XThin® LEDs CxxxXT290-Sxx00-x Cree’s XThin LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond connection. These vertically structured LED chips are approximately 115 microns in height and require a low forward voltage. Cree’s XT™ chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V ESD. Applications for XThin include next-generation mobile appliances for use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption are required. FEATURES • • • • • APPLICATIONS XThin LED Performance – Blue XT-12™ – 12.0 mW min. XT-16™ – 16.0 mW min. XT-18™ – 18.0 mW min. XT-21™ – 21.0 mW min. XT-24™ – 24.0 mW min. – Green – 7.0 mW min. Low Forward Voltage – 3.2 V Typical at 20 mA Class 2 ESD Rating Sn Contact for Low-Temp. Die Attach Methods Die Attach Options – Flux Eutectic; Flux & Temperature (-C) – Eutectic; Temperature & Pressure (-D) • • • • • SMT Packages Cellular Phone LCD Backlighting Digital Camera Flash Mobile Appliance Key Pads – White LEDs – Blue LEDs LED Video Displays CxxxXT290-Sxx00-x Chip Diagram R3CE, Rev. E Datasheet: CP Top View Bottom View G•SiC LED Chip 300 x 300 μm Gold Bond Pad 105 μm Diameter Die Cross Section Backside Contact Metal Bottom View for -C Cathode (-) SiC Substrate t = 115 µm Bottom View for -D Subject to change without notice. www.cree.com Anode (+) Maximum Ratings at TA = 25°C Notes 2&4 CxxxXT290-Sxx00-x DC Forward Current 30mA Peak Forward Current (1/10 duty cycle @ 1kHz) 100mA LED Junction Temperature 125°C Reverse Voltage 5V Operating Temperature Range -40°C to +100°C Storage Temperature Range Electrostatic Discharge Threshold (HBM) -40°C to +100°C 1000V Note 3 Electrostatic Discharge Classification (MIL-STD-883E) Class 2 Note 3 Typical Electrical/Optical Characteristics at T = 25°C, If = 20mA Part Number Forward Voltage (Vf, V) Note 4 Reverse Current [I(Vr=5V), μA] Full Width Half Max (λD, nm) Min. Typ. Max. Max. Typ. C460XT290-Sxx00-x 2.7 3.2 3.7 2 21 C470XT290-Sxx00-x 2.7 3.2 3.7 2 22 C527XT290-S0100-A 2.7 3.2 3.7 2 35 Mechanical Specifications Description CxxxXT290-Sxx00-x Dimension Tolerance P-N Junction Area (μm) 250 x 250 ± 25 Top Area (μm) 200 x 200 ± 25 Bottom Area (μm) 300 x 300 ± 25 Chip Thickness (μm) 115 ± 15 Au Bond Pad Diameter (μm) 105 -5, +15 Au Bond Pad Thickness (μm) 1.2 ± 0.5 Back Contact Metal Area (μm) 210 x 210 ± 25 Back Contact Metal Thickness (μm) -C (Sn Flux Eutectic) 2.0 ± 0.3 Back Contact Metal Thickness (μm) -D (Sn Eutectic) 0.5 ± 0.1 Notes: 1. 2. 3. 4. 5. 6. 7. This product is intended for use in a pre-molded surface mount package. It should be tested in the package and environment consistent with the final use to validate applicability. CxxxXT290-Sxx00-C and –D are not intended for use where extended reliable operation in high temperature and high humidity environments is required. For this condition or for use in a leaded radial lamp, use CxxxXT290-Sxx00-A. See Cree XThin Applications Note for more information. Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000 epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1 3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds). See Cree XThin Applications Note for more assembly process information. Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is performed on each die. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an integrating sphere using Illuminance E. Caution: To avoid leakage currents and achieve maximum output efficiency, die attach material must not contact the side of the chip. See Cree XThin Applications Note for more information. Specifications are subject to change without notice. XThin chips are shipped with the junction side down, not requiring a die transfer prior to die attach. Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc. CPR3CE Rev. E Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com Standard Bins for XT290 LED chips are sorted to the radiant flux and dominant wavelength bins shown. A sorted die sheet contains die from only one bin. Sorted die kit (CxxxXT290-Sxx00-x) orders may be filled with any or all bins (CxxxXB290-01xx-x) contained in the kit. All radiant flux and all dominant wavelength values shown and specified are at If = 20 mA. Radiant Flux XT-24 C460XT290-S2400-x C460XT290-0117-x 24.0 mW 455 nm C460XT290-0118-x 457.5 nm Radiant Flux XT-21 Radiant Flux 460 nm Dominant Wavelength C460XT290-0120-x 462.5 nm 24.0 mW C460XT290-0117-x C460XT290-0118-x C460XT290-0119-x C460XT290-0120-x C460XT290-0113-x C460XT290-0114-x C460XT290-0115-x C460XT290-0116-x 21.0 mW 455 nm 457.5 nm 460 nm Dominant Wavelength 462.5 nm 465 nm C460XT290-S1800-x 24.0 mW 21.0 mW C460XT290-0117-x C460XT290-0118-x C460XT290-0119-x C460XT290-0120-x C460XT290-0113-x C460XT290-0114-x C460XT290-0115-x C460XT290-0116-x C460XT290-0109-x C460XT290-0110-x C460XT290-0111-x C460XT290-0112-x 18.0 mW 455 nm 457.5 nm XT-16 460 nm Dominant Wavelength 462.5 nm 465 nm C460XT290-S1600-x 24.0 mW 21.0 mW 18.0 mW C460XT290-0117-x C460XT290-0118-x C460XT290-0119-x C460XT290-0120-x C460XT290-0113-x C460XT290-0114-x C460XT290-0115-x C460XT290-0116-x C460XT290-0109-x C460XT290-0110-x C460XT290-0111-x C460XT290-0112-x C460XT290-0105-x C460XT290-0106-x C460XT290-0107-x C460XT290-0108-x 16.0 mW 455 nm 457.5 nm 460 nm Dominant Wavelength 462.5 nm Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc. 465 nm C460XT290-S2100-x XT-18 Radiant Flux C460XT290-0119-x CPR3CE Rev. E 465 nm Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com Standard Bins for XT290 (continued) XT-12 C460XT290-S1200-x C460XT290-0117-x C460XT290-0118-x C460XT290-0119-x C460XT290-0120-x C460XT290-0113-x C460XT290-0114-x C460XT290-0115-x C460XT290-0116-x C460XT290-0109-x C460XT290-0110-x C460XT290-0111-x C460XT290-0112-x C460XT290-0105-x C460XT290-0106-x C460XT290-0107-x C460XT290-0108-x C460XT290-0101-x C460XT290-0102-x C460XT290-0103-x C460XT290-0104-x Radiant Flux 24.0 mW 21.0 mW 18.0 mW 16.0 mW 12.0 mW 455 nm 457.5 nm Radiant Flux C470XT290-0113-x 21.0 mW 465 nm C470XT290-0114-x 467.5 nm XT-18 Radiant Flux 462.5 nm C470XT290-0115-x 470 nm Dominant Wavelength C470XT290-0116-x 472.5 nm 475 nm C470XT290-S1800-x 21.0 mW C470XT290-0113-x C470XT290-0114-x C470XT290-0115-x C470XT290-0116-x C470XT290-0109-x C470XT290-0110-x C470XT290-0111-x C470XT290-0112-x 18.0 mW 465 nm 467.5 nm XT-16 470 nm Dominant Wavelength 472.5 nm 475 nm C470XT290-S1600-x 21.0 mW 18.0 mW C470XT290-0113-x C470XT290-0114-x C470XT290-0115-x C470XT290-0116-x C470XT290-0109-x C470XT290-0110-x C470XT290-0111-x C470XT290-0112-x 16.0 mW 465 nm 467.5 nm 470 nm Dominant Wavelength 472.5 nm Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc. 465 nm C470XT290-S2100-x XT-21 Radiant Flux 460 nm Dominant Wavelength CPR3CE Rev. E 475 nm Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com Standard Bins for XT290 (continued) Radiant Flux XT-12 C470XT290-S1200-x C470XT290-0113-x C470XT290-0114-x C470XT290-0115-x C470XT290-0116-x C470XT290-0109-x C470XT290-0110-x C470XT290-0111-x C470XT290-0112-x C470XT290-0105-x C470XT290-0106-x C470XT290-0107-x C470XT290-0108-x C470XT290-0101-x C470XT290-0102-x C470XT290-0103-x C470XT290-0104-x 21.0 mW 18.0 mW 16.0 mW 12.0 mW 465 nm 467.5 nm 470 nm Dominant Wavelength 475 nm C527XT290-S0100-x XT-12 Radiant Flux 472.5 nm C527XT290-0110-x C527XT290-0111-x C527XT290-0112-x C527XT290-0107-x C527XT290-0108-x C527XT290-0109-x C527XT290-0104-x C527XT290-0105-x C527XT290-0106-x C527XT290-0101-x C527XT290-0102-x C527XT290-0103-x 10.0 mW 9.0 mW 8.0 mW 7.0 mW 520 nm 525 nm 530 nm Dominant Wavelength 535 nm Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc. CPR3CE Rev. E Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com Characteristic Curves These are representative measurements for the XThin product. Actual curves will vary slightly for the various radiant flux and dominant wavelength bins. Wavelength Shift vs Forward Current Forward Current vs. Forward Voltage 16.0 30 14.0 25 12.0 10.0 Shift (nm) If (mA) 20 15 10 8.0 6.0 4.0 2.0 0.0 5 527nm -2.0 0 470 nm -4.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5 10 Vf (V) 15 20 25 30 If(mA) Relative Intensity vs Forward Current Relative Intensity vs Peak Wavelength 100 140 120 Relative Intensity (%) 80 % Intensity 100 80 60 60 40 40 20 20 0 0 5 10 15 20 25 30 400 If(mA) Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks of Cree, Inc. CPR3CE Rev. E 500 600 Wavelength (nm) Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com