DELTA IPM12C0A0S06FA

FEATURES
High efficiency: 93% @ 5.0Vin, 3.3V/6A out
Small size and low profile:
17.8 x 15.0 x 7.8mm (0.70” x 0.59” x 0.31”)
Output voltage adjustment: 0.9V~3.3V
Monotonic startup into normal and
pre-biased loads
Input UVLO, output OCP
Remote ON/OFF
Output short circuit protection
Fixed frequency operation
Copper pad to provide excellent thermal
performance
ISO 9001, TL 9000, ISO 14001, QS9000,
OHSAS18001 certified manufacturing
UL/cUL 60950 (US & Canada) Recognized,
and TUV (EN60950) Certified
CE mark meets 73/23/EEC and 93/68/EEC
directives
Delphi Series IPM, Non-Isolated, Integrated
Point-of-Load Power Modules: 3V~5.5V input,
0.8~3.3V and 6A Output Current
The Delphi Series IPM04C non-isolated, fully integrated
Point-of-Load (POL) power modules, are the latest offerings from a
world leader in power supply technology and manufacturing ― Delta
Electronics, Inc. This product family provides up to 6A of output
current or 19.8W of output power in an industry standard, compact,
IC-like, molded package. It is highly integrated and does not require
external components to provide the point-of-load function. A copper
pad on the back of the module, in close contact with the internal heat
dissipation components, provides excellent thermal performance.
The assembly process of the modules is fully automated with no
manual assembly involved. These converters possess outstanding
electrical and thermal performance, as well as extremely high
reliability under highly stressful operating conditions. IPM04C
operate from a 3V~5.5V source and provide a programmable output
voltage of 0.8V~3.3V. The IPM product family is available in both a
SMD or SIP package. IPM family is also available for input 8V~14V,
please refer to IPM12C datasheet for details.
OPTION
SMD or SIP package
APPLICATIONS
Telecom/DataCom
Wireless Networks
Optical Network Equipment
Server and Data Storage
Industrial/Test Equipment
DATASHEET
IPM04C0A0R/S06_08242006
Delta Electronics, Inc.
TECHNICAL SPECIFICATIONS
TA = 25°C, airflow rate = 300 LFM, Vin = 5.0Vdc, nominal Vout unless otherwise noted.
PARAMETER
NOTES and CONDITIONS
IPM04C0A0R/S06FA
Min.
ABSOLUTE MAXIMUM RATINGS
Input Voltage (Continuous)
Operating Temperature
Storage Temperature
INPUT CHARACTERISTICS
Operating Input Voltage
Input Under-Voltage Lockout
Turn-On Voltage Threshold
Turn-Off Voltage Threshold
Maximum Input Current
No-Load Input Current
Off Converter Input Current
Input Reflected-Ripple Current
Input Voltage Ripple Rejection
OUTPUT CHARACTERISTICS
Output Voltage Set Point
Output Voltage Adjustable Range
Output Voltage Regulation
Over Line
Over Load
Over Temperature
Total Output Voltage Range
Output Voltage Ripple and Noise
Peak-to-Peak
RMS
Output Current Range
Output Voltage Over-shoot at Start-up
Output DC Current-Limit Inception
DYNAMIC CHARACTERISTICS
Dynamic Load Response
Positive Step Change in Output Current
Negative Step Change in Output Current
Setting Time to 10% of Peak Devitation
Turn-On Transient
Start-Up Time, From On/Off Control
Start-Up Time, From Input
Output Voltage Rise Time
Maximum Output Startup Capacitive Load
EFFICIENCY
Vo=0.9V
Vo=1.2V
Vo=1.5V
Vo=1.8V
Vo=2.5V
Vo=3.3V
FEATURE CHARACTERISTICS
Switching Frequency
ON/OFF Control, (Logic High-Module ON)
Logic High
Logic Low
ON/OFF Current
Leakage Current
GENERAL SPECIFICATIONS
MTBF
Weight
DS_IPM04C0A0R06_08242006
Refer to figure 33 for measuring point
Typ.
