3 V, SUPER MINIMOLD UPC2762TB MEDIUM POWER SI MMIC AMPLIFIER FEATURES INSERTION POWER GAIN vs. FREQUENCY AND TEMPERATURE • WIDE BANDWIDTH: 2.9 GHz at -3 dB • SUPER SMALL PACKAGE: SOT-363 package • TAPE AND REEL PACKAGING OPTION AVAILABLE DESCRIPTION NEC's UPC2762TB is a Silicon Monolithic integrated circuit which is manufactured using the NESAT™ III process. The NESAT™ III process produces transistors with fT approaching 20 GHz. The UPC2762TB is pin compatible and has comparable performance to the larger UPC2762T, so it is suitable for use as a replacement to help reduce system size. The IC is housed in a 6 pin super minimold or SOT-363 package. Operating on a 3 volt supply, this IC is ideally suited for handheld, portable designs. Insertion Power Gain, GP (dB) 18 • HIGH P1dB: 7 dBm TYP at 1.9 GHz • LOW VOLTAGE: 3.0 V TYP, 2.7 V MIN 16 TA = +85°C 14 TA = +25°C 12 TA = -40°C 10 VCC = 3.0 V 8 0.1 0.3 1.0 3.0 Frequency, f (MHz) NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25°C, ZL = ZS = 50Ω, VCC = 3.0 V) PART NUMBER PACKAGE OUTLINE SYMBOLS PARAMETERS AND CONDITIONS UPC2762TB S06 UNITS MIN TYP MAX ICC Circuit Current (no signal) mA 27 35 GS Small Signal Gain, dB dB 11 11.5 13 15.5 16 17.5 fU Upper Limit Operating Frequency (The gain at fu is 3 dB down from the gain at 0.1 GHz) GHz 2.7 2.9 P1dB Output Power at 1 dB Compression Point, f = 900 MHz f = 1900 MHz dBm dBm +5.5 +4.5 +8 +7 PSAT Saturated Output Power, f = 900 MHz f = 1900 MHz dBm dBm 9 8.5 6.5 7 NF f = 900 MHz f = 1900 MHz Noise Figure, f = 900 MHz f = 1900 MHz dB dB Input Return Loss, f = 900 MHz f = 1900 MHz dB dB 6 5.5 9 8.5 RLOUT Output Return Loss, f = 900 MHz f = 1900 MHz dB dB 8 9 11 12 ISOL Isolation, f = 900 MHz f = 1900 MHz dB dB 22 20 27 25 OIP3 SSB Output Third Order Intercept Point RLIN POUT = +4 dBm PADJ Adjacent Channel Power, f = 900 MHz, π/4 QPSK wave1, PO = +4 dBm f = 900, 902 MHz f = 1900, 1902 MHz dBm dBm +12 +9 ∆f = ±50 KHz ∆f = ±100 KHz dBc dBc -64 -64 Note: 1. π/4 QPSK modulated wave input, data rate 42 kbps. 8.0 9.0 California Eastern Laboratories UPC2762TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS PARAMETERS VCC Supply Voltage UNITS RATINGS SYMBOLS PARAMETERS V 3.6 VCC Supply Voltage V 2.7 3 3.3 TOP Operating Temperature °C -40 25 85 ICC Total Supply Current mA 70 PIN Input Power dBm +10 mW 200 Dissipation2 RECOMMENDED OPERATING CONDITIONS UNITS MIN TYP MAX TEST CIRCUIT PT Total Power TOP Operating Temperature °C -40 to +85 TSTG Storage Temperature °C -55 to +150 VCC Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = 85°C). 