CIRRUS CS4412A-CNZ

CS4412A
30 W Quad Half-Bridge Digital Amplifier Power Stage
Features
Common Applications
 Configurable Outputs (10% THD+N)
 Integrated Digital Televisions
–
–
–
–
2 x 15 W into 8 Ω, Full-Bridge
1 x 30 W into 4 Ω, Parallel Full-Bridge
4 x 7 W into 4 Ω, Half-Bridge
2 x 7 W into 4 Ω, Half-Bridge + 1 x 15 W
into 8 Ω, Full-Bridge
 Space-Efficient Thermally-Enhanced QFN
–
No External Heat Sink Required
 > 100 dB Dynamic Range - System Level
 < 0.1% THD+N @ 1 W - System Level
 Built-In Protection with Error Reporting
–
–
–
Over-Current
Thermal Warning and Overload
Under-Voltage
 +8 V to +18 V High Voltage Supply
 PWM Popguard® for Quiet Startup
 No Bootstrap Required
 Portable Media Player Docking Stations
 Mini/Micro Shelf Systems
 Powered Desktop Speakers
General Description
The CS4412A is a high-efficiency power stage for digital
Class-D amplifiers designed to input PWM signals from
a modulator such as the CS4525. The power stage outputs can be configured as four half-bridge channels, two
half-bridge channels and one full-bridge channel, two
full-bridge channels, or one parallel full-bridge channel.
The CS4412A integrates on-chip over-current, undervoltage, over-temperature protection and error reporting as well as a thermal warning indicator. The low
RDS(ON) outputs can source up to 2.5 A peak current,
delivering high efficiency which allows small device
package and lower power supplies.
The CS4412A is available in a 48-pin QFN package in
Commercial grade (-10 to +70° C). The CRD4412A customer reference design is also available. Please refer to
“Ordering Information” on page 24 for complete ordering information.
 Low Quiescent Current
 Low Power Standby Mode
2.5 V to 5 V
8 V to 18 V
VP
Non-Overlap
Time Insertion
Gate
Drive
Amplifier
Out 1
Non-Overlap
Time Insertion
Gate
Drive
Amplifier
Out 2
In 1
In 2
In 3
In 4
Mode
Configuration
Reset
Hardware
Configuration
Control Logic
Non-Overlap
Time Insertion
Gate
Drive
Amplifier
Out 3
Current &
Thermal Data
Protection &
Error Reporting
Non-Overlap
Time Insertion
Gate
Drive
Amplifier
Out 4
PGND
Advance Product Information
http://www.cirrus.com
This document contains information for a new product.
Cirrus Logic reserves the right to modify this product without notice.
Copyright © Cirrus Logic, Inc. 2007
(All Rights Reserved)
MAY '07
DS786A1
CS4412A
TABLE OF CONTENTS
1. PIN DESCRIPTION ................................................................................................................................. 3
2. CHARACTERISTICS AND SPECIFICATIONS ...................................................................................... 5
RECOMMENDED OPERATING CONDITIONS .................................................................................... 5
ABSOLUTE MAXIMUM RATINGS ........................................................................................................ 5
PWM POWER OUTPUT CHARACTERISTICS ..................................................................................... 6
DC ELECTRICAL CHARACTERISTICS ................................................................................................ 7
DIGITAL INTERFACE SPECIFICATIONS ............................................................................................. 7
DIGITAL I/O PIN CHARACTERISTICS ................................................................................................. 8
3. TYPICAL CONNECTION DIAGRAMS ................................................................................................. 9
4. APPLICATIONS ................................................................................................................................... 13
4.1 Overview ........................................................................................................................................ 13
4.2 Reset and Power-Up ...................................................................................................................... 13
4.2.1 PWM Popguard Transient Control ........................................................................................ 13
4.2.2 Initial Pulse Edge Delay ........................................................................................................ 14
4.2.3 Recommended Power-Up Sequence .................................................................................... 14
4.2.4 Recommended Power-Down Sequence ............................................................................... 14
4.3 Output Mode Configuration ............................................................................................................ 15
4.4 Output Filters ................................................................................................................................. 16
4.4.1 Half-Bridge Output Filter ........................................................................................................ 16
4.4.2 Full-Bridge Output Filter (Stereo or Parallel) ......................................................................... 18
4.5 Device Protection and Error Reporting .......................................................................................... 19
4.5.1 Over-Current Protection ........................................................................................................ 19
4.5.2 Thermal Warning, Thermal Error, and Under-Voltage Error ................................................. 19
5. POWER SUPPLY, GROUNDING, AND PCB LAYOUT ....................................................................... 20
5.1 Power Supply and Grounding ........................................................................................................ 20
5.1.1 Integrated VD Regulator ........................................................................................................ 20
5.2 QFN Thermal Pad .......................................................................................................................... 20
6. PARAMETER DEFINITIONS ................................................................................................................ 21
7. PACKAGE DIMENSIONS .................................................................................................................... 22
8. THERMAL CHARACTERISTICS ......................................................................................................... 23
