EUTECH EUP7171

EUP7171
2A Sink/Source Bus Termination
Regulator
DESCRIPTION
FEATURES
The EUP7171 is a high performance linear regulator
designed to provide power for termination of a DDR
memory bus. It significantly reduces parts count, board
space and overall system cost over previous switching
solutions.
The EUP7171 contains a high-speed operational
amplifier to provide excellent response to load transients.
It also has an independent power source pin (VCNTL)
for achieving better output driving capability. The
regulator can both sink and source up to 2A current. The
output termination voltage can be tightly regulated to
track 1/2 VDDQ by two external voltage divider resistors.
The EUP7171, used in conjunction with series
termination resistors, provides an excellent voltage
source for active termination schemes of high speed
transmission lines as those seen in high speed memory
buses. A typical DDR memory system is seen in Figure 1.
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APPLICATIONS
z
Simplified System Diagram
Figure1.
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Compatible with DDR-I (1.25VTT) or DDR-II
(0.9VTT) SDRAM Systems.
Low Quiescent Current (1.1mA)
Fast Transient Response Time
Capable of Sourcing and Sinking 2A
Adjustable VOUT by Two External Resistors
Current Limiting Protection
Over-Temperature Protection
High Accuracy Output Voltage at Full-Load
Low External Component Count
Available in SOP-8 Exposed Pad Package
RoHS Compliant and 100% Lead (Pb)-Free
DDR SDRAM Termination Voltage
EUP7171
Pin Configurations
Part Number
Pin Configurations (TOP VIEW)
EUP7171
(Plastic SOP-8)
Pin Description
PIN
SYMBOL
DESCRIPTION
1
VIN
Power Input pin
2
GND
3
VREF
4
VOUT
Ground
Reference voltage input and chip enable (Chip
enable when REFEN > 0.8V)
Output voltage for regulation terminator voltage
6
VCNTL
Gate driver voltage
5,7,8
NC
NC
Typical Application Circuit
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EUP7171
Ordering Information
Order Number
Package Type
EUP7171DIT1
SOP-8
EUP7171DIR1
SOP-8
EUP7171
Marking
xxxx
EUP7171
xxxx
EUP7171
□ □ □ □
Lead Free Code
1: Lead Free 0: Lead
Packing
T: Tube
R: Tape & Reel
Operating temperature range
I: Industry Standard
Package Type
D: SOP
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Operating Temperature range
-40°C to 125°C
-40°C to 125°C
EUP7171
Absolute Maximum Ratings
„
„
„
„
„
„
„
Input voltage - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Power dissipation - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ESD rating - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -Maximum junction temperature - - - - - - - - - - - - - - - - - - - - - - - - - Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - - - Lead temperature (soldering , 5 sec) - - - - - - - - - - - - - - - - - - - - - Package thermal resistance SOP-8 (FD) , θjA - - - - - - - - - - - - - - - - - -
6V
Internal limiting
2KV
150 °C
-65°C to150°C
260 °C
42.3 °C/W
Electrical Characteristics
(Limits in standard typeface are for TA=25 °C, unless otherwise specified:
VIN=2.5V/1.8V, VCNTL=3.3V, VREF=1.25V/0.9V, COUT=10µf (Ceramic)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VOS
Output Offset Voltage
IOUT = 0A, (Note1)
-20
0
20
mV
-20
0
20
mV
2.5/1.8
--
IL : 0 →2A(DDRI)/1.5(DDRII)
Load Regulation
ΔVLOAD
IL : 0 → -2A(DDRI)/-1.5(DDRII)
VIN
Input Voltage Range
(DDR I / DDR I I )
Keep VCNTL ≥ VIN on operation
power on and power off
sequences
---
3.3
5.5
IVCNTL
Operating Current of
VCNTL
IL = 0A
--
1.4
2
mA
ISHDN
Current in Shutdown mode
VREF < 0.2V
--
60
110
µA
2.2
--
--
A
--
157
--
°C
Guaranteed by design
--
40
--
°C
Output = High
Output = Low
0.8
--
--
--
--
0.2
VCNTL
V
Short Circuit Protection
ILIMIT
Current Limit
Over Temperature Protection
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
TSD
TSD _HYS
Shutdown function
VIH
VIL
Shutdown Threshold
Note 1: VOS offset is the voltage measurement defined as VOUT subtracted from VREF.
