BRIGHT BL-HG635A-TRB

BRIGHT LED ELECTRONICS CORP.
BL-HG635A-TRB
SINCE 1981
● Features:
●Package Dimensions:
1. Emitted Color : Green.
2. Lens Appearance : Water Clear.
3. Mono-color type.
2.0(.079)± 0.2
4. 2.0x1.25x1.0mm(0805) standard package.
Cathode Mark
1.2(.047)
LED die
5. Suitable for all SMT assembly methods.
1.25(.049)± 0.2
6. Compatible with infrared and vapor phase
reflow solder process.
2-R0.05(.002) MAX.
3°
7. Compatible with automatic placement
2-R0.05(.002) MAX
1.0(.039)± 0.2
For reflow soldering
equipment.
0.3(.012)
1.2(.047)
1.4(.055)
0.9(.035)
1.2(.047)
1.00
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
1.25(.049)
Cathode Mark
0.4(.016)
0.4(.016)
● Applications:
1.
Automotive : Dashboards, stop lamps,
turn signals.
2.
Backlighting : LCDs, Key pads advertising.
3.
Status indicators : Comsumer & industrial
NOTES:
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3.Specifications are subject to change without notice.
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Rating
Unit
Power Dissipation
Pd
120
mW
Forward Current
IF
30
mA
Peak Forward Current *1
IFP
100
mA
Reverse Volage
VR
5
V
Operating Temperature
Topr
-25℃~80℃
-
Storage Temperature
Tstg
-30℃~85℃
-
Soldering Temperature
Tsol
See Page6
-
*1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page 1 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HG635A-TRB
SINCE 1981
● Electrical and optical characteristics(Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Forward Voltage
Vf
IF=20mA
-
3.2
3.6
V
Luminous Intensity
Iv
IF=20mA
94
180
-
mcd
Reverse Current
IR
VR=5V
-
-
1
µA
Peak Wave Length
λp
IF=20mA
-
525
-
nm
Dominant Wave Length
λd
IF=20mA
520
-
530
nm
Spectral Line Half-width
Δλ
IF=20mA
-
35
-
nm
Veiwing Angle
2θ1/2
IF=20mA
-
120
-
deg
● Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
vs. ambient temperature
Fig.1 Relative intensity vs. wavelength
1.0
60
Forward current (mA)
Relative radiant intensity
50
0.5
40
30
20
10
0
475
525
0
575
Wavelength (nm)
60
80
100
3.0
2.5
Relative Luminous intensity
(Normalized @20mA)
40
Forward current (mA)
40
Fig.4 Relative luminous intensity vs.
ambient temperature
Fig.3 Forward current vs. forward voltage
50
30
20
10
0
20
Ambient temperature Ta( C)
2.0
1.5
1.0
0.5
1
2
3
4
0
-40
5
-20
Forward voltage(V)
0
20
40
60
Ambient temperature Ta( C)
Fig.5 Relative luminous intensity
vs. forward current
Fig.6 Radiation diagram
0
2.0
10
20
1.5
Relative radiant intensity
Relative luminous intensity (@20mA)
30
1.0
0.5
40
1.0
0.9
50
0.8
60
70
0.7
80
90
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.1.1 Page 2 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HG635A-TRB
SINCE 1981
● Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED
13.0± 0.5
1.3± 0.1
1.5± 0.1
4.0 ± 0.1
2.0± 0.05
TRAILER
179± 1
13.0± 0.5
2.26± 0.1
3.5 ± 0.05
1.75 ± 0.1
CATHODE
4.0 ± 0.1
71.0± 1
END
5.3 ± 0.05
START
8.0 ± 0.3
ANODE
1.42 ± 0.1
LEADER
0.3
FIXING TAPE
NOTE: 3000 pcs PER REEL
●Package Method:(unit:mm)
12 bag/box
3000 pcs/reel
200
Bar Code Label
245
220
220
Aluminum Foil Bag
185
645
6 box/carton
210
470
Ver.1.0 Page 3 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HG635A-TRB
SINCE 1981
● Bin Limits
Intensity Bin Limits (At 20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
Q
82.0
160.0
R
120.0
240.0
S
180.0
360.0
T
280.0
550.0
Min. (nm)
Max. (nm)
6
519
526
7
524
531
C o l o r B i n L i m i ts ( 2 0 m A )
BIN CODE
V F B i n L i m i ts ( 2 0 m A )
BIN CODE
● B IN: x
x
Min.(v)
Max.(v)
G
2.75
3.05
H
2.95
3.25
J
3.15
3.45
K
3.35
3.65
x
VF BIN CODE
Color BIN CODE
Intensity BIN CODE
Ver.1.1 Page 4 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HG635A-TRB
SINCE 1981
● Reliability Test
Classification
Test Item
Reference Standard
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021
:B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS-C-7021
:B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS-C-7021
:B-10
Storage
Low
:B-12
Temperature JIS-C-7021
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021
:A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS-C-7021
:A-1
Test Conditions
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
Result
0/20
0/20
High Ta=+85℃±5℃
Test time=1,000hrs
0/20
Low Ta=-35℃±5℃
Test time=1,000hrs
0/20
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃±5℃ ~+85℃±5℃
20min
20min
Test Time=10cycle
Preheating:
140℃-160℃,within 2 minutes.
Operation heating:
260℃(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
● Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Note:
Symbol
VF ( V)
IR(uA)
Iv ( mcd )
Measuring conditions
IF=20mA
VR=5V
IF=20mA
1.U means the upper limit of specified characteristics.
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.1.0 Page 5 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HG635A-TRB
SINCE 1981
● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
Temperature
140~160℃
260℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Temperature
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Ver.1.0 Page 6 of 7