8.1 Thermal Flag .................................................................................................................................. 23
9. ORDERING INFORMATION ................................................................................................................ 24
10. REVISION HISTORY .......................................................................................................................... 24
LIST OF FIGURES
Figure 1.Stereo Full-Bridge Typical Connection Diagram ........................................................................... 9
Figure 2.2.1 Channel Typical Connection Diagram .................................................................................. 10
Figure 3.4 Channel Half-Bridge Typical Connection Diagram .................................................................. 11
Figure 4.Parallel Full-Bridge Typical Connection Diagram ....................................................................... 12
Figure 5.Output Filter - Half-Bridge ........................................................................................................... 16
Figure 6.Output Filter - Full-Bridge ............................................................................................................ 18
LIST OF TABLES
Table 1. I/O Power Rails ............................................................................................................................. 8
Table 2. Typical Ramp Times for Typical VP Voltages ............................................................................. 13
Table 3. Output Mode Configuration Options ............................................................................................ 15
Table 4. Low-Pass Filter Components - Half-Bridge ................................................................................. 16
Table 5. DC-Blocking Capacitors Values - Half-Bridge ............................................................................. 17
Table 6. Low-Pass Filter Components - Full-Bridge ................................................................................. 18
Table 7. Over-current Error Conditions ..................................................................................................... 19
Table 8. Thermal and Under-Voltage Error Conditions ............................................................................. 19
Table 9. Power Supply Configuration and Settings ................................................................................... 20
2
DS786A1
CS4412A
Pin Name
ERROC12
ERRUVTE
44
43
42
PGND
ERROC34
45
PGND
RAMP
46
PGND
RST34
47
PGND
GND
48
TWR
GND
1. PIN DESCRIPTION
41
40
39
38
37
CNFG0
1
36
VP
CNFG1
2
35
OUT1
CNFG2
3
34
PGND
IN1
4
33
PGND
IN2
5
32
OUT2
IN3
6
31
VP
IN4
7
30
VP
RST12
8
29
OUT3
LVD
9
28
PGND
GND
10
27
PGND
VD_REG
11
26
OUT4
VD
12
25
VP
Thermal Pad
18
19
GND
GND
GND
GND
GND
GND
20
21
22
23
24
PGND
17
RAMP_CAP
16
PGND
15
OCREF
14
GND
13
GND
Top-Down (Through Package) View
48-Pin QFN Package
Pin #
Pin Description
CNFG0
CNFG1
CNFG2
1
2
3
Out Configuration Select (Input) - Used to set the PWM output configuration mode. See “Output
Mode Configuration” on page 15.
IN1
IN2
IN3
IN4
4
5
6
7
PWM Input (Input) - Logic-level switching inputs from a PWM modulator.
RST12
RST34
8
46
Reset Input (Input) - Reset inputs for channels 1/2 and 3/4 respectively. Active low.
LVD
9
VD Voltage Level Indicator (Input) - Identifies the voltage level attached to VD. When applying
5.0 V to VD, LVD must be connected to VD. When applying 2.5 V or 3.3 V to VD, LVD must be
GND.
VD_REG
11
Core Digital Power (Output) - Internally generated low voltage power supply for digital logic.
VD
12
Digital Power (Input) - Positive power supply for the internal regulators and digital I/O.
OCREF
21
Over-current Reference (Input) - Sets over-current trigger level. Connect pin through a resistor
to GND. See “Device Protection and Error Reporting” on page 19. This pins should not be left
floating.
DS786A1
3
CS4412A
Pin Name
RAMP_CAP
Pin #
Pin Description
24
Output Ramp Capacitor (Input) - Used by the PWM PopGuard Transient Control to suppress the
initial pop in half-bridge-configured outputs.
GND
10,13
14,15
16,17
18,19
20,47
48
Ground (Input) - Ground for the internal logic and I/O. These pins should be connected to the
common system ground.
VP
25,30
31,36
High Voltage Output Power (Input) - High voltage power supply for the individual output power
half-bridge devices.
PGND
22,23
27,28
33,34
37,38
39,40
Power Ground (Input) - Ground for the individual output power half-bridge devices. These pins
should be connected to the common system ground.
OUT4
OUT3
OUT2
OUT1
26
29
32
35
PWM Output (Output) - Amplified PWM power outputs.
TWR
41
Thermal Warning Output (Output) - Thermal warning output. Open drain, active low. See
“Device Protection and Error Reporting” on page 19.
ERRUVTE
42
Thermal and Under-voltage Error Output (Output) - Error flag for thermal shutdown and undervoltage. Open drain, active low. See “Device Protection and Error Reporting” on page 19
ERROC12
ERROC34
43
44
Over-current Error Output (Output) - Over-current error flag for the associated outputs. Open
drain, active low. See “Device Protection and Error Reporting” on page 19.
RAMP
45
Ramp-up/down Select (Input) - Set high to enable ramping. When set low, ramping is disabled.
See “PWM Popguard Transient Control” on page 13.
Thermal Pad
4
-
Thermal Pad - Thermal relief pad for optimized heat dissipation. See “QFN Thermal Pad” on
page 20 for more information.
DS786A1
CS4412A
2. CHARACTERISTICS AND SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
GND = PGND = 0 V, all voltages with respect to ground.
Parameters
Symbol
Min
Nom
Max
Units
VD
2.375
2.5
2.625
V
VD
3.135
3.3
3.465
V
VD
4.75
5.0
5.25
V
VP
8.0
18.0
V
TA
-10
-
+70
°C
TJ
-10
-
+125
°C
DC Power Supply
Digital Core
Power Stage
Temperature
Ambient Temperature
Commercial
Junction Temperature
ABSOLUTE MAXIMUM RATINGS
GND = PGND = 0 V; all voltages with respect to ground.
Parameters
Symbol
Min
Max
Units
Outputs Switching and Under Load
No Output Switching
VP
VP
VD
-0.3
-0.3
-0.3
19.8
23.0
6.0
V
V
V
Input Current
(Note 1)
Iin
-
±10
mA
Digital Input Voltage
(Note 2)
VIND
-0.3
VD + 0.4
V
TA
-20
+85
°C
Tstg
-65
+150
°C
DC Power Supply
Power Stage
Power Stage
Digital Core
Inputs
Temperature
Ambient Operating Temperature - Power Applied
Commercial
Storage Temperature
WARNING: Operation beyond these limits may result in permanent damage to the device. Normal operation is not
guaranteed at these extremes.
