CYStech Electronics Corp. Spec. No. : C310M3 Issued Date : 2003.06.27 Revised Date : Page No. : 1/3 NPN Epitaxial Planar Transistor BTD5213M3 Features • High VCEO, VCEO=80V • High IC, IC(DC)=1A • Low VCE(sat) • Good current gain linearity • Complementary to BTB1260M3 Symbol Outline BTD5213M3 SOT-89 B：Base C：Collector E：Emitter B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Symbol VCBO VCEO VEBO IC ICP Pd Thermal Resistance, Junction to Ambient RθJA Junction Temperature Storage Temperature Tj Tstg Limit Unit 100 80 5 1 2 (Note 1) 0.6 1 (Note 2) 2 (Note 3) 208 125 (Note 2) 62.5 (Note 3) 150 -55~+150 V V V A A W W W °C/W °C/W °C/W °C °C Note : 1. Single Pulse Pw≦350µs, Duty≦2%. 2. When mounted on FR-4 PCB with area measuring 10×10×1 mm 3. When mounted on ceramic with area measuring 40×40×1 mm BTD5213M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C310M3 Issued Date : 2003.06.27 Revised Date : Page No. : 2/3 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. 100 80 5 82 - Typ. 100 20 Max. 1 1 0.4 820 - Unit V V V µA µA V MHz pF Test Conditions IC=50µA, IE=0 IC=1mA, IB=0 IE=50µA, IC=0 VCB=80V. IE=0 VEB=4V,IC=0 IC=500mA, IB=20mA VCE=3V, IC=500mA VCE=10V, IC=50mA, f=100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE Rank P Q R S T Range 82~180 120~270 180~390 270~560 390~820 BTD5213M3 CYStek Product Specification Spec. No. : C310M3 Issued Date : 2003.06.27 Revised Date : Page No. : 3/3 CYStech Electronics Corp. SOT-89 Dimension Marking: A 2 1 3 H C DF D B Style: Pin 1. Base 2. Collector 3. Emitter E I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G *: Typical Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.01417 0.0201 DIM A B C D E Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.527 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD5213M3 CYStek Product Specification