DEC RGP302

DIOTEC ELECTRONICS CORP.
Data Sheet No. FSPD-300-1B
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: (310) 767-1052 Fax: (310) 767-7958
3 AMP HIGH RELIABILITY FAST RECOVERY DIODES
MECHANICAL SPECIFICATION
FEATURES
SERIES RGP300 - RGP310
ACTUAL SIZE OF
DO-27 PACKAGE
R
PROPRIETARY SOFT GLASS JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
DO - 27
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
LL
BD (Dia)
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
­
BL
Color Band
Denotes
Cathode
®
3A at T = 55 C WITH NO THERMAL RUNAWAY
MECHANICAL DATA
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Minimum
In
mm
BL
Maximum
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mm
9.28
0.365
BD
0.205
5.2
0.052
1.3
Sym
1.00
0.048
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MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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PARAMETER (TEST CONDITIONS)
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DIOTEC ELECTRONICS CORP.
Data Sheet No. FSPD-300--2B
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: (310) 767-1052 Fax: (310) 767-7958
3 AMP HIGH RELIABILITY FAST RECOVERY DIODES
RATING & CHARACTERISTIC CURVES FOR SERIES RGP300 - RGP310
ÌËÍÎÍ
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FIGURE 1. FORWARD CURRENT DERATING CURVE
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FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
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4 35
6
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0.4
0.6
0.8
1.0
1.2
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FIGURE 3. TYPICAL FORWARD CHARACTERISTIC
W
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FIGURE 4. TYPICAL JUNCTION CAPACITANCE
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FIGURE 5. REVERSE RECOVERY TEST SETUP AND TIME CHARACTERISTIC
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