Notes:
1. Any pin except supplies. Transient currents of up to ±100 mA on the PWM input pins will not cause
SCR latch-up.
2. The maximum over/under voltage is limited by the input current.
DS786A1
5
CS4412A
PWM POWER OUTPUT CHARACTERISTICS
Test Conditions (unless otherwise specified): GND = PGND = 0 V; All voltages with respect to ground; TA = 25° C;
VD = 3.3 V; VP = 18 V; RL = 8 Ω for full-bridge, RL = 4 Ω for half-bridge and parallel full-bridge; PWM Switch
Rate = 384 kHz; 10 Hz to 20 kHz Measurement Bandwidth; Input source is CS4525 PWM_SIG outputs; Performance measurements taken with a full-scale 997 Hz sine wave, an AES17 measurement filter; Half-Bridge measurements taken through the Half-Bridge Output Filter shown in Figure 5; Stereo Full-Bridge and Parallel FullBridge measurements taken through the Full-Bridge Output Filter shown in Figure 6;.
Parameters
Symbol
Conditions
Min
Typ
Max
Units
THD+N < 10%
THD+N < 1%
THD+N < 10%
THD+N < 1%
THD+N < 10%
THD+N < 1%
-
15
12
7
5.5
30
23.5
-
W
W
W
W
W
W
PO = 1 W
PO = 0 dBFS = 11.3 W
PO = 1 W
PO = 0 dBFS = 5.0 W
PO = 1 W
PO = 0 dBFS = 22.6 W
-
0.05
0.10
0.12
0.28
0.1
0.3
-
%
%
%
%
%
%
PO = -60 dBFS, A-Weighted
PO = -60 dBFS, Unweighted
PO = -60 dBFS, A-Weighted
PO = -60 dBFS, Unweighted
PO = -60 dBFS, A-Weighted
PO = -60 dBFS, Unweighted
-
102
99
102
99
102
99
-
dB
dB
dB
dB
dB
dB
RDS(ON)
Id = 0.5 A, TJ = 50°C
-
280
-
mΩ
Power Output per Channel
Stereo Full-Bridge
Half-Bridge
PO
Parallel Full-Bridge
Total Harmonic Distortion + Noise
Stereo Full-Bridge
Half-Bridge THD+N
Parallel Full-Bridge
Dynamic Range
Stereo Full-Bridge
Half-Bridge
DYR
Parallel Full-Bridge
MOSFET On Resistance
h
PO = 2 x 15 W, RL = 8 Ω
-
85
-
%
PWmin
No Load
-
50
-
ns
Rise Time of OUTx
tr
Resistive Load
-
20
-
ns
Fall Time of OUTx
tf
Resistive Load
-
20
-
ns
ICE
TA = 25°C, OCREF = 16.2 kΩ
TA = 25°C, OCREF = 18 kΩ
TA = 25°C, OCREF = 22 kΩ
-
2.5
2.1
1.7
-
A
A
A
Efficiency
Minimum Output Pulse Width
PWM Output Over-Current Error Trigger Point
Junction Thermal Warning Trigger Point
TTW
-
105
-
°C
Junction Thermal Error Trigger Point
TTE
-
125
-
°C
VP Under-Voltage Error Falling Trigger Point
VUVFALL
TA = 25°C
-
4.7
4.9
V
VP Under-Voltage Error Rising Trigger Point
VUVRISE
TA = 25°C
-
4.95
5.4
V
6
DS786A1
CS4412A
DC ELECTRICAL CHARACTERISTICS
GND = PGND = 0 V; All voltages with respect to ground; PWM switch rate = 384 kHz; Unless otherwise specified.
Parameters
Min
Normal Operation
Typ
Max
Units
(Notes 3, 5)
Power Supply Current
VD = 3.3 V
-
20
-
mA
Power Dissipation
VD = 3.3 V
-
66
-
mW
-
2
-
mA
2.25
-
2.5
-
2.75
3
V
mA
Power-Down Mode
(Note 4)
Power Supply Current
VD = 3 .3 V
VD_REG Characteristics
Nominal Voltage
DC current source
Notes:
3. Normal operation is defined as RST12 and RST34 = HI.
4. Power-Down Mode is defined as RST12 and RST34 = LOW with all input lines held static.
5. Power supply current increases with increasing PWM switching rates.
DIGITAL INTERFACE SPECIFICATIONS
GND = PGND = 0 V; All voltages with respect to ground; Unless otherwise specified.
Parameters
Symbol
Min
High-Level Input Voltage
VIH
0.7*VD_REG
VD
V
Low-Level Input Voltage
VIL
-
0.20*VD_REG
V
VOH
0.90*VD
-
V
-
±10
μA
-
8
pF
High-Level Output Voltage
Input Leakage Current
Input Capacitance
DS786A1
Io = 2 mA
Iin
Max
Units
7
CS4412A
DIGITAL I/O PIN CHARACTERISTICS
The logic level for each input is set by its corresponding power supply and should not exceed the maximum ratings.
