CSPRC032A 4 Channel EMI Filter Network Features Product Description • • • • The CSPRC032A is a 4-channel low pass EMI filter (RC-R configuration) in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California Micro Devices’ unique thin film technology provides a minimum of –25dB of attenuation over this frequency band. • • • 4 EMI filter lines per device Filters attenuate to –30dB at 3GHz CSP package minimizes cross-talk 9-bump 2.485mm X 0.985mm Chip Scale Package (CSP), 0.5mm pitch 0.30mm Eutectic solder bumps Ultra small footprint suitable for portable devices Lead-free version available Applications • • • • • • EMI filtering for RF sections of wireless devices Cellular phones Cordless phones Internet appliances PDAs Laptop computers The bump size and pitch of these filters are selected such that the device can be placed directly on an FR4 printed circuit board using conventional assembly techniques. The pin-out for the device features a signal ‘flow through’ design, allowing optimal signal routing. The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/ Ag/Cu for lead-free finish) and are 0.30 mm in diameter. The CSPRC032A is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. Electrical Schematic A1 50Ω 50Ω R A2 50Ω C R 43pF GND R 50Ω 50Ω GND B3 50Ω 50Ω B4 C R 43pF R A5 B2 C R 43pF GND A4 B1 GND R 50Ω B5 C R 43pF GND © 2005 California Micro Devices Corp. All rights reserved. 11/09/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CSPRC032A PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 Orientation Marking 5 A A 032A B A5 A4 B5 B4 B3 A2 A1 B2 B1 CSPRC032A CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 9 CSP CSPRC032A 032A CSPRC032AG 032A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -55 to +150 °C 25 mW RATING UNITS -40 to +85 °C Power Rating per Resistor STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/09/05 CSPRC032A ELECTRICAL OPERATING CHARACTERISTICS(NOTE 1) SYMBOL ILEAK PARAMETER CONDITIONS Leakage Current, An or Bn to GND VIN=6.0V MIN TYP MAX UNITS 1 µA R Resistance 45 50 55 Ω C Capacitance 34 43 52 pF TOLR Resistor Absolute Tolerance R = 50Ω +10 % TOLC Capacitor Absolute Tolerance C=43pF +20 % TCR Temperature Coefficient of Resistance Note 2 +150 ppm/°C TCC Temperature Coefficient of Capacitance Note 2 +500 ppm/°C Filter Cutoff Frequency ZSOURCE=0Ω, ZLOAD=∞ ZSOURCE=50Ω, ZLOAD=50Ω R=50Ω, C=43pF; FC 74 82 MHz MHz Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified. Note 2: Parameters guaranteed by design or characterization. Filter Performance CSPRC032 Filter Typical Measured Frequency Response (S21) Measurement The measurement is done with 50Ω-source and 50Ω-load impedance using a HP8753C Network Analyzer with a HP85047A S-parameter Test Set. © 2005 California Micro Devices Corp. All rights reserved. 11/09/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CSPRC032A Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/09/05 CSPRC032A Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams The CSPRC032A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s Chip Scale Packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 Custom CSP Bumps 9 3 Inches Min Nom Max A1 0.940 0.985 1.030 0.0370 0.0388 0.0406 A2 2.440 2.485 2.530 0.0961 0.0978 0.0996 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115 C2 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115 D1 0.561 0.605 0.649 0.0221 0.0238 0.0256 D2 0.355 0.380 0.405 0.0140 0.0150 0.0160 # per tape and reel Min Nom 2 Max A2 Millimeters 4 B A B A C2 Dim B2 5 PACKAGE DIMENSIONS Package SIDE VIEW C1 B1 1 D1 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPRC032A 9-bump Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER PKG. SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CSPRC032A 2.485 X 0.985 X 0.605 2.62 X 1.12 X 0.762 TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 4. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 11/09/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5