CURRENT 1.5 Amperes VOLTAGE 50 to 800 Volts RS2A THRU RS2K Features · For surface mounted applications in order optimize board space · Low profile package · Built-in strain relief, ideal for automated placement · Fast switching speed · Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 · Low forward voltage drop · Glass passivated chip junction · High temperature soldering : 250℃/10 seconds at terminals DO-214AA (SMB) 0.155(3.94) 0.130(3.30) 0.083(2.11) 0.075(1.91) 0.185(4.70) 0.160(4.06) 0.012(0.31) 0.006(0.15) 0.096(2.44) 0.083(2.13) Mechanical Data · Case : JEDEC SMB(DO-214AA) molded plastic body · Terminals : Plated axial lead solderable per MIL-STD-750, method 2026 · Polarity : Color band denotes cathode end · Weight : 0.003 ounce, 0.093 gram 0.008(0.203) MAX. 0.050(1.27) 0.030(0.76) 0.220(5.59) 0.200(5.08) Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Symbols RS2A RS2B RS2D RS2G RS2J RS2K Units Maximum recurrent peak reverse voltage VRRM 50 100 200 400 600 800 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 Volts Maximum average forward rectified current at TL=100℃ I(AV) 1.5 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) IFSM 50.0 Amps VF 1.30 Volts Maximum instantaneous forward voltage at 1.5A Maximum reverse current at rated voltage TA=25℃ TA=125℃ Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) Typical junction capacitance (Note 2) Operating junction and storage temperature range 5.0 IR Trr μA 200 150 250 500 nS RθJL RθJA 18.0 55.0 ℃/W CJ 50.0 pF TJ TSTG -55 to +150 Notes: (1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A. (2) Measured at 1MHz and applied reverse voltage of 4.0 Volts. (3) Thermal resistance from junction to ambient and junction to lead mounted on PCB mounted on 0.27×0.27"(7.0×7.0mm) copper pad areas ℃ RATINGS AND CHARACTERISTIC CURVES RS2A THRU RS2K FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT RESISTIVE OR INDUCTIVE LOAD 1.5 1.0 0.5 P.C.B.MOUNTED ON 0.27X0.27"(7.0X7.0mm) COPPER PAD AREAS 0 50 60 70 80 90 100 110 120 130 140 150 160 50 PEAK FORWARD SURGE CURRENT (AMPERES) AVERAGE FORWARD CURRENT (A) FIG.1-FORWARD CURRENT DERATING CURVE TL=100℃ 8.3m SINGLE HALF SINE WAVE (JEDEC Method) 40 30 20 10 LEAD TEMPERATURE ( ℃) 0 1 1 TJ=25℃ 6 8 10 20 40 60 FIG.4-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE (pF) 20 10 4 NUMBER OF CYCLES AT 60Hz 30 TJ=25℃ f=1.0MHz Vsig=50mVp-p 10 1 0.1 100 10 REVERSE VOLTAGE. (V) PULSE WIDTH=300ms 1% DUTY CYCLE 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 FIG.5-TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100 TJ=125℃ INSTANTANEOUS REVERSE CURRENT MICROAMPERES INSTANTANEOUS FORWARD CURRENT (AMPERES) FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 2 10 1 TJ=25℃ 0.1 0 20 40 60 80 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 100 100