Power
Pin
Supply Number
VD
VP
Pin Name
I/O
Driver
Receiver
1
CNFG0
Input
-
2.5 V - 5.0 V
2
CNFG1
Input
-
2.5 V - 5.0 V
3
CNFG2
Input
-
2.5 V - 5.0 V
4
IN1
Input
-
2.5 V - 5.0 V
5
IN2
Input
-
2.5 V - 5.0 V
6
Input
-
2.5 V - 5.0 V
7
IN3
IN4
Input
-
2.5 V - 5.0 V
8
RST12
Input
-
2.5 V - 5.0 V
9
LVD
Input
-
2.5 V - 5.0 V
41
TWR
Output
2.5 V - 5.0 V, Open Drain
-
42
ERRUVTE
Output
2.5 V - 5.0 V, Open Drain
-
43
ERROC12
Output
2.5 V - 5.0 V, Open Drain
-
44
ERROC34
Output
2.5 V - 5.0 V, Open Drain
-
45
RAMP
Input
-
2.5 V - 5.0 V
46
RST34
Input
-
2.5 V - 5.0 V
35
OUT1
Output
8 V - 18 V Power MOSFET
-
32
OUT2
Output
8 V - 18 V Power MOSFET
-
29
OUT3
Output
8 V - 18 V Power MOSFET
-
26
OUT4
Output
8 V - 18 V Power MOSFET
-
Table 1. I/O Power Rails
8
DS786A1
CS4412A
3. TYPICAL CONNECTION DIAGRAMS
+3.3 V or +5.0 V
470 µF
10 µF 0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
+8 V to +18 V
470 µF
Ch2_PWM
4
IN1
5
IN2
6
IN3
7
IN4
31
VP
36
VP
30
VP
VD
Ch1_PWM
25
VP
*
12
RAMP_CAP 24
* Since ramping is disabled for fullbridge applications, this capacitor
can be omitted and RAMP_CAP can
be connected directly to VP.
See Section 4.2.1 for details.
CS4412A
OUT1 35
VD
Connect LVD to :
VD if VD = 5 V
GND if VD = 3.3 V
1
CNFG0
2
CNFG1
3
CNFG2
9
LVD
45
RAMP
See Section 5.1.1
for details.
Full-Bridge
Output Filter
OUT2 32
Channel 1
Audio
Output
See Figure 6.
OUT3 29
System
Control
Logic
Full-Bridge
Output Filter
22 kΩ
22 kΩ
22 kΩ
22 kΩ
VD
43
ERROC12
44
ERROC34
42
ERRUVTE
41
TWR
8
RST12
46
RST34
OUT4 26
Channel 2
Audio
Output
See Figure 6.
GND 10
GND 13
GND 14
11
10 µF
0.1 µF
VD_REG
GND 15
GND 16
GND 17
GND 18
16.2 kΩ
GND 19
21
OCREF
GND 20
GND 47
Thermal Pad
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
GND 48
22
23
27
28
33
34
37
38
39
40
Figure 1. Stereo Full-Bridge Typical Connection Diagram
DS786A1
9
CS4412A
+3.3 V or +5.0 V
470 µF
10 µF 0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
+8 V to +18 V
470 µF
31
VP
36
VP
30
VP
VD
25
VP
33 nF
12
RAMP_CAP 24
Ch1_PWM
4
IN1
Ch2_PWM
5
IN2
Ch3_PWM
6
IN3
7
IN4
OUT1 35
CS4412A
Half-Bridge
Output Filter
Channel 1
Audio
Output
See Figure 5.
VD
1
CNFG0
2
CNFG1
3
CNFG2
9
LVD
45
RAMP
43
ERROC12
44
ERROC34
42
ERRUVTE
41
TWR
8
RST12
46
RST34
Connect LVD to :
VD if VD = 5 V
GND if VD = 3.3 V
See Section 5.1.1
for details.
OUT2 32
Half-Bridge
Output Filter
Channel 2
Audio
Output
See Figure 5.
System
Control
Logic
22 kΩ
22 kΩ
22 kΩ
22 kΩ
VD
OUT3 29
Full-Bridge
Output Filter
OUT4 26
Channel 3
Audio
Output
See Figure 6.
GND 10
11
10 µF
0.1 µF
VD_REG
GND 13
GND 14
GND 15
GND 16
GND 17
GND 18
16.2 k Ω
GND 19
21
OCREF
GND 20
GND 47
Thermal Pad
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
GND 48
22
23
27
28
33
34
37
38
39
40
Figure 2. 2.1 Channel Typical Connection Diagram
10
DS786A1
CS4412A
+3.3 V or +5.0 V
470 µF
10 µF 0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
+8 V to +18 V
470 µF
33 nF
30
31
VP
VP
36
VP
25
VP
VD
12
RAMP_CAP 24
Ch1_PWM
4
IN1
Ch2_PWM
5
IN2
Ch3_PWM
6
IN3
Ch4_PWM
7
IN4
VD
Connect LVD to :
VD if VD = 5 V
GND if VD = 3.3 V
See Section 5.1.1
for details.
OUT1 35
CS4412A
1
CNFG0
2
CNFG1
3
CNFG2
9
LVD
45
RAMP
Half-Bridge
Output Filter
See Figure 5.
OUT2 32
Half-Bridge
Output Filter
Channel 1
Audio
Output
Channel 2
Audio
Output
See Figure 5.
System
Control
Logic
22 kΩ
22 kΩ
22 kΩ
22 kΩ
VD
OUT3 29
43
ERROC12
44
ERROC34
42
ERRUVTE
41
TWR
8
RST12
46
RST34
11
VD_REG
See Figure 5.
OUT4 26
GND 10
10 µF
0.1 µF
Half-Bridge
Output Filter
GND 13
Half-Bridge
Output Filter
See Figure 5.
