CLARE CPC1908J

CPC1908
i4-PAC™ Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
RθJC
Rating
60
8.5
3.5
0.3
0.35
Description
Units
VP
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high-power Solid State Relays.
Arms
As part of this family, the CPC1908 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 8.5Arms continuous load current with a
5°C/W heat sink.
Ω
°C/W
Features
•
•
•
•
•
•
•
•
•
Compact i4-PAC™ Power Package
Low Thermal Resistance (0.35 °C/W)
8.5Arms Load Current with 5°C/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
The CPC1908 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of
high performance switching applications.
The unique i4-PAC package pioneered by IXYS
allows Solid State Relays to achieve the highest load
current and power ratings. This package features
a unique IXYS process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low thermal resistance (0.35 °C/W).
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
Ordering Information
Part Number
CPC1908J
Description
i4-PAC Package (25 per tube)
Pin Configuration
Switching Characteristics of Normally
Open (Form A) Devices
CONTROL
ILOAD
+
90%
10%+
RoHS
2002/95/EC
TON
e3
DS-CPC1908-R05
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TOFF
1
CPC1908
Absolute Maximum Ratings
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation
Isolation voltage Input to Output
Operational Temperature
Storage Temperature
Ratings
60
5
100
1
150
2500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance Input/Output
1
2
3
2
Conditions
TA = 25°C
t ≤ 10ms
No Heat Sink
TC=25°C
TC=99°C
IL=1A, IF=10mA
VL=60V
IF=20mA, VL=10V
V=25V, f=1MHz
TA = 25°C
IL=1A
IF=5mA
VR=5V
TA = 25°C
-
Symbol
Min
Typ
Max
Units
0.09
-
25
3.5
15
3.9
0.3
1
AP
IL(99)
RON
ILEAK
-
TON
TOFF
COUT
-
16
0.17
1100
20
5
-
IF
IF
VF
IR
0.6
0.9
-
1.2
-
10
1.4
10
mA
mA
V
µA
CI/O
-
1
-
pF
IL
Arms
Ω
µA
ms
pF
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on time.
For applications requiring high temperature operation (TC > 60ºC) an LED drive current of 20mA is recommended.
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CPC1908
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature (operation)
Conditions
Free air
-
Symbol
RθJC
RθJA
TJ
Min
-40
Typ
33
-
Max
0.35
100
Units
°C/W
°C/W
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL
2
•
RθJC
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (Arms)
IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
R05
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CPC1908
PERFORMANCE DATA*
35
30
25
20
15
10
25
20
15
10
5
1.31
1.32
1.33
0.078
0.082
CPC1908
Typical Turn-Off Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 1ADC; IF = 10mA)
0.086 0.090 0.094
On-resistance (Ω)
11
15
10
5
5ºC/W
10ºC/W
0
0.11
0.13
0.15
0.17
0.19
0.21
No Heat Sink
21
18
20
40
60
Temperature (ºC)
1.02
1.00
0.98
0.96
-20
0
20
40
60
80
100
-40
-20
0
I F = 20mA
I F = 10mA
1.0
40
60
80
-20
0
20
40
60
Temperature (ºC)
80
100
120
100
IF = 10mA
0.20
0.15
0.10
-40
-20
0
20
40
60
80
100
CPC1908
Typical Turn-Off vs. LED Forward Current
(Load Current = 1ADC)
40
0.36
36
0.32
32
0.28
28
24
20
16
12
0.24
0.20
0.16
0.12
0.08
0.04
0
-40
80
Temperature (ºC)
4
0.8
60
0
100
Turn-Off (ms)
I F = 50mA
Turn-On (ms)
1.6
1.2
20
CPC1908
Typical Turn-On vs. LED Forward Current
(Load Current = 1ADC)
1.8
40
0.25
Temperature (ºC)
CPC1908
Typical LED Forward Voltage Drop
vs. Temperature
20
0.05
Temperature (°C)
1.4
0
0.30
6
0
-20
CPC1908
Typical Turn-Off vs. Temperature
(Load Current = 1ADC)
0.35
9
0.92
-40
Temperature (ºC)
12
0.94
0.006
100
IF = 10mA
15
3
-40
80
Turn-Off (ms)
Turn-On (ms)
1.04
0.008
0.002
CPC1908
Typical Turn-On vs. Temperature
(Load Current = 1ADC)
CPC1908
Normalized Blocking Voltage vs. Temperature
1.06
0.010
0
0
Turn-Off (ms)
1.08
21
0.004
4
2
0
19
0.012
10
6
17
0.014
12
8
15
CPC1908
Typical Leakage vs. Temperature at
Maximum Rated Voltage
(Measured across Pins 1 & 2)
Leakage (µA)
20
13
Turn-On (ms)
CPC1908
Maximum Load Current vs.