0
-40
-55
3.0
3.3/5.0
2.4
2.1
Vin=Vin,min to Vin,max, Io=Io,max
3
100
TBD
P-P 1µH inductor, 5Hz to 20MHz
120 Hz
Vin=5.0V, Io=Io,max,
Vin=Vin,min to Vin,max
Io=Io,min to Io,max
Ta=-40°C to 85°C
Over sample load, line and temperature
5Hz to 20MHz bandwidth
Full Load, 1µF ceramic, 10µF tantalum
Full Load, 1µF ceramic, 10µF tantalum
0.889
0.8
6
116
125
Vdc
°C
°C
5.5
V
2.7
2.4
7.0
100
10
150
V
V
A
mA
mA
mAp-p
dB
% Vo,set
V
10
10
15
+3.0
mV
mV
mV
% Vo,set
100
15
6
3
mVp-p
mV
A
% Vo,set
% Io
150
150
25
190
190
50
mVpk
mVpk
µs
12
12
20
20
10
1000
5000
ms
ms
ms
µF
µF
50
10
0
0
200
10µF Tan & 1µF Ceramic load cap, 0.5A/µs
50% Io, max to 100% Io, max
100% Io, max to 50% Io, max
Units
0.911
3.3
0.900
-3.0
Vin=3.0V to 5.5V, Io=0A to 6A,
Max.
Io=Io.max
Time for Vo to rise from 10% to 90% of Vo,set,
Full load; ESR ≧1mΩ
Full load; ESR ≧10mΩ
5
5
5
Vin=5.0V, Io=Io,max,
Vin=5.0V, Io=Io,max,
Vin=5.0V, Io=Io,max,
Vin=5.0V, Io=Io,max,
Vin=5.0V, Io=Io,max,
Vin=5.0V, Io=Io,max,
Module On
Module Off
Ion/off at Von/off=0
Logic High, Von/off=5V
Io=80% Io,max,
80.0
83.0
86.0
88.0
91.0
93.0
%
%
%
%
%
%
300
kHz
2.2
-0.2
0.25
30.3
6
Vin,max
0.8
1
50
V
V
mA
µA
M hours
grams
2
ELECTRICAL CHARACTERISTICS CURVES
EFFICIENCY(%)
EFFICIENCY(%)
95
85
Vin=5.0V
Vin=4.0V
Vin=3.3V
85
Vin=5.0V
Vin=4.0V
Vin=3.3V
75
75
1
2
3
4
5
1
6
2
3
6
95
EFFICIENCY(%)
95
EFFICIENCY(%)
5
Figure 2: Converter efficiency vs. output current
(1.2V output voltage)
Figure 1: Converter efficiency vs. output current
(0.90V output voltage)
85
Vin=5.0V
Vin=4.0V
Vin=3.3V
85
Vin=5.0V
Vin=4.0V
Vin=3.3V
75
75
1
2
3
4
5
1
6
2
3
LOAD (A)
4
5
6
LOAD (A)
Figure 3: Converter efficiency vs. output current
(1.5V output voltage)
Figure 4: Converter efficiency vs. output current
(1.8V output voltage)
95
85
EFFICIENCY(%)
95
EFFICIENCY(%)
4
LOAD (A)
LOAD (A)
Vin=5.0V
Vin=4.0V
Vin=3.3V
Vin=5.5V
Vin=5.0V
Vin=4.0V
85
75
75
1
2
3
4
5
LOAD (A)
Figure 5: Converter efficiency vs. output current
(2.5V 0utput voltage)
DS_IPM04C0A0R06_08242006
6
1
2
3
4
5
6
LOAD (A)
Figure 6: Converter efficiency vs. output current
(3.3V output voltage)
3
ELECTRICAL CHARACTERISTICS CURVES
Figure 7: Output ripple & noise at 5.0Vin, 0.9V/ 6A out
Figure 8: Output ripple & noise at 5.0Vin, 1.2V/ 6A out
Figure 9: Output ripple & noise at 5.0Vin, 1.5V/ 6A out
Figure 10: Output ripple & noise at 5.0Vin, 1.8V/ 6A out
Figure 11: Output ripple & noise at 5.0Vin, 2.5V/ 6A out
Figure 12: Output ripple & noise at 5.0Vin, 3.3V /6A out
DS_IPM04C0A0R06_08242006
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ELECTRICAL CHARACTERISTICS CURVES
Figure 13: Power on waveform at 5.0vin, 0.9V/ 6A out
with application of Vin
Figure 14: Power on waveform at 5.0vin, 3.3V/ 6A out
with application of Vin
Figure 15: Power off waveform at 5.0vin, 0.9V/ 6A out
