CYStech Electronics Corp. Spec. No. : C303S3C Issued Date : 2003.10.07 Revised Date : . . Page No. : 1/4 DAN217S3 HIGH-SPEED SWITCHING DIODE Description The DAN217S3 consists of two diodes in a plastic surface mount package. The diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits. Features • Small SMD Package (SOT-323) • Ultra-high Speed • Low Forward Voltage • Fast Reverse Recovery Time Equivalent Circuit 3 1 Outline K1, A2 2 1. Anode 1 2. Cathode 2 3. Cathode 1 / Anode 2 A1 K2 Sot-323 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature............................................................................................ -65 ~ +150 °C Junction Temperature .................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................ 200 mW • Maximum Voltages and Currents (Ta=25°C) Reverse Voltage .................................................................................................................. 70 V Repetitive Reverse Voltage ................................................................................................. 70 V Forward Current ............................................................................................................. 150 mA Repetitive Forward Current ............................................................................................ 500 mA Forward Surge Current (1ms)....................................................................................... 1000 mA DAN217S3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303S3C Issued Date : 2003.10.07 Revised Date : . . Page No. : 2/4 Characteristics (Ta=25°C) Characteristic Reverse Breakdown Voltage Forward Voltage Reverse Current Total Capacitance Reverse Recovery Time DAN217S3 Symbol V(BR) VF(1) VF(2) VF(3) VF(4) IR CT trr Condition IR=100µA IF=1mA IF=10mA IF=50mA IF=150mA VR=70 VR=0, f=1MHz IF=IR=10mA, RL=100Ω measured at IR=1mA Min 70 - Max 715 855 1000 1250 2.5 1.5 Unit V mV mV mV mV µA pF - 6 ns CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303S3C Issued Date : 2003.10.07 Revised Date : . . Page No. : 3/4 Characteristic Curves Forward Biased Voltage & Forward Current Capacitance & Reverse-Biased Voltage 1 Capacitance-Cd (pF) Current-IF (mA) 450 300 150 0.1 0 0 500 1000 1500 Forward Biased Voltage-VF (mV) DAN217S3 2000 0.1 1 10 100 Reverse Biased Voltage-VR (V) CYStek Product Specification Spec. No. : C303S3C Issued Date : 2003.10.07 Revised Date : . . Page No. : 4/4 CYStech Electronics Corp. SOT-323 Dimension Marking: 3 A Q A1 1 C KJG TE Lp 2 detail Z bp e1 W B e E D A Z 3-Lead SOT-323 Plastic Surface Mounted Package CYStek Package Code: S3 θ He 0 v A Style : Pin 1. A1 2.K2 3. K1, A2 2 mm 1 scale *: Typical Inches Min. Max. 0.0315 0.0433 0.0000 0.0039 0.0118 0.0157 0.0039 0.0098 0.0709 0.0866 0.0453 0.0531 0.0512 - DIM A A1 bp C D E e Millimeters Min. Max. 0.80 1.10 0.00 0.10 0.30 0.40 0.10 0.25 1.80 2.20 1.15 1.35 1.3 - DIM e1 He Lp Q v w θ Inches Min. Max. 0.0256 0.0787 0.0886 0.0059 0.0177 0.0051 0.0091 0.0079 0.0079 - Millimeters Min. Max. 0.65 2.00 2.25 0.15 0.45 0.13 0.23 0.2 0.2 10° 0° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DAN217S3 CYStek Product Specification