DYNEX MF34-1400

MF34
MF34
Fast Recovery Diode
Replaces March 1998 version, DS4624-2.1
DS4624-3.0 January 2000
KEY PARAMETERS
VRRM
1600V
IF(AV)
40A
IFSM
400A
Qr
25µC
trr
0.25ns
APPLICATIONS
■ Inverse, Parallel Or Series Connected Diode
■ Power Supplies
■ High Frequency Applications
FEATURES
■ Glass Passivation
■ High Voltage Capability
■ Fast Recovery Characteristics
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
VRRM
V
MF34 - 1600
MF34 -1400
MF34 - 1200
MF34 -1000
MF34 - 800
1600
1400
1200
1000
800
Conditions
VRSM = VRRM +100V
Lower voltage grades available.
For stud anode add suffix 'R' to type number. e.g. MF34-1600R.
Outline type code: DO5.
See Package Details for further information.
CURRENT RATINGS
Symbol
Parameter
Conditions
Max.
Units
IF(AV)
Mean forward current
Half sine wave resistive load, Tcase = 65oC
40
A
IF(RMS)
RMS value
Tcase = 65oC
63
A
Continuous (direct) forward current
Tcase = 65oC
50
A
IF
1/7
MF34
SURGE RATINGS
Symbol
Conditions
Parameter
Max.
Units
IFSM
Surge (non-repetitive) forward current
10ms half sine; with VRRM ≤ 10V, Tj = 125oC
400
A
I2t
I2t for fusing
10ms half sine; Tj = 125oC
800
A2s
THERMAL AND MECHANICAL DATA
Conditions
Parameter
Symbol
Min.
Max.
Units
Rth(j-c)
Thermal resistance - junction to case
dc
-
0.8
o
Rth(c-h)
Thermal resistance - case to heatsink
Mounting torque 3.5Nm
with mounting compound
-
0.2
o
Forward (conducting)
-
125
o
Reverse (blocking)
-
125
o
Storage temperature range
-55
125
˚C
Mounting torque
3.5
4.0
Nm
Typ.
Max.
Units
Tvj
Tstg
-
C/W
C/W
C
Virtual junction temperature
C
CHARACTERISTICS
Symbol
2/7
Parameter
Conditions
o
VFM
Forward voltage
At 120A peak, Tcase = 25 C
-
2.0
V
IRM
Peak reverse current
At VRRM, Tcase = 100oC
-
5
mA
trr
Reverse recovery time
IF = 1A, diRR/dt = 25A/µs, Tcase = 25˚C,
VR = 100V
-
250
ns
QR
Recovered charge
IF = 50A, diRR/dt = 50A/µs, Tcase = 25˚C,
VR = 100V
-
25
µC
VTO
Threshold voltage
At Tvj = 125 C
-
1.2
V
rT
Slope resistance
At Tvj = 125 C
-
7.0
mΩ
o
o
MF34
CURVES
Instantaneous forward current - (A)
200
Measured under pulse
conditions
Tj = 25˚C
150
Tj = 125˚C
100
50
0
0
1.0
2.0
3.0
Instantaneous forward voltage - (V)
400
1.00
Tcase = 125˚C
VR = VRRM
Thermal impedance - ˚C/W
Peak half sinewave forward current - (A)
Fig.1 Maximum (limit) forward characteristics
350
300
250
200
1
2
3 45
10
50
Cycles at 50Hz
Duration
Fig.2 Surge (non-repetitive) forward current vs time
d.c.
0.75
0.50
0.25
0
0.001
0.01
0.1
Time - (s)
1.0
10
Fig.3 Maximum transient thermal impedance
3/7
MF34
Peak current - (A)
500
Tcase = 65˚
100
50
10
00
0
10
10
50
00
25
00
10
00
50
0
H
10 z
0
30
0
100
1000
Pulse width - (µs)
10000
Fig.4 Frequency curves - square waveform
Peak current - (A)
500
Tcase = 85˚
100
50
10
00
0
10
10
50
00
25
10
00
00
50
0
30
100
1000
Pulse width - (µs)
0
H
10 z
0
10000
Fig.5 Frequency curves - square waveform
500
Peak current - (A)
0.05
0.1
0.2
0.5
1.0
2.0J
100
10
10
100
1000
Pulse width - (µs)
Fig.6 Energy per pulse - square waveform
4/7
10000
MF34
Peak current - (A)
500
Tcase = 65˚
100
10
00
0
10
10
50
00
25
00
10
00
50
0
50
H
10 z
0
30
0
100
1000
Pulse width - (µs)
10000
Fig.7 Frequency curves - sine waveform
Peak current - (A)
500
Tcase = 85˚
100
10
00
0
10
10
50
00
25
00
10
00
50
0
100
1000
Pulse width - (µs)
50
H
10 z
0
30
0
10000
Fig.8 Frequency curves - sine waveform
500
Peak current - (A)
0.05 0.1
0.2
0.5
1.0
2.0J
100
10
10
100
1000
Pulse width - (µs)
10000
Fig.9 Energy per pulse - sine waveform
5/7
MF34
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Hex. 17.35mm AF max
23
Ø4.0
11.5
Thread 1/4 in
28 UNF 2A
Weight: 20g
Package outline type code: DO5
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
AN4506
Thyristor and diode measurement with a multi-meter
AN4853
Use of V , r on-state characteristic
AN5001
TO
6/7
T
MF34
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4624-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
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