NEC's ¼ W SINGLE CONTROL UPG2012TK L, S-BAND SPDT SWITCH FEATURES DESCRIPTION • SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.) NEC's UPG2012TK is a single control GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and L, S-band applications. • SINGLE SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) This device can operate frequency from 0.5 GHz to 2.5 GHz, with low insertion loss and high isolation. • LOW INSERTION LOSS: LINS1 = 0.27 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS3 = 0.30 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • HIGH ISOLATION: ISL1 = 30 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V ISL2 = 30 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) This device is housed in a 6-pin lead-less minimold package suitable for high-density surface mounting. APPLICATIONS • L, S-band digital cellular or cordless handsets • BluetoothTM , W-LAN and WLL • Short Range Wireless • HIGH-DENSITY SURFACE MOUNTING: 6-pin lead-less minimold package ORDERING INFORMATION Part Number Package Marking UPG2012TK-E2-A 6-pin lead-less minimold (1511) G3H Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales ofﬁce. Part number for sample order: UPG2012TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2012TK PIN CONNECTIONS (Top View) 2 3 6 G3H 1 (Top View) (Bottom View) 1 5 6 2 4 6 5 3 1 5 4 2 4 3 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 Vcont 5 INPUT 6 VDD TRUTH TABLE Vcont INPUT−OUTPUT1 INPUT−OUTPUT2 Low OFF ON High ON OFF ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise speciﬁed) Parameter Symbol Ratings Unit Supply Voltage VDD +6.0 V Switch Control Voltage Vcont +6.0 V Input Power Pin +26 dBm Power Dissipation PD 150 Note mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = 25°C) Parameter Supply Voltage Symbol MIN. TYP. MAX. Unit VDD 2.7 2.8 3.0 V Switch Control Voltage (H) Vcont(H) 2.7 2.8 3.0 V Switch Control Voltage (L) Vcont(L) −0.2 0 0.2 V UPG2012TK ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise speciﬁed) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss1 LINS1 f = 0.5 to 1.0 GHz − 0.27 0.50 dB Insertion Loss2 LINS2 f = 2.0 GHz − 0.30 0.50 dB Isolation1 ISL1 f = 0.5 to 2.0 GHz 24 30 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 − dB +17.5 +20.5 − dBm 0.1 dB Gain Compression Input Power Note Pin(0.1 dB) f = 2.0 GHz Supply Current IDD − 50 100 μA Switching Control Current Icont − 4 20 μA Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VDD = 2.8 V,Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise speciﬁed) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss3 LINS3 f = 2.5 GHz − 0.30 − dB Isolation2 ISL2 f = 2.5 GHz − 30 − dB 1 dB Gain Compression Input Power Note Pin(1 dB) f = 2.0 GHz − +24.0 − dBm Switching Control Speed tSW − 300 − ns Note Pin (1dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of the system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2012TK EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) VDD INPUT Vcont 56 pF 1 000 pF 1 000 pF 6 5 4 1 2 3 56 pF OUTPUT1 56 pF OUTPUT2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. UPG2012TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont 6pin L2MM SPDT SW Vc1 OUTPUT2 C2 C 2 C 4 OUT 1 INPUT G3H C1 C3 C1 IN C C 5 C2 C1 1 OUT 2 OUTPUT1 Vc2 VDD USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF UPG2012TK PACKAGE DIMENSIONS 0.48±0.05 0.48±0.05 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) Remark ( ): Reference value UPG2012TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales ofﬁce. Soldering Method Soldering Conditions Condition Symbol Infrared Reﬂow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reﬂow processes Maximum chlorine content of rosin ﬂux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reﬂow processes Maximum chlorine content of rosin ﬂux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of ﬂow processes Maximum chlorine content of rosin ﬂux (% mass) : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin ﬂux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 08/30/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. 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Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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