1000 pF L = 300 nH 6 50 Ω IN 50 Ω 4 1 OUT 1000 pF 1000 pF 2, 3, 5 TYPICAL PERFORMANCE CURVES (TA = 25°C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE CIRCUIT CURRENT vs. OPERATING TEMPERATURE 50 50 No signal VCC = 3.0 V Circuit Current, ICC (mA) Circuit Current, ICC (mA) 40 30 20 10 40 30 20 10 0 0 0 2 1 3 -60 4 -40 -20 0 20 40 60 80 Supply Voltage, VCC (V) Operating Temperature, TOP (°C) NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY AND VOLTAGE INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY 100 0 20 VCC = 3.0V 18 VCC = 3.3 V VCC = 3.0 V GS 12 10 10 VCC = 3.3 V 8 8 NF 6 6 VCC = 3.0 V VCC = 2.7 V 4 4 2 2 0.1 0.3 1.0 Frequency, f (GHz) 3.0 Return Loss (dB) -10 VCC = 2.7 V Noise Figure, NF (dB) Gain, GS (dB) 16 14 RLin RLout -20 -30 -40 0.1 0.3 1.0 Frequency, f (GHz) 3.0 UPC2762TB TYPICAL PERFORMANCE CURVES (TA = 25°C) OUTPUT POWER vs. INPUT POWER AND VOLTAGE ISOLATION vs. FREQUENCY 10 15 VCC = 3.0V VCC = 3.0V f = 0.9 GHZ Output Power, POUT (dBm) Isolation, ISOL (dB) 0 -10 -20 -30 -40 0.1 0.3 1.0 VCC = 3.3V 5 VCC = 2.7V 0 -5 -10 -20 3.0 0 -5 OUTPUT POWER vs. INPUT POWER AND TEMPERATURE OUTPUT POWER vs. INPUT POWER AND VOLTAGE +5 +15 VCC = 3.3 V VCC = 3.0 V f = 1.9 GHz 5 Output Power, POUT (dBm) 10 VCC = 2.7 V 0 -5 -10 -20 -15 -10 -5 0 VCC = 3.3 V +5 VCC = 2.7 V 0 -5 -10 -20 +5 VCC = 3.0 V +10 Input Power, PIN (dBm) -15 -10 -5 0 +5 Input Power, PIN (dBm) SATURATED OUTPUT POWER vs. FREQUENCY OUTPUT POWER vs. INPUT POWER AND TEMPERATURE +15 TA = +85°C TA = +25°C +10 +5 TA = -40°C 0 -5 -20 -15 -10 -5 Input Power, PIN (dBm) 0 +5 Saturated Output Power, PO(SAT) (dBm) +13 f = 1.9 GHz VCC = 3.0 V Output Power, POUT (dBm) -10 Input Power, PIN (dBm) f = 0.9 GHz VCC = 3.0 V -10 -15 Frequency, f (GHz) 15 Output Power, POUT (dBm) 10 PIN = +3 dBm VCC = 3.3 V +11 VCC = 3.0 V +9 VCC = 2.7 V +7 +5 +3 0.1 0.3 1.0 Frequency, f (GHz) 3.0 UPC2762TB TYPICAL PERFORMANCE CURVES (TA = 25°C) SATURATED OUTPUT POWER vs. FREQUENCY AND TEMPERATURE 13 Output Power, PO (SAT) (dBm) PIN = +3 dBm TA = +25°C 11 TA = +85°C 9 TA = -40°C 7 5 3 0.1 0.3 1.0 3.0 Frequency, f (GHz) Third Order Intermodulation Distortion, IM3 (dBc) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE -60 f1 = 1.900 GHz f2 = 1.902 GHz -50 VCC = 3.3 V -40 VCC = 3.3 V -30 VCC = 3.3 V -20 -10 0 -15 -10 -5 0 +5 10 Output Power of Each Tone, PO (EACH) (dBm) Third Order Intermodulation Distortion, IM3 (dBc) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE -60 f1 = 0.900 GHz f2 = 0.902 GHz -50 VCC = 3.3 V -40 VCC = 3.3 V -30 VCC = 3.3 V -20 -10 0 -15 -10 -5 0 +5 +10 Output Power of Each Tone, PO (EACH) (dBm) UPC2762TB TYPICAL SCATTERING PARAMETERS (TA = +25°C, VCC = VOUT = 3.0 V) 3.0 GHz 0.1 GHz 0.1 GHz 2.0 GHz 3.0 GHz 2.0 GHz 1.0 GHz S22 S11 VCC = VOUT = 3.0 V, ICC = 29 mA FREQUENCY S11 S21 S12 S22 K GHz MAG ANG MAG ANG MAG ANG MAG ANG 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 0.338 0.346 0.348 0.340 