EDI BRUS520

BRUS1 BRUS5
MINIBRIDGE
50 ns. ULTRA-FAST RECOVERY
4 to 6 AMPERES
SINGLE-PHASE, FULL-WAVE BRIDGES
HEAT SINK CHASSIS PC BOARD MOUNTING
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BRUS5
Th ogra
5A PC BOARD MOUNTING
pr
6A HEAT SINK MOUNTING
BRUS1
3A PC MOUNTING
4A HEAT SINK MOUNTING
PRV/LEG
50V
BRUS1 SERIES
BRUS105
BRUS5 SERIES
BRUS505
100V
200V
400V
500V
600V
BRUS110
BRUS120
BRUS140
BRUS150
BRUS160
BRUS510
BRUS520
BRUS540
BRUS550
BRUS560
ELECTRICAL CHARACTERISTICS PER LEG
(at TA =25 C U nle ss O the rwis e Sp eci fie d)
SERIES DESIGNATION
BRUS1
BRUS5
UNITS
4
6
Amps
3
5
Amps
BRUS1 Series = 2A
Max. Forward Voltage Drop, IF BRUS5
Series = 4A
1.3
1.3
Volts
Max.DC Reverse Current @ PRV and 25 C , IR
10
10
A
Max.DC Reverse Current @ PRV and 100 C ,IR
200
200
A
Max.Reverse Recovery Time,Trr (Fig.3)
50
50
Nanosec.
Max.Peak Surge Current, lFSM (8.3ms) (Fig.2)
100
240
Amps
O
Average Output Current, lo @ 60 C Tc (Fig.1)
O
Average Output Current, lo @ 80 C TL (Fig.2)
Storage Temperature Range, TSTG
-55 to+150
o
Ambient Operating Temperature Range,TA
-55 to+150
o
Thermal Resistance (Total Bridge), R0- j-c
7.7 typ.
8.7 typ.
C
C
o
C/W
NOTE: A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
EDI reserves the right to change these specifications at any time without notice.
BRUS1 BRUS5
FIG.2
NON-REPETITIVE SURGE CURRENT
FIG.1
CURRENT DERATING
1000
BRUS5
MAX. PEAK SURGE CURRENT I FSM
L
lO. AVERAGE FORWARD CURRENT (AMP)
6
5
4
BRUS1
3
2
1
0
500
300
200
100
BRU
S5
50
30
BRU
20
S1
10
0
25
75
50
100
125
150
1
Tc
5
2
10
20
50
100
NUMBER OF CYCLES AT 60 CPS
O
=TEMPERATURE ( C)
FIG.3
REVERSE RECOVERY TEST METHOD
T RR
R1
50 OHM
ZERO
PULSE
GENERATOR
-
1.0A
D.U.T.
+
REFERENCE
0.5A
R2
1 OHM
0.25A
SCOPE
BRUS MECHANICAL OUTLINE
R1, R2 NON-INDUCTIVE RESISTORS
PULSE GENERATOR - HEWLETT
PACKARD 214A OR EQUIV.
IKC REP.RATE, 10 SEC. PULSE WIDTH
ADJUST PULSE AMPLITUDE FOR PEAK IR
BRUS5 MECHANICAL OUTLINE
Dielectric test voltage 2,500 V rms.,max. 50-60Hz
D
AC
A
+
.160
.140
B
.700
.660
.760Max.
_
C
F
LTR
INCHES
MILLIMETERS
A
B
.411-.441
.137-.167DIA
3.48-4.24DIA
C
.590-.610
14.99-15.49
D
E
F
.038-.042
.750MIN
.300MAX
.97-1.07
19.05MIN
7.62MAX
1.0Min.
10.44-11.20
.280
.260
.185
.165
45
E
A
AC
.935
.895
.075R.Typ.
(2 Places)
.085
.065
.455
.405
.205
.185
.260
.180
.220
.180
.052
.048
Maximum lead and terminal temperature for soldering, 3/8 inch from case, 5 seconds at 250 C.
A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
* YONKERS. NEW YORK 10710 914-965-4400
Ee-mail:[email protected] *Wwebsite: www.edidiodes.com
* FAX 914-965-5531
* 1-800-678-0828