with application of Vin
Figure 16: Power off waveform 5.0vin, 3.3V/ 6A out
with application of Vin
Figure 17: Remote turn on delay time at 5.0vin,
0.9V/ 6A out
DS_IPM04C0A0R06_08242006
Figure 18: Remote turn on delay time at 5.0vin,
3.3V/ 6A out
5
ELECTRICAL CHARACTERISTICS CURVES
Figure 19: Turn on delay at 5.0vin, 0.9V/ 6A out
with application of Vin
Figure 21: Typical transient response to step load change at
0.5A/µS from 0% to 50% of Io, max at 5.0Vin,
2.5V out (measurement with a 1uF ceramic
and a 10µF tantalum
DS_IPM04C0A0R06_08242006
Figure 20: Turn on delay at 5.0vin, 3.3V/ 6A out
with application of Vin
Figure 22: Typical transient response to step load change at
0.5A/µS from 50% to 0% of Io, max at 5.0Vin,
2.5V out (measurement with a 1uF ceramic
and a 10µF tantalu)
6
TEST CONFIGURATIONS
DESIGN CONSIDERATIONS
Input Source Impedance
TO OSCILLOSCOPE
L
VI(+)
2 100uF
Tantalum
BATTERY
VI(-)
Note: Input reflected-ripple current is measured with a
simulated source inductance. Current is
measured at the input of the module.
Figure 23: Input reflected-ripple current test setup
To maintain low-noise and ripple at the input voltage, it is
critical to use low ESR capacitors at the input to the
module. Figure 26 shows the input ripple voltage
(mVp-p) for various output models using 2x100 uF low
ESR tantalum capacitors (KEMET P/N:T491D107M,
100uF/16V or equivalent) or 2x22 uF very low ESR
ceramic capacitors (TDK P/N:C3225X7S1C226MT,
22uF/16V or equivalent).
The input capacitance should be able to handle an AC
ripple current of at least:
Irms = Iout
Vout ⎛
Vout ⎞
⎜1 −
⎟
Vin ⎝
Vin ⎠
Arms
COPPER STRIP
Vo
SCOPE
Resistive
Load
GND
Note: Use a 10µF tantalum and 1µF capacitor. Scope
measurement should be made using a BNC
connector.
Figure 24: Peak-peak output noise and startup transient
measurement test setup
300
Input Ripple Voltage (mVp-p
1uF
10uF
tantalum ceramic
250
200
150
100
Tantalum
Ceramic
50
0
0
1
2
3
4
Output Voltage(Vdc)
CONTACT AND
DISTRIBUTION LOSSES
VI
Vo
II
Io
LOAD
SUPPLY
GND
CONTACT RESISTANCE
Figure 25: Output voltage and efficiency measurement test
setup
Note: All measurements are taken at the module
terminals. When the module is not soldered (via
socket), place Kelvin connections at module
terminals to avoid measurement errors due to
contact resistance.
η =(
Figure 26: Input ripple voltage for various output models,
Io = 6A (Cin = 2x100uF tantalum capacitors or
2x22uF ceramic capacitors at the input)
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the module. An
input capacitance must be placed close to the modules
input pins to filter ripple current and ensure module
stability in the presence of inductive traces that supply
the input voltage to the module.