0.329 0.324 0.341 0.359 0.378 0.375 0.363 0.353 0.357 0.377 0.402 0.414 0.426 0.434 0.448 0.463 0.483 0.492 0.492 0.486 0.489 0.500 0.511 0.511 0.494 0.465 0.441 -1.3 -2.0 -1.2 -1.9 -3.1 -6.2 -8.1 -7.6 -6.5 -5.1 -5.2 -6.7 -8.8 -11.7 -12.7 -13.2 -13.6 -16.1 -19.0 -21.7 -23.9 -25.8 -29.7 -34.6 -40.4 -44.6 -48.5 -50.4 -52.9 -55.9 -60.6 4.560 4.581 4.616 4.661 4.689 4.726 4.844 4.927 5.057 5.179 5.306 5.400 5.567 5.706 5.820 5.987 6.081 6.182 6.229 6.328 6.382 6.431 6.424 6.329 6.146 5.997 5.822 5.693 5.553 5.334 5.157 -3.4 -7.6 -11.3 -15.8 -19.5 -23.6 -27.4 -31.5 -35.8 -41.0 -45.9 -51.0 -56.5 -61.7 -68.0 -73.7 -80.1 -86.7 -93.2 -99.7 -106.7 -113.8 -121.2 -128.8 -136.1 -143.1 -149.9 -157.0 -163.0 -169.5 -175.5 0.039 0.039 0.039 0.040 0.040 0.041 0.042 0.043 0.044 0.045 0.047 0.047 0.048 0.049 0.052 0.052 0.055 0.056 0.057 0.057 0.058 0.058 0.060 0.060 0.062 0.061 0.064 0.066 0.065 0.065 0.066 1.0 2.7 6.8 8.1 11.6 13.7 15.8 18.1 19.3 20.3 22.1 23.7 26.1 24.5 26.7 26.8 29.0 28.2 28.5 28.0 28.5 29.0 30.1 30.2 31.1 32.1 31.4 34.0 33.8 35.5 35.5 0.310 0.311 0.302 0.296 0.290 0.292 0.291 0.292 0.284 0.280 0.285 0.288 0.288 0.285 0.282 0.285 0.288 0.291 0.286 0.282 0.282 0.282 0.278 0.268 0.260 0.251 0.248 0.237 0.222 0.203 0.189 -5.5 -9.5 -12.3 -16.2 -20.2 -24.1 -26.2 -28.3 -30.9 -35.3 -40.0 -43.4 -45.7 -47.9 -52.8 -58.1 -62.0 -66.1 -70.4 -76.2 -81.5 -86.9 -91.7 -98.4 -104.5 -111.3 -116.7 -121.5 -128.3 -134.5 -141.1 2.23 2.20 2.20 2.18 2.20 2.12 2.01 1.90 1.77 1.72 1.64 1.62 1.54 1.44 1.32 1.27 1.18 1.14 1.09 1.07 1.01 0.99 0.99 1.01 1.02 1.05 1.03 1.04 1.11 1.20 1.27 UPC2762TB OUTLINE DIMENSIONS (Units in mm) LEAD CONNECTIONS (Top View) PACKAGE OUTLINE S06 (Bottom View) 3 1.25±0.1 0.2 +0.1 -0 2.0±0.2 0.65 3 4 0.65 2 5 1 6 2 1.3 1 DOT ON BACK SIDE 0.9 ± 0.1 0.7 1. 2. 3. 4. 5. 6. C1Z 2.1±0.1 4 4 3 5 5 2 6 6 1 INPUT GND GND OUTPUT GND VCC +0.1 0.15 -0.5 0 ~0.1 PIN DESCRIPTIONS Pin No. Pin Name Applied Voltage (V) 1 Input – Internal Equivalent Circuit Description Signal input pin. An internal matching circuit, configured with resistors, enables 50 Ω connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to the signal source with a blocking capacitor. 4 Output Signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. 6 VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. 2 3 5 GND 0 Ground pins. These pins should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. 6 4 1 3 2 5 ORDERING INFORMATION PART NUMBER UPC2762TB-E3-A QTY 3K/Reel Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated side of tape. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/12/2000 DATA SUBJECT TO CHANGE WITHOUT NOTICE 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. 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