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V
EUP7171
Typical Operating Characteristics
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EUP7171
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EUP7171
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EUP7171
Function Block Diagram
Pin Functions
VCNTL and VIN
VCNTL and VIN are the input supply pins for the
EUP7171. VIN provides the rail voltage for VOUT
generation. VCNTL is used to supply the internal
control circuitry. The limitation on input voltage
selection is that VIN must be equal to or lower than
VCNTL. For DDR I application, a separation
connection of VIN and VCNTL to 2.5V and 3.3V
respectively can achieve better output drive capability.
Resistance) connected at VOUT is recommended.
Thermal dissipation should be considered if the large
current continues with long duration time. If the
junction temperature exceeds the thermal shutdown
point, the VOUT will turn to tri-state.
Component Selection
In order to obtain the best performance from the
EUP7171, using lower ESR capacitor is necessary to
Cin and Cout for high current load. The ESR of the
output bulk capacitor primarily affects the capability
to deliver a current surge within a specified delta
voltage drop (ΔV) at VOUT. With a given capacitor
ESR, the ΔV drop will be proportional to the load
current, and a step in voltage drop will occur.
(ΔVstep-peak = ESR * IL), the SSTL-2 spec
indicates a maximum delta voltage drop of 40mV.
VREF
REFEN is an external reference input for the
EUP7171. For SSTL-2 applications, VREF should be
a 1.25V that the regulator can trace for termination
voltage VOUT. It is recommended to place a 0.01uF
to 0.1uF bypass capacitor at close to the VREF pin.
An additional function included in the VREF is an
active low shutdown. When VREF is pulled low the
VOUT output will tri-state providing a high
impedance output. A power savings advantage can be
obtained in this mode through lower quiescent
current.
A very good, low ESR electrolytic capacitor of no less
than 470uF should be placed next to the terminator,
which should be placed as possible to memory array.
It might be possible to reduce the total capacitance,
provided the performance remains stable. Examine the
behavior of the VOUT bus carefully when the system
is operating and verify that deviations in the bus
voltage do not exceed the DDR specification (+/-40
mV).
VOUT
VOUT provides a regulated output for termination
bus usage. It is capable of sinking and sourcing
current while regulating the output voltage precisely
at REFEN. The regulator is designed to handle
continue current up to +/-2A with fast transient
response. If the application requires high load
current with low voltage dropped, a large output
capacitor with lower ESR(Equivalent Series
DS7171 Ver1.0 Mar. 2005
REFEN input is needed a high-frequency decoupling
capacitor (CSS). A 0.1uf ceramic capacitor should be
placed as possible to REFEN.
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EUP7171
PCB Layout Considerations
The EUP7171 regulator is packaged in plastic SOP-8
package. This small footprint package is unable to
convectively dissipate at high current levels. The
junction temperature should be kept well away from
the thermal shutdown temperature in normal
operation. To do this, care should be taken to derate
the part dependent on several variables: the thickness
of copper on PCB; the area of top side copper used
and the airflow. Since multiple GND pins on the
SOP-8 package are internally connected, the lowest
thermal resistance will result if these pins are tightly
connected on larger ground traces and more copper on
top side of the printed circuit board.
If the large ground trace around the IC is unavailable
on top, numerous vias from the ground connection to
the internal ground plane will help. The vias should be
small enough to retain solder when the board is wavesoldered.
Additional improvements can be achieved with a
constant airflow across the package.
Test Circuit
Figure 2. Load transient (+2A ~ –2A) test circuit
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EUP7171
Packaging Information
X
Y
Z
Standard Solder Map
Bottom
Ues as much
copper area
as possible
Symbols
A
B
C
D
E
H
F
L1
L2
M
N
A1
B1
EXPOSED PAD
Dimension in Millimeters
Min.
Max.
4.80
5.00
5.80
6.20
3.80
4.00
1.194
1.346
1.45
1.55
0.00
0.10
0.33
0.51
0.19
0.25
0.40
1.27
0°
8°
40°
50°
2.6
2.8
2.4
2.6
Dimension in Inches
Min.
Max.
0.189
0.197
0.228
0.244
0.150
0.157
0.047
0.053
0.057
0.061
0.000
0.004
0.013
0.020
0.007
0.010
0.016
0.050
0°
8°
40°
50°
0.102
0.110
0.095
0.102
8 – Lead SOP(FD) Plastic Package
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