Data Sheet XFP Optical Transceivers for 10km 10G Datacom and Storage Applications IGF Series IGF-17311J Features: The Bookham IGF Series optical transceiver modules are high-performance, cost-effective modules for serial optical data communication applications at 10Gb/s. They are designed to provide 10Gb/s Ethernet and 10Gb/s Fiber Channel 10 km compliant links. The modules are designed for single mode fiber and operate at a nominal wavelength of 1310nm. They incorporate Bookham’s exclusive optical packaging platform. The modules aid system hardware engineers in implementing low-cost single mode Physical Media Dependency (PMD) solutions that are protocol transparent. The “hot pluggable” feature built into every module reduces manufacturing cost, inventory costs and allows optical port upgrades at the customer premises. Built-in remote monitoring via digital diagnostics allows user access to static and dynamic data as well as module condition. The IGF-17311J uses a DFB laser packaged in conjunction with an optical isolator. This design provides for maximum eye opening, minimized jitter generation, and excellent back reflection performance. The transmitter is fully EN/IEC60825-1 Class 1/Class I laser eye safety compliant. • Multi-Protocol support: IEEE 802.3ae 10G Ethernet 10GBASE-LR/LW 10G Fibre Channel 1200-SM-LL-L • Compliant with the XFP • 9.95 to 10.52 Gb/s data rates • Supports 10km link distances • Hot Pluggable • Low EMI for high port density • 2.2W Typical Power Dissipation • On board Enhanced Digital Diagnostics providing I2C remote monitoring capability • XFI Loop-Back Diagnostic • Integral Signal Conditioning ICs enabling FR4 host board PCB traces up to 8 inches • Duplex LC connector • Transmit disable and loss-of-signal functions • RoHS compliant Applications: • High Port Density Solutions • 10GBASE-L applications • 10Gb/s Gigabit Ethernet Networking • Datacom and Storage-area networking • Rack-to-rack connectivity • Client side interconnection • Fiber to the X aggregation 1 Data Sheet Absolute maximum ratings Parameter Symbol Min Max Units Tstg -40 85 °C Supply voltage 5 VCC5 0 6 V Supply voltage 3 VCC3 0 4.0 V Supply voltage 2 VCC2 Supply voltage E5 VEE5 Storage Temp 1.8V Not required V -5.2V Not required V Data AC volt. differential Tx+, Tx- -0.5 2 Vpp Data DC volt Tx+, Tx- 0 VCC2 Vpp Receiver Input Damage Threshold PDamage 5 dBm Recommended operating conditions Parameter Symbol Baud rate Typ Max Units Notes 10.52 GBd 10 GbE; 10G FC 5.0 5.25 V +/- 5% 275 400 mA 3.3 3.47 V 300 mA 9.95 Supply voltage 5 VCC5 Supply current 5 ICC5 Supply voltage 3 VCC3 Supply current 3 ICC3 255 Supply voltage 2 VCC2 1.8 V Not required Supply voltage VEE5 -5.2 V Not required Power dissipation Pw 2.2 Temperature case Ts1 E5 Please contact sales for special requirements 2 Min 4.75 3.13 0 2.7 W 70 °C +/- 5% Data Sheet Operating Specifications – electrical Parameter Symbol Value Typical Min Units Notes Max CML input (differential) VTxDiff 125 940 mVpp 100 ohm differential CML output (differential) VRxDiff 360 770 mVpp 100 ohm differential Tr/Tf 24 Ps 20% - 80% Output voltage high Output voltage low VOH VOL VCC3-0.5 0 VCC3+0.3 0.4 V RX_LOS, MOD_NR, Interrupt Input voltage high Input voltage low VIH VIL 2 0 VCC3+0.3 0.8 V TX_DIS, P_Down/RST Rise/Fall time Low Speed Electrical Signals Loss of signal timing Assert (off to on) TA 100 µs Deassert (on to off) TD 100 µs Transmitter operating specifications – optical Parameter Symbol Value Typical Max Units 1310 1355 nm 0.5 dBm Center wavelength λc 1260 Optical transmit power Po -6.0 Transmitter Optical Modulation Amplitude OMA -5.2 dBm -6.2 dBm SMSR 30 dB ER 3.5 dB Transmitter power (in OMA) - TDP Side mode suppression Extinction ratio Transmitter and dispersion penalty TDP 3.2 dB TX disabled output power POFF -30 dBm Output