Temperature with Heat Sink
(IF=20mA)
16
Load Current (Arms)
Device Count (N)
5
0.098
14 1ºC/W
Blocking Voltage (V)
10
0
1.34
LED Forward Voltage (V)
LED Forward Voltage Drop (V)
15
0
1.30
25
20
5
0
CPC1908
Typical Turn-On Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 1ADC; IF = 10mA)
25
30
Device Count (N)
Device Count (N)
CPC1908
Typical On-resistance Distribution
(N=50 Ambient Temperature = 25ºC)
(Load Current = 1ADC; I F = 10mA)
Device Count (N)
35
CPC1908
Typical LED Forward Voltage Drop
(N = 50, TA = 25ºC, I L = 1ADC, I F = 10mA)
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R05
CPC1908
PERFORMANCE DATA*
CPC1908
Typical On-resistance vs. Temperature
(Load Current = 1ADC)
0.18
0.16
IF = 10mA
0.08
0.06
0.04
0.02
0
On-resistance (Ω)
On-resistance (Ω)
0.12
I F = 10mA
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-40
-20
0
20
40
60
80
-40
100
Temperature (ºC)
CPC1908
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25ºC)
(IF = 10mA)
5
4
3
2
1
0
-1
-2
-3
-4
-5
-0.33
-20
0
20
40
60
Temperature (ºC)
80
100
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
CPC1908
Energy Rating Curve
(Free air, no heat sink)
30
25
Load Current (AP)
Load Current (A)
LED Current (mA)
0.14
0.10
CPC1908
Typical IF for Switch Operation
vs. Temperature
(Load Current = 1ADC)
CPC1908
Typical On-resistance vs. Temperature
(Load Current = max rated)
20
15
10
5
0
-0.22
-0.11
0
0.11
Load Voltage (V)
0.22
0.33
10µs 100µs 1ms 10ms 100ms
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
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CPC1908
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
e3
MECHANICAL DIMENSIONS
0.190 MIN - 0.205 MAX
(4.83 MIN - 5.21 MAX)
0.046 MIN - 0.085 MAX
(1.17 MIN - 2.16 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
0.210 MIN - 0.244 MAX
(5.33 MIN - 6.20 MAX)
0.065 MIN - 0.080 MAX
(1.65 MIN - 2.03 MAX)
0.660 MIN - 0.690 MAX
(16.76 MIN - 17.53 MAX)
ISOLATED HEAT SINK
0.100 MIN - 0.180 MAX
(2.54 MIN - 4.57 MAX)
0.819 MIN - 0.840 MAX
(20.80 MIN - 21.34 MAX)
0.590 MIN - 0.620 MAX
(14.99 MIN - 15.75 MAX)
0.083 MIN - 0.102 MAX
(2.11 MIN - 2.59 MAX)
0.780 MIN - 0.840 MAX
(19.81 MIN - 21.34 MAX)
0.300 BSC
(7.62 BSC)
0.150 BSC
(3.81 BSC)
0.020 MIN - 0.029 MAX
(0.51 MIN - 0.74 MAX)
0.058 MIN - 0.068 MAX
(1.47 MIN - 1.73 MAX)
0.102 MIN - 0.118 MAX
(2.59 MIN - 3.00 MAX)
0.045 MIN - 0.055 MAX
(1.14 MIN - 1.40 MAX)
NOTE: Bottom heatsink meets 2500Vrms isolation to the other pins.
Dimensions:
inches
(mm)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1908-R05
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
i4-PAC™ is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
3/20/07