CYStech Electronics Corp. Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 1/4 Advanced Schottky Barrier Diodes ASD723SN Features: ● Designed for mounting on small surface ● Low stored charge ● Majority carrier conduction Mechanical data: ● Case: 0805(2012) Standard package, molded plastic ● Terminals : Solder plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 4.8mg (approximately) Absolute Maximum Ratings(Ta=25℃) Characteristics Continuous Reverse Voltage Average Rectified Current Forward Surge Current @ 8.3ms single half sine-wave superimposed on rated load(JEDEC method) Capacitance between Terminals @ f=1MHz and applied 10VDC Reverse Voltage Junction Temperature Storage Temperature Range Symbol VR IO Value 30 200 Unit V mA IFSM 1.5 A CT 20 pF Tj Tstg -40 to +125 -40 to +125 °C °C Electrical Characteristics ( TA=25°C, unless otherwise noted) Parameter Forward Voltage Reverse Current ASD723SN Condition IF = 200mADC VR = 30VDC Symbol VF IR Min - Typ - Max 0.55 15 Unit V µA CYStek Product Specification Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 2/4 CYStech Electronics Corp. Characteristic Curves Forward Current vs Forward Voltage Forward Current Derating Curve 100 M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 125℃ 75℃ 10 25℃ 20 - 25℃ 0 1 0 25 50 75 100 125 150 0 0.1 Reverse Leakage Current vs Reverse Voltage 0.4 0.5 0.6 Capacitance vs Reverse Voltage 100 1 Capacitance between terminals---C T(pF) 10 Reverse Leakage Current---I R(mA) 0.3 Forward Voltage---VF(V) Ambient Temperature---TA(℃) 125℃ 0.1 75℃ 0.01 0.001 25℃ 10 1 0.0001 0 10 20 Reverse Voltage---VR(V) ASD723SN 0.2 30 40 0 5 10 15 20 25 30 35 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 3/4 Packing Information ASD723SN CYStek Product Specification Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 4/4 CYStech Electronics Corp. 0805(2012) Dimension Marking Code : 4 A B R C D 0805 surface mount package CYStek package code: SN *:Typical DIM A B R Inches Min. Max. 0.079 0.087 0.016(typ.) 0.008(tup.) Millimeters Min. Max. 2.00 2.20 0.40(typ.) 0.20(typ.) DIM C D Inches Min. Max. 0.047 0.055 0.035 0.043 Millimeters Min. Max. 1.20 1.40 0.90 1.10 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. ASD723SN CYStek Product Specification