Channel 3
Audio
Output
Channel 4
Audio
Output
GND 14
GND 15
GND 16
GND 17
GND 18
16.2 k Ω
GND 19
21
OCREF
GND 20
GND 47
Thermal Pad
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
GND 48
22
23
27
28
33
34
37
38
39
40
Figure 3. 4 Channel Half-Bridge Typical Connection Diagram
DS786A1
11
CS4412A
+8 V to +18 V
+3.3 V or +5.0 V
10 µF 0.1 µF
470 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
470 µF
31
VP
36
VP
30
VP
VD
25
VP
*
12
RAMP_CAP 24
PWM
4
IN1
5
IN2
6
IN3
7
IN4
1
CNFG0
2
CNFG1
OUT1 35
3
CNFG2
OUT2 32
9
LVD
45
RAMP
* Since ramping is disabled for fullbridge applications, this capacitor
can be omitted and RAMP_CAP can
be connected directly to VP.
See Section 4.2.1 for details.
CS4412A
VD
Connect LVD to :
VD if VD = 5 V
GND if VD = 3.3 V
See Section 5.1.1
for details.
Full-Bridge
Output Filter
OUT3 29
Audio
Output
See Figure 6.
OUT4 26
22 kΩ
22 kΩ
22 kΩ
VD
43
System
Control
Logic
ERROC12
44
ERROC34
42
ERRUVTE
41
TWR
GND 10
8
RST12
46
RST34
11
VD_REG
GND 13
GND 14
GND 15
10 µF
0.1 µF
GND 16
GND 17
GND 18
16.2 k Ω
GND 19
21
OCREF
GND 20
GND 47
Thermal Pad
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
PG
N
D
GND 48
22
23
27
28
33
34
37
38
39
40
Figure 4. Parallel Full-Bridge Typical Connection Diagram
12
DS786A1
CS4412A
4. APPLICATIONS
4.1
Overview
The CS4412A is a high-efficiency power stage for digital Class-D amplifiers designed to be configured as
four half-bridge channels, two half-bridge channels and one full-bridge channel, two full-bridge channels, or
one parallel full-bridge channel.
The CS4412A integrates on-chip over-current, under-voltage, over-temperature protection and error reporting as well as a thermal warning indicator. The low RDS(ON) outputs can source up to 2.5 A peak current,
delivering 85% efficiency. This efficiency provides for smaller device package, no external heat sink requirements, and smaller power supplies.
4.2
Reset and Power-Up
Reliable power-up can be accomplished by keeping the device in reset until the power supplies and configuration pins are stable. It is also recommended that the RST12 and RST34 pins be activated if the voltage
supplies drop below the recommended operating condition to prevent power-glitch related issues.
When the RST12 or RST34 are low, the corresponding channels of the CS4412A enter a low-power mode;
all of the channels’ internal states are reset and the corresponding power output pins are held in a highimpedance state. When RST12 or RST34 are high, the corresponding outputs will begin normal operation
according to the RAMP, CNFG[2:0], and IN1 - IN4 pins.
4.2.1
PWM Popguard Transient Control
The CS4412A uses PWM Popguard technology to minimize the effects of output transients during powerup and power-down for half-bridge configurations. This technique reduces the audio transients commonly
produced by half-bridge, single-supply amplifiers when implemented with external DC-blocking capacitors
connected in series with the audio outputs.
When the device is configured for ramping (RAMP set high) and RST12 or RST34 is set high, the corresponding power outputs will ramp-up to the bias point (VP/2). This gradual voltage ramping allows time
for the external DC-blocking capacitor to charge to the quiescent voltage, minimizing the power-up transient. The corresponding outputs will not begin normal operation until the ramp has reached the bias point.
The time it takes to complete a ramp-up sequence will vary slightly from the applied VP voltage; typical
ramp-up speeds achieved with a 1000 μF DC blocking capacitor are listed in Table 2. These times will
scale with the value of the capacitor.
VP Voltage
Typical Ramp Time*
12 V
1.25 seconds
15 V
0.95 seconds
18 V
0.80 seconds
* With 1000 μF DC Blocking Capacitor.
Table 2. Typical Ramp Times for Typical VP Voltages
DS786A1
13
CS4412A
When the device is configured for ramping (RAMP set high) and RST12 or RST34 is set low, the corresponding outputs will begin to slowly ramp down from the bias point to PGND, allowing the DC-blocking
capacitor to discharge.
The ramp feature is intended for use with half-bridge outputs. For “2.1 channel” applications with stereo
half-bridge and mono full-bridge (CNFG[2:0] = 001 or 101), the ramp will only be applied to OUT1 and
OUT2 (the half-bridge channels); OUT3 and OUT4 (the full-bridge channel) will not ramp.
The ramp feature requires a 33 nF capacitor on the RAMP_CAP pin to VP. For applications that do not
enable the ramping feature, RAMP_CAP can be connected directly to VP.
It is not necessary to complete a ramp-up/down sequence before ramping up/down again.
4.2.2
Initial Pulse Edge Delay
After RST12 or RST34 is released, the CS4412A will continue to hold the corresponding power output
pins in a high-impedance state until a pulse edge is sensed on a corresponding PWM input pin. This is
done to prevent a possible DC output condition on the speakers if the PWM inputs are not yet modulating
immediately following the release of the corresponding reset signal. This initial transition delay is independent for each input/output pin pair; each output corresponding to an inactive input will remain in a highimpedance state until its input receives a pulse edge even if other inputs are activated. The pulse edge
must be from a digital low state to a digital high state. Once a pulse edge is detected, the corresponding
output pin will activate and switch as dictated by the output mode configuration as described in section
4.3 on page 15 until either an error condition is detected or until its reset pin is set low.
If the outputs are configured for ramping the CS4412A will perform a ramp-up sequence on OUT1/2 immediately following the release of RST12 and a ramp sequence on OUT3/4 immediately following the release of RST34. See section 4.2.1 on page 13 for more information on output ramping. If a pulse edge is
detected on an input before the ramp-up sequence finishes on its corresponding output pin, the CS4412A
will continue the ramp sequence and begin normal output operation immediately following its completion.
