defining a degree of excellence HIGH SPEED LAN MAGNETICS 960030B • Designed to enhance performance with National Semiconductor 10/100 DSP 83840/83223 chipsets • Split design allows CMC's to address 10 Mbps or 100 Mbps signals individually • Split input on transmit channel provides better balance of differential output signal and greater isolation between 10Base-T and 100Base-TX transceivers • Additional 10 Mbps and 100 Mbps common chokes provide for lower EMI emissions • 2000 Vrms isolation ELECTRICALS AT 25°C Part No. S558-5999-37 Inductance OCL (µH) Min with 8mA DC bias Insertion Loss (dB) Min 100KHz-100MHz CMDR 1% (dB) Min 100KHz-50MHz CMDR 1% (dB) Min 50MHz-100MHz Crosstalk (dB) Max 100KHz-100MHz 350 -1.1 -50 -40 -30 SCHEMATIC MECHANICAL Specifications subject to change without notice. Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: [email protected] Website: http://www.belfuse.com defining a degree of excellence HIGH SPEED LAN MAGNETICS 960030B APPLICATION CIRCUIT APPLICATION NOTES • These Bel dual, 2-port devices have been uniquely designed for either 100 Mbps or 10/100 Mbps data transmission systems over category 5 UTP/STP cable. These Bel parts have been tested and qualified for use with the National Semiconductor DP83223 TP-Transceiver and DP83840 10/100 Mbps PHY device. Each Bel module provides superior EMI noise suppression, high voltage isolation, wave shaping and fast, but controlled rise times. All parts meet IEEE 802.3 standards, which includes 350µH OCL (inductance) when 8mA of DC bias is applied. • The Bel unique design approach allows for separation of the 10 Mbps and 100 Mbps signals, creating better signal balance, superior noise suppression, optimization of performance for each 10 Mbps and 100 Mbps signal and ease of magnetics design. This approach also allows for the addition of either a 10 Mbps or 100 Mbps common mode choke, which could not be effectively implemented if the 10 Mbps and 100 Mbps shared the same signal lines. • Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is optically inspected to meet rigid coplanarity requirements. Corporate Office Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302-4496 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: [email protected] Internet: http://www.belfuse.com Far East Office Bel Fuse Ltd. 8F/8 Luk Hop Street San Po Kong Kowloon, Hong Kong Tel: 852-2328-5515 Fax: 852-2352-3706 European Office Bel Fuse Europe Ltd. Preston Technology Management Centre Marsh Lane, Preston PR1 8UD Lancashire, U.K. Tel: 44-1772-556601 Fax: 44-1772-888366