Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 1/1 CYStech Electronics Corp. 80V/100mA SURFACE MOUNT SWITCHING DIODE CASD355SY Features: ● Designed for mounting on small surface ● Extremely thin / leadless package ● Low leakage current ● High mounting capability, strong surge withstand, high reliability Mechanical data: ● Case: 1005(2512) standard package, molded plastic, JEDEC SOD-323 ● Terminals : Gold plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 0.006 gram (approximately) Absolute Maximum Ratings(At Ta=25℃, unless otherwise noted) Characteristics Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current Peak Forward Surge Current @8.3ms, single half sine-wave superimposed on rated load(JEDEC method) Repetitive Peak Forward Current Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM VR IO Min - Typ - Max 90 80 100 Unit V V mA IFSM - 1000 - mA IFRM PD Tj Tstg -55 -55 - 225 300 +125 +125 mA mW °C °C Electrical Characteristics ( At Ta=25°C, unless otherwise noted) Parameter Forward Voltage Reverse Current Diode Capacitance Reverse Recovery Time CASD355SY Conditions IF=100mA VR=80V VR=0.5V, f=1MHz IF=10mA,VR=6V,IRR=0.1×IR, RL=50Ω Symbol VF IR CD trr Min - Typ - Max 1 100 3 4 Unit V nA pF ns CYStek Product Specification Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 2/2 CYStech Electronics Corp. Characteristic Curves Reverse Leakage Current vs Temperature Forward Current vs Forward Voltage 10000 Reverse Leakage Current---IR(nA) Forward Current---IF(mA) 1000 125℃ 100 75℃ 25℃ -25℃ 10 125℃ 1000 75℃ 100 25℃ 10 1 1 0 0.2 0.4 0.6 0.8 1 0 1.2 10 30 40 50 60 70 80 Ambient Temperature---TA(℃) Forward Voltage---VF(V) Diode Capacitance vs Reverse Voltage Forward Current vs Ambient Temperature 125 Percentage of Peak Average Forward Current(%) 5 Diode Capacitance---CD(pF) 20 f=1MHz Ta=25℃ 4 3 2 1 0 Mounting on glass epoxy PCBs 100 75 50 25 0 0 2 4 6 8 10 Reverse Voltage---VR(V) CASD355SY 12 14 0 25 50 75 100 125 150 Ambient Temperature---Ta(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 3/3 SOD-323(1005) Dimension SOD-323(1005) Plastic Surface Mounted Package CYStek Package Code : SY *:Typical Inches Min. Max. 0.095 0.102 0.043 0.051 0.014(typ) DIM A B C Millimeters Min. Max. 2.4 2.6 1.1 1.3 0.35(typ) DIM D E F Inches Min. Max. 0.027 0.035 0.012(typ) 0.014(typ) Millimeters Min. Max. 0.7 0.9 0.30(typ) 0.35(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CASD355SY CYStek Product Specification