BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Features: ●Package Dimensions: 1. Emitted Color : Yellow Green 2. Lens Appearance : Water Clear. 3. Mono-color type. 4. 1.6x0.8x0.8mm(0603) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 80 mW Forward Current IF 30 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -55℃~85℃ - Storage Temperature Tstg -55℃~85℃ - Soldering Temperature Tsol See Page6 - Derating Linear From 25℃ - 0.6 mA/℃ Infrared Soldering Condition - 240℃(for 10 Seconds) - Vapor Soldering Condition - 215℃(for 3Minutes) - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.2.1 Page 1 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=20mA - 2.0 2.6 V Luminous Intensity Iv IF=20mA 3.7 10.0 - mcd Reverse Current IR VR=5V - - 100 µA 568 - nm 576 nm Peak Wave Length λp IF=20mA - Dominant Wave Length λd IF=20mA 566 Spectral Line Half-width Δλ IF=20mA - 30 - nm Veiwing Angle 2θ1/2 IF=20mA - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength vs. ambient temperature 1.0 60 Forward current (mA) Relative radiant intensity 50 0.5 40 30 20 10 0 515 568 0 615 20 Wavelength (nm) 100 2.5 Relative Luminous intensity (Normalized @20mA) Forward current (mA) 80 3.0 40 30 20 10 2.0 1.5 1.0 0.5 1 2 3 4 0 -40 5 -20 Forward voltage(V) 0 20 60 40 Ambient temperature Ta( C) RADIATION DIAGRAM Fig.5 Relative luminous intensity vs. forward current 0 4.0 10 20 30 RELATIVE RADIANT INTENSITY Relative luminous intensity (@20mA) 60 Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 50 0 40 Ambient temperature Ta( C) 3.0 2.0 1.0 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Ver.2.0 Page 2 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 13.0± 0.5 1.04± 0.1 4.0 ± 0.1 1.75 ± 0.1 CATHODE 1.5± 0.1 4.0 ± 0.1 2.0± 0.05 TRAILER 179± 1 13.0± 0.5 71.0± 0.1 1.88± 0.1 3.5 ± 0.05 5.3 ± 0.05 END 8.0 ± 0.3 ANODE 1.08± 0.1 START LEADER 0.3 FIXING TAPE NOTE: 3000 pcs PER REEL ●Package Method:(unit:mm) 12 bag/box 3000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 187 645 6 box/carton 210 470 Ver.2.0 Page 3 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (mcd) G 3.2 6.3 H 4.8 9.4 J 7.0 14.0 K 11 . 0 21.0 Min. (mcd) Max. (mcd) 4 565 569 5 567 571 6 569 573 7 571 575 8 573 577 C o l o r B i n L i m i ts ( A t 2 0 m A ) BIN CODE B IN： x Max. (mcd) x Color BIN CODE Intensity BIN CODE Ver.2.0 Page 4 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Reliability Test Classification Test Item Operation Life Endurance Test High Temperature High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling Thermal Shock Solder Resistance Reference Standard MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 MIL-STD-202:103B JIS-C-7021 :B-11 MIL-STD-883:1008 JIS-C-7021 :B-10 JIS-C-7021 :B-12 MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1011 MIL-STD-202:201A MIL-STD-750:2031 JIS-C-7021 :A-1 Environmental IR-Reflow Test - Solderability - Solderability - Test Conditions Result Ta=Under RoomTemperature As Per Data Sheet Maximum Rating Test Time=1000HRS(-24HRS,+72HRS)＠ 20mA Ta=+65℃±5℃ RH=90%-95% Test time=240hrs±2HRS 0/20 0/20 High Ta=+105℃±5℃ Test time=1,000hrs(-24HRS,+72HRS) 0/20 Low Ta=-55℃±5℃ Test time=1,000hrs(-24HRS,+72HRS) 0/20 +105℃ ~ +25℃ ~ -55℃ ~ +25℃ 30min 5min 30min 5min Test Time=10cycle IR-Reflow In-Board, 2 (10min)~-40±5℃(10min) Test Time=10cycle T.sol=260±5℃ Dwell Time=10±1secs Times 0/20 85±5 ℃ 0/20 0/20 Ramp-up rate(183℃ to Peak)+3℃ 1sec max Temp maintain at125±25℃ 120sec max Temp maintain above 183℃ 60～150sec Peak temperature range 235℃～240℃ Time within5℃ of actual Pwck Temperature10-30sec Ramp-down rate+6℃ 1sec max T.sol=235±5℃ Immesion time 2±0.5sec Immesion rate 25±2.5mm/sec Coverage≧95% of the dipped surface 0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA 1.U means the upper limit of specified characteristics. Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.2.0 Page 5 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 235℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 5 SEC. MAX. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec. 120~150℃ Preheat 120~180 sec. Time ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.2.0 Page 6 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG036D-TRB SINCE 1981 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Customer: xxx Cus Part.NO: XX Material No: BL-Hxxxxx-TRB Quantity:xxxx Sealing date:xxxxxx x Batch(BIN): x Part No. Quantity BIN. Lot NO:X Sealing Date xx xx xx Year Month Day Manufacture Location Ver.2.0 Pag 7 of 7