optical eye 3 Min Compliant with IEEE 802.3æ clause 52 Notes EOL 10km SMF Data Sheet Receiver operating specifications – optical Parameter Symbol Min Input operating wavelength λ Value Typical Units 1360 1260 nm Receiver sensitivity PIN-MIN Receiver sensitivity in OMA PIN-OMA -12.6 dBm SRS -10.3 dBm Stressed receiver sensitivity in OMA Receiver overload PIN-MAX -17 dBm 0.5 dBm Reflectance -12 dB -20 dBm -15 dBm 6 dB Loss of Signal Loss of Signal Assert (Off to On) PA Loss of Signal Deassert (On to Off) PD Hysteresis 4 PA - PD -32 0.5 Notes Max Ave. power at ER=6dB Ave. power Data Sheet Electrical pin out Top of Board GND 30 2 VEE5 TD+ 29 3 Mod_Desel TD- 28 4 Interrupt GND 27 GND 26 6 VCC5 RefCLK- 25 7 GND RefCLK+ 24 8 VCC3 GND 23 9 VCC3 VCC2 22 10 SCL P_down/RST 21 11 SDA VCC2 20 12 Mod_Abs GND 19 13 Mod_NR RD+ 18 14 Rx_LOS RD- 17 15 GND GND 16 Figure 1: XFP Module Board Pinout & Names 5 15 Rx_LOS 14 Mod_NR 13 Mod_Abs 12 SDA 11 SCL 10 VCC3 9 VCC3 8 GND 7 VCC5 6 TX_DIS 5 Interrupt 4 16 GND 1 GND 5 TX_DIS GND 17 RD18 RD+ 19 GND 20 VCC2 21 P_down/RST 22 VCC2 23 GND 24 RefCLK+ 25 RefCLK26 GND 27 GND Mod_Desel 3 28 TDVEE5 2 GND 1 29 TD+ 30 GND Towards Bezel Towards ASIC Figure 2: Host PCB XFP Pinout Top View Data Sheet Pin definitions Pin # Logic Symbol Function Plug Seq Notes 1 GND Module Ground; Signal Ground 1 1 2 VEE5 Optional -5.2V Power Supply—NOT USED 2 3 LVTTL-I Mod_Desel Module De-select; When held low by host allows the module to respond to 2-wire serial interface commands 3 4 LVTTL-O Interrupt Interrupt_BAR; Indicates the presence of an important condition that can be read over the two wire interface 3 5 LVTTL-I TX_DIS Transmitter Disable; Turns Off Transmitter Laser Source 3 6 VCC5 +5 V Power Supply 2 7 GND Module Ground; Signal Ground 1 8 VCC3 +3.3 V Power Supply 2 9 VCC3 +3.3 V Power Supply 2 1 10 LVTTL-I SCA Two Wire Interface Clock 3 2 11 LVTTL-I/O SDA Two Wire Interface Data Line 3 2 12 LVTTL-O Mod_Abs Indicates Module Not Present; Grounded in Module 3 2 13 LVTTL-O Mod_NR Module Not ready or Indicating Module Operational Fault 3 2 14 LVTTL-O RX_LOS Receiver Loss of Signal Indicator 3 2 15 GND Module Ground; Signal Ground 1 1 16 GND Module Ground; Signal Ground 1 1 17 CML-O RD- Receiver Inverted Data Output 3 18 CML-O RD+ Receiver Non-Inverted Data Output 3 19 GND Module Ground; Signal Ground 1 20 VCC2 +1.8 V Power Supply 2 P_down/RST Power down; When high, places the module in the low power standby mode of less than 1.5 W with 2-wire interface still operational. Reset; The falling edge of P_Down/RST initiates a complete module reset including the 2-wire interface. 3 22 VCC2 +1.8 V Power Supply 2 23 GND Module Ground; Signal Ground 1 21 LVTTL-I 1 1 24 PECL-I RefCLK+ Reference Clock Non-Inverted Input, AC coupled on Host Board 3 25 PECL-I RefCLK- Reference Clock Inverted Input, AC coupled on Host Board 3 26 GND Module Ground; Signal Ground 1 1 27 GND Module Ground; Signal Ground 1 1 28 CML-I TD- Transmitter Inverted Data Input 3 29 CML-I TD+ Transmitter Non-Inverted Data Input 3 GND Module Ground; Signal Ground 1 30 Notes: 6 2 1. Module ground pins are isolated from the module case and chassis ground within the module. 2. Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board. 1 Data Sheet Figure 3. Host Board Supply Filtering Figure 4. Host Board mechanical layout (mm) 7 Data Sheet Mechanical interface The XFP module is a pluggable module with its foundation based on the successful SFP package configuration. It consists of a rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module is inserted into a metal cage assembly. As an option, a heat sink can be clipped to the cage to enhance the cooling of the module. Figure 5. Example of clip-on heat sink Thermal interface One of the unique features of the XFP module is that the module cage is designed with the ability to have a thermal heat sink clipped onto the cage. Thus the equipment manufacturer that designs with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow, air flow direction and desired pressure drop. Figure 6. Mechanical Dimensions (mm) of the XFP module. 