADS1274IPAPR PAP 64 TAI 0.0 0.0 0.0 ADS1274IPAPT PAP 64 TAI 0.0 0.0 0.0 ADS1278IPAPR PAP 64 TAI 346.0 346.0 41.0 ADS1278IPAPT PAP 64 TAI 0.0 0.0 0.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jun-2007 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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