CYSTEKEC BTB1326I3

Spec. No. : C816I3
Issued Date : 2003.07.03
Revised Date :
Page No. : 1/4
CYStech Electronics Corp.
Low Vcesat PNP Epitaxial Planar Transistor
BTB1326I3
Features
• Low VCE(sat), VCE(sat)=-0.6 V (typical), at IC / IB = -4A / -0.1A
• Excellent DC current gain characteristics
• Complementary to BTD2097I3
Symbol
Outline
BTB1326I3
TO-251
B:Base
C:Collector
E:Emitter
B C E
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
ICP
Pd(TA=25℃)
Pd(TC=25℃)
Tj
Tstg
-20
-15
-6
-5
-10
1
10
150
-55~+150
V
V
V
*1
A
W
°C
°C
Note : *1. Single Pulse, Pw=10ms
BTB1326I3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C816I3
Issued Date : 2003.07.03
Revised Date :
Page No. : 2/4
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
fT
Cob
Min.
-20
-15
-6
120
-
Typ.
120
60
Max.
-0.5
-0.5
-1.0
560
-
Unit
V
V
V
µA
µA
V
MHz
pF
Test Conditions
IC=-50µA, IE=0
IC=-1mA, IB=0
IE=-50µA, IC=0
VCB=-20V, IE=0
VEB=-5V, IC=0
IC=-4A, IB=-0.1A
VCE=-2V, IC=-0.5A
VCE=-6V, IC=-50mA, f=30MHz
VCB=-20V, f=1MHz
*Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2%
Classification Of hFE
Rank
Range
BTB1326I3
Q
120~270
R
180~390
S
270~560
CYStek Product Specification
Spec. No. : C816I3
Issued Date : 2003.07.03
Revised Date :
Page No. : 3/4
CYStech Electronics Corp.
Characteristic Curves
Saturation Voltage vs Collector Current
Current Gain vs Collector Current
1000
Saturation Voltage---VCE(SAT)(mV)
1000
Current Gain---HFE
VCE=5V
VCE=2V
100
VCE=1V
100
IC=40IB
10
IC=20IB
IC=10IB
1
10
1
10
100
1000
1
10000
100
1000
10000
Collector Current---IC(mA)
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
Power Derating Curve
12
Power Dissipation---PD(W)
10000
Saturation Voltage---VBE(SAT)(mV)
10
IC=10IB
1000
10
8
6
4
2
0
100
1
10
100
1000
10000
Collector Current---IC(mA)
0
50
100
150
200
Case Temperature---TC(℃ )
Power Derating Curve
Power Dissipation---PD(W)
1.2
1
0.8
0.6
0.4
0.2
0
0
50
100
150
200
Ambient Temperature---TA(℃ )
BTB1326I3
CYStek Product Specification
Spec. No. : C816I3
Issued Date : 2003.07.03
Revised Date :
Page No. : 4/4
CYStech Electronics Corp.
TO-251 Dimension
A
B
C
Marking:
D
B1326
F
G
3
K
E
I
H
2
1
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package
CYStek Package Code: I3
J
*: Typical
Inches
Min.
Max.
0.0177
0.0217
0.0354
0.0591
0.0177
0.0236
0.0866
0.0945
0.2520
0.2677
0.2677
0.2835
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
0.45
0.55
0.90
1.50
0.45
0.60
2.20
2.40
6.40
6.80
6.80
7.20
DIM
G
H
I
J
K
Inches
Min.
Max.
0.2559
*0.1811
0.0354
0.0315
0.2047
0.2165
Millimeters
Min.
Max.
6.50
*4.60
0.90
0.80
5.20
5.50
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1326I3
CYStek Product Specification