If a pulse edge is not detected on an input by the time the ramp-up sequence has finished on its corresponding output pin, the output pin will be placed into and remain in a high-impedance state until a pulse
edge is detected on the corresponding input.
4.2.3
Recommended Power-Up Sequence
1. Turn on the system power.
2. Hold RST12 and RST34 low until the power supply is stable. In this state, all associated outputs are
held in a high-impedance state.
3. Release RST12 and RST34 high.
4. Start the PWM modulator output.
4.2.4
Recommended Power-Down Sequence
1. Mute the logic-level PWM inputs present on IN1 - IN4 by applying 50 % duty-cycle input signals.
2. Hold RST12 and RST34 low.
3. Power down the remainder of the system.
14
DS786A1
CS4412A
4.3
Output Mode Configuration
Each OUTx pin will switch in association with the corresponding INx pin. For most configurations, OUTx will
be non-inverted from INx; however, some INx pins can be configured for internal inversion to allow one
PWM input to drive both the positive and negative sides of a full-bridge output. Unused OUTx pins must
have their corresponding INx pin tied to ground.
Table 3 shows the setting of the CNFG[2:0] inputs and the corresponding mode of operation. These pins
should remain static during operation (RST12 or RST34 set high).
CNFG2 CNFG1 CNFG0
Description
Necessary Input Connections
IN1 must provide the PWM data for the first full-bridge.
Stereo Full-Bridge IN2 must be inverted from IN1 for full-bridge operation.
0
0
0
Tied Loads
IN3 must provide the PWM data for the second full-bridge.
IN4 must be inverted from IN3 for full-bridge operation.
IN1 must provide the PWM data for the first half-bridge.
Stereo Half-Bridge
IN2 must provide the PWM data for the second half-bridge.
0
0
1
& Mono Full-Bridge
IN3 must provide the PWM data for the mono full-bridge.
Tied Loads*
IN4 must be inverted from IN3 for full-bridge operation.
IN1 must provide the PWM data for the mono full-bridge.
Mono Parallel Full- IN2 must be wired directly to IN1 for parallel full-bridge operation.
0
1
0
Bridge Tied Load IN3 must be inverted from IN1 for parallel full-bridge operation.
IN4 must be wired to IN3 for parallel full-bridge operation.
IN1 must provide the PWM data for the first half-bridge.
Quad Half-Bridge IN2 must provide the PWM data for the second half-bridge.
0
1
1
Tied Loads
IN3 must provide the PWM data for the third half-bridge.
IN4 must provide the PWM data for the fourth half-bridge.
IN1 must provide the PWM data for the first full-bridge.
Stereo Full-Bridge
IN2 must be wired to IN1; the CS4412A will internally invert IN2.
1
0
0
Tied Loads
IN3 must provide the PWM data for the second full-bridge.
With Inversion
IN4 must be wired to IN3; the CS4412A will internally invert IN4.
Stereo Half-Bridge IN1 must provide the PWM data for the first half-bridge.
& Mono Full-Bridge IN2 must provide the PWM data for the second half-bridge.
1
0
1
Tied Loads
IN3 must provide the PWM data for the mono full-bridge.
With Inversion* IN4 must be wired to IN3; the CS4412A will internally invert IN4.
IN1 must be provided for half-bridge operation.
Mono Parallel FullIN2 must be wired to IN1 for parallel full-bridge operation.
1
1
0
Bridge Tied Load
IN3 must be wired to IN1; the CS4412A will internally invert IN3.
With Inversion
IN4 must be wired to IN1; the CS4412A will internally invert IN4.
1
1
1
Reserved
The input connections are not applicable.
* PWM Popguard Transient Control only affects OUT1 and OUT2.
Table 3. Output Mode Configuration Options
In Stereo Half-Bridge & Mono Full-Bridge configurations, the PWM Popguard Transient Control will only affect the two half-bridge outputs, OUT1 and OUT2. The full-bridge output will not ramp regardless of the state
of the RAMP pin. See Section 4.2.1 on page 13 for more details about PWM Popguard Transient Control.
DS786A1
15
CS4412A
4.4
Output Filters
The filter placed after the PWM outputs can greatly affect the output performance. The filter not only reduces
radiated EMI (snubber filter), but also filters high frequency content from the switching output before going
to the speaker (low-pass LC filter).
4.4.1
Half-Bridge Output Filter
Figure 5 shows the output filter for a half-bridge configuration. The transient-voltage suppression circuit
(snubber circuit) is comprised of a resistor (20 Ω, ¼ W) and capacitors (220 pF) and should be placed as
close as possible to the corresponding PWM output pin to greatly reduce radiated EMI.
Each output pin must be connected to two Schottky diodes—one to ground and one to the VP supply.
These diodes should be placed within 12 mm of the corresponding OUTx pin. The requirements of this
diode are:
1. Rated IF (average rectifier forward current) is greater than or equal to 1.0 A.
2. Support up to 80° C of lead temperature with VF drop (forward voltage) less than or equal to 480 mV
at the corresponding IF.
3. VR (reverse voltage) is greater than or equal to 20 V.
VP
L1
OUTx
C2
+
-
20 Ω
220 pF
*Diode is Rohm
RB160M-30 or
equivalent
C1
Figure 5. Output Filter - Half-Bridge
The inductor, L1, and capacitor, C1, comprise the low-pass filter. Along with the nominal load impedance
of the speaker, these values set the cutoff frequency of the filter. Table 4 shows the component values for
L1 and C1 based on nominal speaker (load) impedance for a corner frequency (-3 dB point) of approximately 35 kHz.