Vo × Io
) × 100 %
Vi × Ii
DS_IPM04C0A0R06_08242006
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DESIGN CONSIDERATIONS
FEATURES DESCRIPTIONS
Safety Considerations
Over-Current Protection
For safety-agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements. The power module
has extra-low voltage (ELV) outputs when all inputs are
ELV.
The input to these units is to be provided with a
maximum 10A time-delay fuse in the ungrounded lead.
Remote On/Off
The IPM series power modules have an On/Off control
pin for output voltage remote On/Off operation. The
On/Off pin is an open collector/drain logic input signal
that is referenced to ground. When On/Off control pin is
not used, leave the pin unconnected.
The remote on/off pin is internally connected to +Vin
through an internal pull-up resistor. Figure 27 shows the
circuit configuration for applying the remote on/off pin.
The module will execute a soft start ON when the
transistor Q1 is in the off state.
The typical rise for this remote on/off pin at the output
voltage of 0.9V and 3.3V are shown in Figure 17 and 18.
To provide protection in an output over load fault
condition, the unit is equipped with internal over-current
protection. When the over-current protection is
triggered, the unit enters hiccup mode. The units
operate normally once the fault condition is removed.
Pre-Bias Startup Capability
The IPM would perform the monotonic startup into the
pre-bias loads; so as to avoid a system voltage drop
occur upon application. In complex digital systems an
external voltage can sometimes be presented at the
output of the module during power on. This voltage may
be feedback through a multi-supply logic component,
such as FPGA or ASIC. Another way might be via a
clamp diode as part of a power up sequencing
implementation.
Output Voltage Programming
The output voltage of IPM can be programmed to any
voltage between 0.9Vdc and 3.3Vdc by connecting one
resistor (shown as Rtrim in Figure 28, 29) between the
TRIM and GND pins of the module to trim up (0.9V ~
3.3V) and between the Trim and +Output to trim down
(0.8V ~ 0.9V). Without this external resistor, the output
voltage of the module is 0.9 Vdc. To calculate the value of
the resistor Rtrim for a particular output voltage Vo,
please use the following equation:
Trim up
Rtrim =
Vo
Vin
IPM
On/Off
7.0
Vadj. –0.9
- 0.187 (KΩ)
2.0
0.9 – Vadj.
- 10.187 (KΩ)
Trim Down
RL
Rtrim =
Q1
GND
Rtrim is the external resistor in KΩ
Vout is the desired output voltage
Figure 27: Remote on/off implementation
DS_IPM04C0A0R06_08242006
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FEATURES DESCRIPTIONS (CON.)
For example: to program the output voltage of the IPM
module to 3.3Vdc, Rtrim is calculated as follows:
Rtrim =
7.0
3.3 –0.9
- 0.187 (KΩ)
Rtrim = 2.729 KΩ
Figure 28:
Trim up Circuit configuration for programming
output voltage using an external resistor
IPM can also be programmed by applying a voltage
between the TRIM and GND pins (Figure 30). The
following equation can be used to determine the value of
Vtrim needed for a desired output voltage Vo:
Vout
Rtrim
Vtrim = 0.7168 – 0.0187Vo
Load
Trim
Vtrim is the external voltage in V
Vo is the desired output voltage
For example, to program the output voltage of a IPM
module to 3.3 Vdc, Vtrim is calculated as follows
GND
Figure 29:
Trim down Circuit configuration for programming
output voltage using an external resistor
Vtrim = 0.7168 – 0.0187 x 3.3
Vtrim = 0.6551V
Figure 30: Circuit configuration for programming output voltage
using external voltage source
DS_IPM04C0A0R06_08242006
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FEATURE DESCRIPTIONS (CON.)
Table 1 provides Rtrim values required for some common
output voltages, while Table 2 provides value of external
voltage source, Vtrim, for the same common output
voltages. By using a 0.5% tolerance resistor, set point
tolerance of ±2% can be achieved as specified in the
electrical specification.
