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Data Sheet No. BDTC-600-1A
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6 AMP SILICON BRIDGE RECTIFIERS
MECHANICAL SPECIFICATION
FEATURES
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VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
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BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
a
SURGE OVERLOAD RATING TO 250 AMPS PEAK
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IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
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THRU-HOLE FOR EASY HEAT SINK MOUNTING
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MECHANICAL DATA
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
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2.5
2.9
0.098
0.114
0.6
0.8
0.024
0.031
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7.3
7.7
0.287
0.303
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9.8
10.2
0.386
0.402
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0.9
1.1
0.035
0.043
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30.3
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C2
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0.157
0.189
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D2
D3
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13.2
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10.8
20.3
13.8
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11.2
0.776
0.520
0.126
0.425
0.799
0.543
0.165
0.441
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3.1
3.3
0.122
0.130
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SERIES DT6C00 - DT6C10
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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