Load
L1
C1
4Ω
6Ω
8Ω
22 µH
33 µH
47 µH
1.0 µF
0.68 µF
0.47 µF
Table 4. Low-Pass Filter Components - Half-Bridge
16
DS786A1
CS4412A
C2 is the DC-blocking capacitor. Table 5 shows the component values for C2 based on corner frequency
(-3 dB point) and a nominal speaker (load) impedances of 4 Ω, 6 Ω, and 8 Ω. This capacitor should also
be chosen to have a ripple current rating above the amount of current that will passed through it.
Load
Corner Frequency
C2
4Ω
40 Hz
58 Hz
120 Hz
39 Hz
68 Hz
120 Hz
42 Hz
60 Hz
110 Hz
1000 µF
680 µF
330 µF
680 µF
390 µF
220 µF
470 µF
330 µF
180 µF
6Ω
8Ω
Table 5. DC-Blocking Capacitors Values - Half-Bridge
DS786A1
17
CS4412A
4.4.2
Full-Bridge Output Filter (Stereo or Parallel)
Figure 6 shows the output filter for a full-bridge configuration. The transient-voltage suppression circuit
(snubber circuit) is comprised of a resistor (20 Ω) and capacitor (330 pF) and should be placed as close
as possible to the corresponding PWM output pins to greatly reduce radiated EMI. The inductors, L1 and
L2, and capacitor, C1, comprise the low-pass filter. Along with the nominal load impedance of the speaker,
these values set the cutoff frequency of the filter. Table 6 shows the component values based on nominal
speaker (load) impedance for a corner frequency (-3 dB point) of approximately 35 kHz.
Each output pin must be connected to two Schottky diodes—one to ground and one to the VP supply.
These diodes should be placed within 12 mm of the corresponding OUTx pin. The requirements of this
diode are:
1. Rated IF (average rectifier forward current) is greater than or equal to 1.0 A.
2. Support up to 80° C of lead temperature with VF drop (forward voltage) less than or equal to 480 mV
at the corresponding IF.
3. VR (reverse voltage) is greater than or equal to 20 V.
VP
L1
OUTX+
*Diode is Rohm
RB160M-30 or
equivalent
20 Ω
330 pF
C1
VP
L2
OUTX-
Figure 6. Output Filter - Full-Bridge
Load
L1, L2
C1
4Ω
6Ω
8Ω
10 µH
15 µH
22 µH
1.0 µF
0.47 µF
0.47 µF
Table 6. Low-Pass Filter Components - Full-Bridge
18
DS786A1
CS4412A
4.5
Device Protection and Error Reporting
The CS4412A has built-in protection circuitry for over-current, under-voltage, and thermal warning/overload conditions. The levels of the over-current error, thermal error, and VP under-voltage trigger points
are listed in the PWM Power Output Characteristics table on page 6. Automatic shut-down will occur
whenever any of these preset thresholds other than thermal warning are crossed.
Each error and warning pin implements an active-low open-drain driver and requires an external 22 kΩ
pull-up resistor for proper operation.
4.5.1
Over-Current Protection
An over-current error condition will occur if the peak output current exceeds the Over-Current Error trigger
point. Over-current errors for OUT1/2 and OUT3/4 are reported on the ERROC12 and ERROC34 pins
respectively. The power output of the channel which is reporting the over-current condition will be set to
high-impedance until the error condition has been removed and the reset signal for that channel has been
toggled from low to high.
ERROCxy
0
1
Reported Condition
Over-current error on channel x or channel y.
Operating current of channel x and y within allowable limits.
Table 7. Over-current Error Conditions
4.5.2
Thermal Warning, Thermal Error, and Under-Voltage Error
Table 8 shows the behavior of the TWR and ERRUVTE pins. When the junction temperature exceeds the
junction thermal warning trigger point, the TWR pin will be set low. If the junction temperature continues
to increase beyond the junction thermal error trigger point, the ERRUVTE pin will be set low. If the voltage
on VP falls below the VP under-voltage error trigger point, ERRUVTE will be set low.
When the thermal error or VP under-voltage trigger point is crossed, all power outputs will be set in a highimpedance state until the error condition has been removed and both the RST12 and RST34 signals have
been toggled from low to high.
TWR
ERRUVTE
0
0
1
1
0
1
0
1
Reported Condition
Thermal warning and thermal error and/or under-voltage error.
Thermal warning only.
Under-voltage error.
Junction temperature and VP voltage within normal limits.
Table 8. Thermal and Under-Voltage Error Conditions
DS786A1
19
CS4412A
5. POWER SUPPLY, GROUNDING, AND PCB LAYOUT
5.1
Power Supply and Grounding
The CS4412A requires careful attention to power supply and grounding arrangements if its potential performance is to be realized.
Extensive use of power and ground planes, ground plane fill in unused areas and surface mount decoupling
capacitors are recommended. It is necessary to decouple the power supply by placing capacitors directly
between the power and ground of the CS4412A. Decoupling capacitors should be as close to the pins of
the CS4412A as possible. The lowest value ceramic capacitor should be closest to the pin and should be
mounted on the same side of the board as the CS4412A to minimize inductance effects. The CRD4412A
reference design demonstrates the optimum layout and power supply arrangements.
5.1.1
Integrated VD Regulator
The CS4412A includes an internal linear regulator to provide a fixed 2.5 V supply from the VD supply voltage for its internal digital logic. The LVD pin must be set to indicate the voltage present on the VD pin as
shown in Table 9 below.