Table 1
The amount of power delivered by the module is the
voltage at the output terminals multiplied by the output
current. When using the trim feature, the output voltage
of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the
maximum output power of the module must not exceed
the maximum rated power (Vo.set x Io.max ≤ P max).
Voltage Margining
VO (V)
0.9
1.2
1.5
1.8
2.5
3.3
Rtrim (Ω)
Open
23.146K
11.479K
7.590K
4.188K
2.729K
Table 2
VO (V)
0.9
1.2
1.5
1.8
2.5
3.3
Vtrim (V)
0.7000
0.6943
0.6887
0.6831
0.6700
0.6551
Output voltage margining can be implemented in the IPM
modules by connecting a resistor, Rmargin-up, from the Trim
pin to the ground pin for margining-up the output voltage
and by connecting a resistor, Rmargin-down, from the Trim pin
to the output pin for margining-down. Figure 31 shows
the circuit configuration for output voltage margining. If
unused, leave the trim pin unconnected.
Vo
Vin
IPM
Rmargin-down
Q1
On/Off
Trim
Rmargin-up
Rtrim
Q2
GND
Figure 31: Circuit configuration for output voltage margining
DS_IPM04C0A0R06_08242006
10
THERMAL CONSIDERATIONS
Thermal management is an important part of the system
design. To ensure proper, reliable operation, sufficient
cooling of the power module is needed over the entire
temperature range of the module. Convection cooling is
usually the dominant mode of heat transfer.
Hence, the choice of equipment to characterize the
thermal performance of the power module is a wind
tunnel.
Thermal Testing Setup
Delta’s DC/DC power modules are characterized in
heated vertical wind tunnels that simulate the thermal
environments encountered in most electronics
equipment. This type of equipment commonly uses
vertically mounted circuit cards in cabinet racks in which
the power modules are mounted.
Figure 33: Temperature measurement location
* The allowed maximum hot spot temperature is defined at 116℃.
The following figure shows the wind tunnel
characterization setup. The power module is mounted on
a test PWB and is vertically positioned within the wind
tunnel. The height of this fan duct is constantly kept at
25.4mm (1’’).
Thermal Derating
Heat can be removed by increasing airflow over the
module. To enhance system reliability, the power
module should always be operated below the maximum
operating temperature. If the temperature exceeds the
maximum module temperature, reliability of the unit may
be affected.
PWB
FACING PWB
MODULE
AIR VELOCITY
AND AMBIENT
TEMPERATURE
MEASURED BELOW
THE MODULE
50.8 (2.0”)
AIR FLOW
12.7 (0.5”)
25.4 (1.0”)
Figure 32: Wind tunnel test setup
DS_IPM04C0A0R06_08242006
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THERMAL CURVES (CON.)
IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin=5V, Vout = 3.3V (Either Orientation)
Output Current(A)
7
7
6
6
5
5
Natural
Convection
4
3
2
2
1
1
0
35
45
55
65
IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin=5V, Vout = 1.8V (Either Orientation)
Output Current(A)
25
7
6
5
5
Natural
Convection
35
45
Output Current(A)
65
75
85
Ambient Temperature (℃)
IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin=3.3V, Vout =1.5V (Either Orientation)
Natural
Convection
4
3
3
2
2
1
1
0
55
Figure 37: Output current vs. ambient temperature and air velocity
@ Vin=3.3V, Vo=2.5V(Either Orientation
6
4
Natural
Convection
0
75
85
Ambient Temperature (℃)
Figure 34: Output current vs. ambient temperature and air velocity
@ Vin=5V, Vout=3.3V(Eithere Orientation)
7
IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin=3.3V, Vout = 2.5V (Either Orientation)
4
3
25
Output Current(A)
0
25
35
45
55
65
75
85
Ambient Temperature (℃)
Figure 35: Output current vs. ambient temperature and air velocity
@ Vin=5V, Vout=1.8V(Either Orientation)
7
Output Current(A)
IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin=3.3V, Vout = 2.5V (Either Orientation)
25
45
65
75
85
Ambient Temperature (℃)
@ Vin=3.3V, Vout=1.5V(Either Orientation)
7
6
5
5
Output Current(A)
IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin=3.3V, Vout =0.9V (Either Orientation)
Natural
Convection
4
Natural
Convection
55
Figure 38: Output current vs. ambient temperature and air velocity
6
4
35
3
3
2
2
1
1
0
0
25
35
45
55
65
75
85
Ambient Temperature (℃)
25
35
45
55
65
75
85
Ambient Temperature (℃)
Figure 36: Output current vs. ambient temperature and air velocity
Figure 39: Output current vs. ambient temperature and air velocity
@ Vin=3.3V, Vout=2.5V(Eithere Orientation)
@ Vin=3.3V, Vout=0.9V(Either Orientation)
DS_IPM04C0A0R06_08242006
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PICK AND PLACE LOCATION
SURFACE-MOUNT TAPE & REEL
All dimensions are in millimeters (inches)
All dimensions are in millimeters (inches)
LEAD FREE PROCESS RECOMMEND TEMP. PROFILE
Temp.
