CEL UPG2012TK-E2-A

NEC's ¼ W SINGLE CONTROL
UPG2012TK
L, S-BAND SPDT SWITCH
FEATURES
DESCRIPTION
• SUPPLY VOLTAGE:
VDD = 2.7 to 3.0 V (2.8 V TYP.)
NEC's UPG2012TK is a single control GaAs MMIC for
L, S-band SPDT (Single Pole Double Throw) switch for
mobile phone and L, S-band applications.
• SINGLE SWITCH CONTROL VOLTAGE:
Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.)
Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
This device can operate frequency from 0.5 GHz to 2.5
GHz, with low insertion loss and high isolation.
• LOW INSERTION LOSS:
LINS1 = 0.27 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
LINS3 = 0.30 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
(Reference value)
• HIGH ISOLATION:
ISL1 = 30 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
ISL2 = 30 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
(Reference value)
This device is housed in a 6-pin lead-less minimold package suitable for high-density surface mounting.
APPLICATIONS
• L, S-band digital cellular or cordless handsets
• BluetoothTM , W-LAN and WLL
• Short Range Wireless
• HIGH-DENSITY SURFACE MOUNTING:
6-pin lead-less minimold package
ORDERING INFORMATION
Part Number
Package
Marking
UPG2012TK-E2-A
6-pin lead-less minimold
(1511)
G3H
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG2012TK
Caution
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
UPG2012TK
PIN CONNECTIONS
(Top View)
2
3
6
G3H
1
(Top View)
(Bottom View)
1
5
6
2
4
6
5
3
1
5
4
2
4
3
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont
5
INPUT
6
VDD
TRUTH TABLE
Vcont
INPUT−OUTPUT1
INPUT−OUTPUT2
Low
OFF
ON
High
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VDD
+6.0
V
Switch Control Voltage
Vcont
+6.0
V
Input Power
Pin
+26
dBm
Power Dissipation
PD
150 Note
mW
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
RECOMMENDED OPERATING RANGE (TA = 25°C)
Parameter
Supply Voltage
Symbol
MIN.
TYP.
MAX.
Unit
VDD
2.7
2.8
3.0
V
Switch Control Voltage (H)
Vcont(H)
2.7
2.8
3.0
V
Switch Control Voltage (L)
Vcont(L)
−0.2
0
0.2
V
UPG2012TK
ELECTRICAL CHARACTERISTICS
(TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss1
LINS1
f = 0.5 to 1.0 GHz
−
0.27
0.50
dB
Insertion Loss2
LINS2
f = 2.0 GHz
−
0.30
0.50
dB
Isolation1
ISL1
f = 0.5 to 2.0 GHz
24
30
−
dB
Input Return Loss
RLin
f = 0.5 to 2.5 GHz
15
20
−
dB
Output Return Loss
RLout
f = 0.5 to 2.5 GHz
15
20
−
dB
+17.5
+20.5
−
dBm
0.1 dB Gain Compression
Input Power Note
Pin(0.1 dB)
f = 2.0 GHz
Supply Current
IDD
−
50
100
μA
Switching Control Current
Icont
−
4
20
μA
Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear
range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, VDD = 2.8 V,Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss3
LINS3
f = 2.5 GHz
−
0.30
−
dB
Isolation2
ISL2
f = 2.5 GHz
−
30
−
dB
1 dB Gain Compression
Input Power Note
Pin(1 dB)
f = 2.0 GHz
−
+24.0
−
dBm
Switching Control Speed
tSW
−
300
−
ns
Note Pin (1dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear
range.
Caution
It is necessary to use DC blocking capacitors with the device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching
speed and the condition with the actual board of the system. The range of recommended DC blocking capacitor value is
less than 100 pF.
UPG2012TK
EVALUATION CIRCUIT
(VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF)
VDD
INPUT
Vcont
56 pF
1 000 pF
1 000 pF
6
5
4
1
2
3
56 pF
OUTPUT1
56 pF
OUTPUT2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
UPG2012TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont
6pin L2MM SPDT SW
Vc1
OUTPUT2
C2
C
2
C
4
OUT 1
INPUT
G3H
C1
C3
C1
IN
C
C
5
C2
C1
1
OUT 2
OUTPUT1
Vc2
VDD
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
56 pF
1 000 pF
UPG2012TK
PACKAGE DIMENSIONS
0.48±0.05 0.48±0.05
6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
Remark ( ): Reference value
UPG2012TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 120°C or below
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
08/30/2004
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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