BLV6N60 N-channel Enhancement Mode Power MOSFET • Avalanche Energy Specified BVDSS 600V • Fast Switching RDS(ON) 1.2Ω Ω • Simple Drive Requirements ID 6A Description This advanced high voltage MOSFET is produced using Belling’s proprietary DMOS technology. Designed for high efficiency switch mode power supply. Absolute Maximum Ratings ( TC=25oC unless otherwise noted ) Symbol Parameter Value Units VDS Drain-Source Voltage 600 V VGS Gate-Source Voltage + 20 V 6 A Continuous Drain Current ( TC=100 oC) 3.8 A Drain Current (pulsed) 24 A 125 W 1 W/℃ 490 mJ Continuous Drain Current ID IDM (Note 1) Power Dissipation PD Linear Derating Factor EAS Single Pulsed Avalanche Energy (Note 2) IAR Avalanche Current (Note 1) 6 A EAR Repetitive Avalanche Energy (Note 1) 12.5 mJ Tj Operating Junction Temperature Range TSDG Storage Temperature Range -55 to +150 o -55 to +150 o C C Thermal Characteristics Symbol Parameter Rth j-c Thermal Resistance, Junction to case Rth j-a Thermal Resistance, Junction to Ambient Max. -1Total 6 Pages Max. Value Units 1 ℃/ W 62.5 ℃/ W BLV6N60 N-channel Enhancement Mode Power MOSFET Electrical Characteristics ( TC=25C unless otherwise noted ) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 600 - - V ∆BVDSS /∆TJ Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA - 0.6 - V/℃ RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=3A - - 1.2 Ω VGS(th) Gate Threshold Voltage 2 - 4 V g fs Forward Transconductance (note3) VDS=15V, ID=3A - 5 - S IDSS Drain-Source Leakage Current Drain-Source Leakage Current Tc=125℃ VDS=600V, VGS=0V - - 1 uA VDS=480V, VGS=0V - - 100 uA IGSS Gate-Source Leakage Current VGS= ± 20V - - ±100 nA Qg Total Gate Charge - 35.5 - nC Qgs Gate-Source Charge VDD=480V ID=6A VGS=10V - 8.1 - nC Qgd Gate-Drain Charge - 14.1 - nC t (on) Turn-on Delay Time - 14 - ns tr Turn-on Rise Time - 19 - ns t (off) Turn-off Delay Time - 40 - ns tf Turn-off Fall Time - 26 - ns Ciss Input Capacitance - 1074 - pF Coss Output Capacitance - 158 - pF Crss Reverse Transfer Capacitance - 29 - pF VDS=VGS, ID=250uA (note3) VDD=300V ID=6A RG=25Ω note3 (note3) VDS=25V VGS=0V f = 1MHz Source-Drain Diode Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Units IS Continuous Source Diode Forward Current - - 6 A ISM Pulsed Source Diode Forward Current (note1) - - 24 A VSD Forward On Voltage VGS=0V, IS=6A - - 1.4 V trr Reverse Recovery Time VGS=0V, IS=6A(note3) - 1020 - ns Qr r Reverse Recovery Charge dIF/dt =100A/us - 2 - uC Note： (1) Repetitive Rating: Pulse width limited by maximum junction temperature (2) L=25mH, Ias=6A，Vdd=50V，Rg=25Ω，staring Tj=25C (3) Pulse width ≤ 300 us; duty cycle ≤ 2% -2Total 6 Pages BLV6N60 N-channel Enhancement Mode Power MOSFET Typical Characteristics Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. Normalized BVdss vs. Junction Temperature Fig 4. Normalized On-Resistance vs. Junction Temperature -3Total 6 Pages BLV6N60 N-channel Enhancement Mode Power MOSFET Typical Characteristics （continued） ） Fig 5. On-Resistance Variation vs. Drain Current and Gate Voltage Fig 6. Body Diode Forward Voltage Variation vs. Source Current and Temperature Fig 7. Gate Charge Characteristics Fig 8. Capacitance Characteristics -4Total 6 Pages BLV6N60 N-channel Enhancement Mode Power MOSFET Typical Characteristics （continued） ） Fig 9. Maximum Safe Operating Area Fig 10. Transient Thermal Response Curve -5Total 6 Pages BLV6N60 N-channel Enhancement Mode Power MOSFET Test Circuit and Waveform Fig 11. Gate Charge Circuit Fig 12. Gate Charge Waveform Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform Fig 15. Unclamped Inductive Switching Test Circuit Fig 16. Unclamped Inductive Switching Waveforms -6Total 6 Pages