Peak Temp. ~ 220 ℃
210℃
Ramp down
max. 4℃ /sec
200℃
150℃
Preheat time
90~150 sec
Time Limited 60 sec
above 210℃
Ramp up
max. 3℃ /sec
25℃
Time
Note: All temperature refers to topside of the package, measured on the package body surface.
LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Temp.
Peak Temp. ~ 225 ℃
Ramp down
max. 4℃ /sec
183℃
150℃
100℃
Preheat time
60~150 sec
60 ~ 120 sec
Ramp up
max. 3℃ /sec
25℃
Time
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
DS_IPM04C0A0R06_08242006
13
MECHANICAL DRAWING
SMD PACKAGE
SIP PACKAGE
1 2 3 4 5
RECOMMEND PWB HOLE LAYOUT
RECOMMEND PWB PAD LAYOUT
Note: The copper pad is recommended to connect to the ground
7
6
1 2 3 4 5
1 2 3 4 5
Note: All dimension are in millimeters (inches) standard dimension tolerance is± 0.10(0.004”)
DS_IPM04C0A0R06_08242006
14
PART NUMBERING SYSTEM
IPM
04
C
0A0
R
06
Product
Family
Input Voltage
Number of
Outputs
Output Voltage
Package
Output
Current
06 - 6A
Integrated POL 04 - 3V ~ 5.5V C - Low current
0A0 – programmable
R - SIP
12 - 8V ~ 14V
output
S - SMD
Module
F
A
Option Code
F- RoHS 6/6
A - Standard Functions
(Lead Free)
MODEL LIST
Model Name
Packaging
Input Voltage
Output Voltage
Output Current
Efficiency (Typical @ full
IPM12C0A0R04FA
SIP
8V ~14V
0.8V ~ 5V
4A
91%
IPM12C0A0S04FA
SMD
8V ~14V
0.8V ~ 5V
4A
91%
IPM04C0A0R06FA
SIP
3V ~ 5.5V
0.8V ~ 3.3V
6A
93%
IPM04C0A0S06FA
SMD
3V ~ 5.5V
0.8V ~ 3.3V
6A
93%
CONTACT: www.delta.com.tw/dcdc
USA:
Telephone:
East Coast: (888) 335 8201
West Coast: (888) 335 8208
Fax: (978) 656 3964
Email: DCDC@delta-corp.com
Europe:
Phone: +41 31 998 53 11
Fax: +41 31 998 53 53
Email: DCDC@delta-es.com
Asia & the rest of world:
Telephone: +886 3 4526107 ext 6220
Fax: +886 3 4513485
Email: DCDC@delta.com.tw
WARRANTY
Delta offers a two (2) year limited warranty. Complete warranty information is listed on our web site or is available upon
request from Delta.
Information furnished by Delta is believed to be accurate and reliable. However, no responsibility is assumed by Delta
for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of Delta. Delta reserves the right to revise these
specifications at any time, without notice.
DS_IPM04C0A0R06_08242006
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