GaAs INTEGRATED CIRCUIT µPG2310TK GaAs MMIC LOW NOISE AMPLIFIER FOR SATELLITE RADIO DESCRIPTION The µPG2310TK is a GaAs MMIC LNA for SDARS (Satellite Digital Audio Radio Services). High Gain and Low Distortion suit to driver stage amplifier for Satellite Radio Antenna. FEATURES • High gain : GP = 27.0 dB TYP. • Low distortion : OIP3 = +28.5 dBm TYP. • 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) APPLICATION • Satellite Radio Antenna etc. ORDERING INFORMATION Part Number µPG2310TK-E2 Order Number µPG2310TK-E2-A Package Marking 6-pin lead-less minimold (1511 PKG) (Pb-Free) G4W Supplying Form • Embossed tape 8 mm wide Note • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2310TK-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PG10576EJ01V0DS (1st edition) Date Published August 2005 CP(K) µPG2310TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 3 G4W 1 (Top View) Pin No. Pin Name 1 VCC2/OUT 2 GND 3 VCC1 4 IN 5 GND 6 GND (Bottom View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Supply Voltage Input Power Symbol Ratings Unit VCC1, VCC2 +5.0 V Pin −10 dBm 300 Note Total Power Dissipation Ptot mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE Parameter Operating Frequency Supply Voltage Operating Ambient Temperature 2 Symbol MIN. TYP. MAX. Unit fopt 2 320 2 340 2 360 MHz VCC1, VCC2 +2.7 +3.0 +3.3 V TA −45 +25 +85 °C Data Sheet PG10576EJ01V0DS µPG2310TK ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC1 = VCC2 = +3.0 V, ZO = 50 Ω, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 25.0 27.0 − dB Power Gain GP f = 2 340 MHz, Pin = −30 dBm Noise Figure NF f = 2 340 MHz − 1.8 2.0 dB Input Return Loss RLin f = 2 340 MHz, Pin = −30 dBm − 13 − dB Output Return Loss RLout f = 2 340 MHz, Pin = −30 dBm − 15 − dB Output 3rd Order Distortion OIP3 f1 = 2 340 MHz, f2 = 2 340.1 MHz +26.5 +28.5 − dBm ICC f = 2 340 MHz, Pin = −30 dBm − 30 35 mA Intercept Point Circuit Current Note Note Please refer to following chart. CIRCUIT CURRENT vs. SUPPLY VOLTAGE Circuit Current ICC (mA) 40 35 30 25 20 15 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 Supply Voltage VCC (V) Remark The graph indicates nominal characteristics. Data Sheet PG10576EJ01V0DS 3 µPG2310TK TEST CIRCUIT C2 0.1 µ F 3 4 IN VCC1 L1 2.2 nH VCC2 2 5 L3 68 nH GND 6 C3 0.1 µ F 1 GND OUT C1 5.0 pF GND L2 3.3 nH The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10576EJ01V0DS µPG2310TK OUTPUT POWER (2 tones), IM3 (2 tones), ICC vs. INPUT POWER (2 tones) 40 39 30 38 20 10 37 Pout 36 0 35 IM3 –10 34 –20 33 –30 32 –40 31 ICC –50 –60 –70 –30 –20 30 VCC1 = VCC2 = +3.0 V 29 f1 = 2 340 MHz f2 = 2 340.1 MHz 28 –10 0 10 Circuit Current ICC (mA) Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion (2 tones) IM3 (dBm) TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) Input Power (2 tones) Pin (dBm) Remark The graph indicates nominal characteristics. Data Sheet PG10576EJ01V0DS 5 µPG2310TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) (Bottom View) 0.16±0.05 1.5±0.1 0.48±0.05 0.48±0.05 (Top View) 1.1±0.1 0.2±0.1 6 0.11+0.1 –0.05 0.55±0.03 1.3±0.05 Data Sheet PG10576EJ01V0DS 0.9±0.1 µPG2310TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10576EJ01V0DS 7 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. 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