8 Data Sheet Figure 7. Interface Design with Bezel (mm) Management Interface Digital diagnostics is an available interface on all Bookham XFP transceivers. A 2-wire Serial ID interface provides user access to vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code mechanism for verifying accuracy in the data registers. These “static” and “dynamic” diagnostics allow users to remotely and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify which “Enhanced” diagnostics are supported, and monitor module parameters to determine the module and link condition. The module’s “Enhanced Digital Diagnostics” features provide real-time monitoring of receiver input power, transmitter power, internal module temperature, laser bias current, and supply voltage parameters. The 2-wire serial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications. The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate memory locations. The memory location starting at A0h (data address 0 ~ 127) contains the Digital Diagnostic Functions. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control functions that must be accessed repeatedly. 9 One exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the memory map (in the diagnostics space) to allow software developed for multiple module types to have a common branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship to other serial ID bits. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as ample space for vendor specific functions. These are allocated as follows: • Table 01h: Serial ID EEPROM • Table 02h: User writable EEPROM The details of each memory space are found in the XFP MSA specification Chapter 5. Reference Documents: 1. XFP MSA revision 4.0 found at www.xfpmsa.org; April 13, 2004 Data Sheet Regulatory compliance Bookham IGF-17311J 1310nm XFP transceivers are designed to be Class I Laser compliant. They are certified per the following standards: Feature Laser Safety Agency Standard Certificate/Comments FDA/CDRH CDHR 21(J) CFR 1040.10 0212646-01 DE3-54632 TÜV IEC/EN 60950-1:2001 IEC/EN 60825-1/A2:2001 CAN/CSA-60825-1-03 U8V 06 06 54880 002 UL 60950-1:2003 UL 94 V-0 CAN/CSA-C22.2 No.60950-1-03 U8V 06 06 54880 002 Product Safety UL/CSA ESD IEC MIL-STD 883 Method 3015 Pass IEC61000-4-2 Part 15 Class B Pass [EU Directive] EN55022, EN55024 Class B Pass EU Directive 73/23/EEC (Low voltage) 89/336/EEC (EMC) Pass FCC/89/336/EE EMI CE 10 Data Sheet RoHS Compliance Bookham is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compliance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details. Ordering Information: TRX 10G XFP 10KM SR GBE COM ROHS 5/6 IGF-17311J Contact Information North America Bookham Worldwide Headquarters Europe Paignton Office Asia Shenzhen Office 2584 Junction Ave. San Jose CA 95134 USA Brixham Road Paignton Devon TQ4 7BE United Kingdom 2 Phoenix Road Futian Free Trade Zone Shenzhen 518038 China • Tel: +1 408 919 1500 • Tel: +44 (0) 1803 66 2000 • Fax: +1 408 919 6083 • Fax: +44 (0) 1803 66 2801 • Fax: +86 755 33305805 +86 755 33305807 • Tel: +86 755 33305888 Important Notice Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by Bookham before they become applicable to any particular order or contract. In accordance with the Bookham policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Bookham or others. Further details are available from any Bookham sales representative. www.bookham.com [email protected] 11 BH13280 Rev 1.0 January 2007 ©Bookham 2005. Bookham is a registered trademark of Bookham Inc.