CYStech Electronics Corp. Spec. No. : C335SG Issued Date : 2003.06.10 Revised Date : Page No. : 1/4 High voltage switching diode BAS21SG Description High voltage switching diode encapsulated in a SOD-323 small plastic SMD package. Features •Fast switching speed •Low forward voltage drop •Small plastic SMD package Mechanical Data • Case: Molded Plastic, JEDEC SOD-323. • Terminals: Solder plated, solderable per MIL-STD-750 Method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.0045 gram, 0.000159 ounce Symbol Outline SOD-323 BAS21SG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335SG Issued Date : 2003.06.10 Revised Date : Page No. : 2/4 Absolute Maximum Ratings(Ta=25℃, unless otherwise specified) • Maximum Temperatures Storage Temperature Tstg ................................................................................................... -55~+150 °C Junction Temperature Tj ............................................................................................................. +150 °C • Maximum Power Dissipation Total Power Dissipation Ptot (Note)........................................................................................... 200 mW Derate above 25℃ ……………………………………………………………………….. 1.57mW/℃ • Maximum Voltages and Currents Continuous Reverse Voltage VR…………………………………………………………………… 250V Continuous Forward Current IF (Note)…………………………………………………………… 200 mA Peak Repetitive Forward Current IFRM (Note)………..………………………………………….625 mA • Thermal Resistance, Junction to Ambient Air RθJA……………………………………….…….635℃/W Note : Parts mounted on FR-5 board with minimum pad. Characteristics (Ta=25°C) Characteristic Symbol Reverse Breakdown Voltage Forward Voltage (Note) Reverse Leakage Current (Note) Diode Capacitance Reverse Recovery Time VBR VF(1) VF(2) IR(1) IR(2) CD trr Condition IR=100µA IF=100mA IF=200mA VR=200V,Tj=25℃ VR=200V,Tj=150℃ VR=0V, f=1MHz IF=IR=30mA RL=100Ω measured at IR=3mA Min. Max. Unit 250 - 1 1.25 100 100 5 V V V nA µA pF - 50 ns Notes: Pulse test, tp=380µs, duty cycle<2%. BAS21SG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335SG Issued Date : 2003.06.10 Revised Date : Page No. : 3/4 Characteristic Curves Forward Characteristics Reverse Leakage Current vs Junction Temperature 100 Reverse Leakage Current---I R(μA) Instantaneous Forward Current---I F(mA) 1000 100 10 1 0.1 10 1 0.1 0.01 0.01 0 1 Instantaneous Forward Voltage---VF(V) 2 0 100 Junction Temperature---Tj(℃) 200 Power Derating Curve Power Dissipation---P D(mW) 250 200 150 100 50 0 0 50 100 150 200 Ambient Temperature---TA(℃) BAS21SG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335SG Issued Date : 2003.06.10 Revised Date : Page No. : 4/4 SOD-323 Dimension K A Marking: 5JS H 1 2 B D Style: Pin 1.Cathode 2.Anode J H E C 2-Lead SOD-323 Plastic Surface Mounted Package CYStek Package Code: SG *: Typical Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAS21SG CYStek Product Specification