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2002 California Micro Devices Corp. All rights reserved.
01/24/02
215 Topaz Street, Milpitas, California 95035
▲ Tel: (408) 263-3214
▲ Fax: (408) 263-7846 ▲
www.calmicro.com
1
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2002 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035 ▲
Tel: (408) 263-3214 ▲ Fax: (408) 263-7846 ▲ www.calmicro.com
01/24/02
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2002 California Micro Devices Corp. All rights reserved.
01/24/02
215 Topaz Street, Milpitas, California 95035
▲ Tel: (408) 263-3214
▲ Fax: (408) 263-7846 ▲
www.calmicro.com
3
!
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Line Regulation with 500mA Load
Load Regulation
1.38
1.36
1.36
1.34
1.34
VOUT [V]
VOUT [V]
1.38
1.32
1.32
1.30
1.30
1.28
1.28
1.26
1.26
1.24
1.24
1.22
2.8
3.0
3.2
1.22
3.6
3.4
0
VCC [V]
400
600
800
Load Current [mA]
1000
Ground Current vs. Output Load
700
700
600
600
Ground Current [uA]
Supply Current [uA]
Supply Current vs. Voltage
200
500
400
300
200
100
500
400
300
200
100
0
0
0
1
2
3
VCC [V]
4
5
0
200
400
600
Load Current [mA]
800
2002 California Micro Devices Corp. All rights reserved.
4
215 Topaz Street, Milpitas, California 95035 ▲
Tel: (408) 263-3214 ▲ Fax: (408) 263-7846 ▲ www.calmicro.com
01/24/02
!$0%
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Cold Start Power-up with Rated Load
Full Power Down with Rated Load
Load Transient Response (50mA to 500mA)
Line Transient Step Response (0.6Vp-p)
2002 California Micro Devices Corp. All rights reserved.
01/24/02
215 Topaz Street, Milpitas, California 95035
▲ Tel: (408) 263-3214
▲ Fax: (408) 263-7846 ▲
www.calmicro.com
5
!$0%
TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA)
Output Voltage with temperature (5mA Load)
1.38
1.36
1.34
VOUT [V]
'(9"0"("#θJ%
" """#,3%"""
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#θJ&% ("("
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0(.5
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0"
0( "(!";
1.32
1.30
1.28
1.26
= TAMB + PD ∗ (θJA)
1.24
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"( 6( "75 (
"θJA"0D0°C/W
1.22
-50
1.35
1.34
1.33
VOUT [V]
= 70°C + .8W ∗ (70°C/W)
= 70°C + 55°C = 125°C
,&*3'("+"
"(("(&* "(
""""
-50
-25
0
25
o
Temperature [ C]
50
75
Ground Current with Temperature (No Load)
700
Ground Current [uA]
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multilayer board construction using only the minimum size
pad layout will typically provide the CM3001 with an
overall θJA of 70°C/W, which allows up to 0.8W to be
dissipated safely.
1.32
1.31
1.30
1.29
1.28
1.27
1.26
1.25
'(("" "
0
"
0
"( !"()
(:3"6(
"7
Measurements showing performance up to a junction
temperature of 125°C are presented in >" They
were performed under light load conditions (5mA); this
allows the ambient temperature to be representative of
the internal junction temperature.
150
Output Voltage with temperature (500mA Load)
Based on a power dissipation of .8W (Load x Vin-Vout =
.4A x [3.3V-1.3V]) with an ambient of 70°C, the resulting junction temperature will be:
TJUNC = TAMB + PD ∗ (θJA)
0
50
100
o
Temperature [ C]
600
500
400
300
200
100
0
-50
0
50
100
o
Temperature [ C]
150
1
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2002 California Micro Devices Corp. All rights reserved.
6
215 Topaz Street, Milpitas, California 95035 ▲
Tel: (408) 263-3214 ▲ Fax: (408) 263-7846 ▲ www.calmicro.com
01/24/02
234
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2002 California Micro Devices Corp. All rights reserved.
01/24/02
215 Topaz Street, Milpitas, California 95035
▲ Tel: (408) 263-3214
▲ Fax: (408) 263-7846 ▲
www.calmicro.com
7