BRIGHT BL-XUB361-TR7

BRIGHT LED ELECTRONICS CORP.
LED LAMPS SPECIFICATION
●COMMODITY:AXIAL TYPE LAMP
●DEVICE NUMBER:BL-XUB361-F7
●ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=25℃)
Chip
Emitted
Color
Super Orange Red
PAGE:
REVISION:
Absolute Maximun
Rating
Electro-optical
Data (At 20mA)
Lens
Dominant
Peak
Want
Wave
Vf(V)
Iv(mcd)
Appearance Δλ Pd
If
Peak
Length
Length
(nm) (mW) (mA) If(mA) Typ. Max. Min Typ.
λp (nm) λd(nm)
645
632±5
Water Clear
22
80
30
100
2.1
2
1.1
Viewing
Angle
2θ1/2
(deg)
2.6 42.0 100.0
35
Remark:1.Viewing angle is the Off-axis angle at which the luminous intensity is half the axial luminous intensity.
2.This product doesn’t contain restrictionSubstance, comply ROHS standard.
●ABSOLUTE MAXIMUN RATINGS (Ta=25℃)
Reverse Voltage ………………………………………..……………………………….…..……………………….… 5V
Reverse Current (VR=5V) …………………………………………….………………………………………….. 100µA
Operating Temperature Range ……………………………………………..……….……………..…… -25℃ ~ 80℃
Storage Temperature Range ……………………………………………………………………..…… -30℃ ~ 85℃
Lead Soldering Temperature ………………………………..……………..……………………… 260℃ For 5 Seconds
●PACKAGE DIMENSIONS
NOTES: 1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3.Lead spacing is measured where the leads emerge from the package.
4.Specifications are subject to change without notice.
. BRIGHT LED ELECTRONICS CORP.
LED
LAMP SPECIFICATION
●COMMODITY:AXIAL TYPE LED LAMP
●DEVICE NUMBER:BL-XUB361-F7
PAGE:
REVISION:
3
1.0
BRIGHT LED ELECTRONICS CORP.
AXIAL LED LAMP SPECIFICATION
●COMMODITY:AXIAL TYPE LED LAMP
●DEVICE NUMBER:BL-XUB361-TR7
PAGE:
● TAPPING AND PACKAGING SPECIFICA
4
RERSION: 1.0
SPECIFICATION
ITEM
SYMBOL
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter (DIA)
D0
1.40
0.055
1.55
0.061
Feed Hole Location
E
1.65
0.065
1.85
0.072
Centers Line Dimensions Length Direction
F
5.45
0.215
5.55
0.218
Compartment Depth
K0
3.10
0.122
3.30
0.130
Carrier Tape Overall Thickness
K
3.00
0.118
3.20
0.126
Compartment Pitch
P
3.90
0.153
4.10
0.161
Sprocket Hole Diameter
P0
3.90
0.153
4.10
0.161
Centers Line Dimensions Length Direction
P2
1.95
0.076
2.05
0.080
Carrier Tape Thickness
t
-
-
0.30
0.012
Carrier Tape Width
W
12.00
0.472
12.30
0.484
Flange Diameter
A
178.0
7.008
180.0
7.087
Hub Spindle Hole
C
12.50
0.492
13.50
0.531
Hub Diameter
D2
20.00
0.788
21.50
0.846
Fixing Tape Width
W1
9.00
0.354
9.30
0.366
Flange Space Between Flanges
T
16.00
0.629
17.00
0.669
Compartment Length
A0
2.20
0.087
2.40
0.094
Compartment Width
B0
3.90
0.154
4.10
0.161
e
d
o
n
A
e
d
o
h
t
a
C
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
RELIABILITY TEST
Classification
Test Item
Reference Standard
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS C 7021 :B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS C 7021 :B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS C 7021 :B-10
Storage
Low
Temperature JIS-C-7021 :B-12
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021 :A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS C 7021 :A-1
PAGE:
REVISION:
Test Conditions
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
5
1.0
Result
0/20
0/20
High Ta=+85℃±5℃
Test time=1,000hrs
0/20
Low Ta=-35℃±5℃
Test time=1,000hrs
0/20
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃±5℃ ~+85℃±5℃
20min
20min
Test Time=10cycle
Preheating:
140℃-160℃,within 2 minutes.
Operation heating:
235℃(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY
Measuring items
Forward voltage
Reverse current
Luminous intensity
Note:
Symbol
VF ( V)
Ir(uA)
Iv ( mcd )
Measuring conditions
If=20mA
Vr=5V
If=20mA
1.U means the upper limit of specified characteristics.
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal
ambient conditions after completion of each test.
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
REVISION:
1.
6
1.0
SOLDERING:
● Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
● Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 235℃(MAX.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
TEMPERATURE
140~160℃
235℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
TIME
● DIP soldering (Wave Soldering)
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Soldering heat Max. 260 ℃
TEMPERATURE
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
TIME
2.
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
REVISION:
3.
7
1.0
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
4. Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
5.
Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on
each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx
xx
Year Month
Manufacture Location
xx
Day