VD Connection
VD_REG Connection
LVD Connection
5 V Supply
Bypass Capacitors Only
VD
3.3 V Supply
Bypass Capacitors Only
GND
2.5 V Supply
VD and Bypass Capacitors
GND
Table 9. Power Supply Configuration and Settings
The output of the digital regulator is presented on the VD_REG pin and may be used to provide an external device with up to 3 mA of current at its nominal output voltage of 2.5 V.
If a nominal supply voltage of 2.5 V is used as the VD supply (see the Recommended Operating Conditions table on page 5), the VD and VD_REG must be connected to the VD supply source. In this configuration, the internal regulator is bypassed and the external supply source is used to directly drive the
internal digital logic.
5.2
QFN Thermal Pad
The CS4412A is available in a compact QFN package. The underside of the QFN package reveals a large
metal pad that serves as a thermal relief to provide for maximum heat dissipation. This pad must mate with
an equally dimensioned copper pad on the PCB and must be electrically connected to ground. A series of
thermal vias should be used to connect this copper pad to one or more larger ground planes on other PCB
layers; the copper in these ground planes will act as a heat sink for the CS4412A. The CRD4412A reference
design demonstrates the optimum thermal pad and via configuration.
20
DS786A1
CS4412A
6. PARAMETER DEFINITIONS
Dynamic Range (DYR)
The ratio of the rms value of the signal to the rms sum of all other spectral components over the specified
bandwidth, typically 20 Hz to 20 kHz. Dynamic Range is a signal-to-noise ratio measurement over the specified band width made with a -60 dBFS signal. 60 dB is then added to the resulting measurement to refer
the measurement to full-scale. This technique ensures that the distortion components are below the noise
level and do not effect the measurement. This measurement technique has been accepted by the Audio
Engineering Society, AES17-1991, and the Electronic Industries Association of Japan, EIAJ CP-307. Expressed in decibels.
Total Harmonic Distortion + Noise (THD+N)
The ratio of the rms value of the signal to the rms sum of all other spectral components over the specified
band width (typically 10 Hz to 20 kHz), including distortion components. Expressed in decibels. Measured
at -1 and -20 dBFS as suggested in AES17-1991 Annex A.
DS786A1
21
CS4412A
7. PACKAGE DIMENSIONS
48L QFN (9 × 9 MM BODY) PACKAGE DRAWING
e
b
D
Pin #1 ID
Pin #1 ID
E
E2
A1
D2
L
A
Top View
Side View
Bottom View
INCHES
MILLIMETERS
NOTE
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
--
--
0.0354
--
--
0.90
1
A1
0.0000
--
0.0020
0.00
--
0.05
1
b
0.0118
0.0138
0.0157
0.30
0.35
0.40
1,2
D
D2
0.3543 BSC
0.2618
E
E2
0.2736
6.65
0.3543 BSC
0.2618
e
L
0.2677
9.00 BSC
0.2677
0.0217
6.95
9.00 BSC
0.2736
6.65
0.0256 BSC
0.0177
6.80
1
6.80
1
6.95
0.65 BSC
0.0276
0.45
0.55
1
1
1
0.70
1
JEDEC #: MO-220
Controlling Dimension is Millimeters.
Notes:
1. Dimensioning and tolerance per ASME Y4.5M - 1994.
2. Dimensioning lead width applies to the plated terminal and is measured between 0.20 mm and
0.25 mm from the terminal tip.
22
DS786A1
CS4412A
8. THERMAL CHARACTERISTICS
Parameter
Junction to Case Thermal Impedance
8.1
Symbol
Min
Typ
Max
Units
θJC
-
1
-
°C/Watt
Thermal Flag
This device is designed to have the metal flag on the bottom of the device soldered directly to a metal plane
on the PCB. To enhance the thermal dissipation capabilities of the system, this metal plane should be coupled with vias to a large metal plane on the backside (and inner ground layer, if applicable) of the PCB.
In either case, it is beneficial to use copper fill in any unused regions inside the PCB layout, especially those
immediately surrounding the CS4412A. In addition to improving in electrical performance, this practice also
aids in heat dissipation.
The heat dissipation capability required of the metal plane for a given output power can be calculated as
follows:
θCA = [(TJ(MAX) - TA) / PD] - θJC
where,
θCA = Thermal resistance of the metal plane in °C/Watt
TJ(MAX) = Maximum rated operating junction temperature in °C, equal to 150 °C
TA = Ambient temperature in °C
PD = RMS power dissipation of the device, equal to 0.15*PRMS (assuming 85% efficiency)
θJC = Junction-to-case thermal resistance of the device in °C/Watt
DS786A1
23
CS4412A
9. ORDERING INFORMATION
Product
Description
Package Pb-Free
Grade
Temp Range Container
Order#
Rail
CS4412A-CNZ
CS4412A
30 W Quad Half-Bridge
Digital Amplifier Power Stage
48-QFN
Yes
Commercial
-10° to +70°C
Tape and
Reel
CS4412ACNZR
CRD4412A
1 x 30 W Reference Design
Daughter Card
-
-
-
-
-
CRD4412A
CRD4525
2 x 15 W Reference Design
Main Board
-
-
-
-
-
CRD4525
10.REVISION HISTORY
Release
A1
Changes
Initial Release
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative.
To find one nearest you, go to www.cirrus.com.
IMPORTANT NOTICE
“Advance” product information describes products that are in development and subject to development changes. Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS”
without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that
information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment,
including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus for the use of this information, including use
of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document is the property of
Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or
other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such
as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE
IN AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD
TO BE FULLY AT THE CUSTOMER’S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE
IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED
IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER
AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH
THESE USES.
Cirrus Logic, Cirrus, the Cirrus Logic logo designs, and Popguard are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be
trademarks or service marks of their respective owners.
24
DS786A1