CYStech Electronics Corp. Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 1/3 100V/100mA SURFACE MOUNT SWITCHING DIODE CASD355SG Features: ● Small surface mounting type ● High reliability ● High speed(trr<4ns) Mechanical data: ● Case: Molded plastic, JEDEC SOD-323 ● Terminals : Solder plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 0.000159 ounce, 0.0045 gram Absolute Maximum Ratings(At Ta=25℃, unless otherwise noted) Characteristics Repetitive Peak Reverse Voltage Average Forward Current, VR=0 Peak Forward Surge Current, tp<1s Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM IFAV IFSM PD Tj Tstg Value 100 100 500 350 175 -55 to +175 Unit V mA mA mW °C °C Electrical Characteristics ( At Ta=25°C, unless otherwise noted) Parameter Forward Voltage Reverse Current Breakdown Voltage Diode Capacitance Reverse Recovery Time CASD355SG Conditions IF=10mA VR=25V VR=25V, Tj=150℃ VR=80V IR=100µA, Tp/T=0.01, Tp=0.3ms VR=0, f=1MHz, VHF=50mV IF=10mA,VR=6V,IRR=0.1×IR, RL=100Ω Symbol VF IR IR IR V(BR) CD trr Min 100 Typ - Max 1.2 100 50 30 4 4 Unit V nA µA µA V pF ns CYStek Product Specification CYStech Electronics Corp. Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 2/3 Characteristic Curves Forward Current vs Forward Voltage Reverse Leakage Current vs Junction Temperature 1000 Instantaneous Forward Current---I F(mA) Reverse Leakage Current---I R(μA) 1000 VR =80V / Max. Values 100 10 1 VR =80V / Typ Values 0.1 VR =25V / Typ. Values Tj=25℃ Pulse Width 300μs 1% Duty Cycle 100 10 Scattering Limit 1 0.1 0.01 0 20 40 60 0 80 100 120 140 160 180 200 0.8 1.2 1.6 2 Forward Voltage---VF(V) Junction Temperature---Tj(℃) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 1000 3 Tj= 25℃ Diode Capacitance ---C D(pF) Reverse Leakage Current---I R(nA) 0.4 100 Scattering Limit 10 f=1MHz Ta=25℃ 2.5 2 1.5 1 0.5 1 1 10 Reverse Voltage---VR(V) CASD355SG 100 0.1 1 10 100 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 3/3 SOD-323F Dimension SOD-323F Plastic Surface Mounted Package CYStek Package Code:SG *:Typical Inches Min. Max. 0.090 0.106 0.045 0.053 0.012(typ) DIM A B C Millimeters Min. Max. 2.3 2.7 1.15 1.35 0.3(typ) DIM D R Inches Min. Max. 0.028 0.035 0.02(typ) Millimeters Min. Max. 0.7 0.9 0.5(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CASD355SG CYStek Product Specification