EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED – 1W EHP-AX08LS/SUR01A-P01 Features z z z z z z Feature of the device: small package with high efficiency Typical view angle: 130°. Typical light flux output: 42 lm @ 350mA. ESD protection. Soldering methods: SMT. Grouping parameter: total luminous flux, dominant wavelength z Typical optical efficiency: 46 lm/W. z Thermal resistance (junction to lead): 15 K/W. z The product itself will remain within RoHS compliant version Applications z z z z TFT LCD display backlight Decorative and entertainment illumination Signal and symbol luminaries for orientation marker lights (e.g. steps, exit ways, etc.) Exterior and interior automotive illumination Materials Items Description Housing black body Heat resistant polymer Encapsulating Resin Silicone resin Lens Silicone Electrodes Ag plating copper alloy Die attach Silver paste Chip AlGaInP Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 1 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 Dimensions Notes: 1. Dimensions are in millimeters. 2. Tolerances unless dimensions ±0.25mm. Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 2 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 Maximum Ratings (T Ambient=25ºC) Parameter Symbol Rating Unit Operating Temperature Topr -40 ~ +100 ºC Storage Temperature Tstg -40 ~ +110 ºC Junction temperature Tj 125 ºC Pulse Forward Current IF 500 mA Power Dissipation Pd 2.0 W Junction to heat-sink thermal resistance Rth 15 K/W Electro-Optical Characteristics (TAmbient=25ºC) Parameter Luminous Flux(1) Forward Voltage(2) Bin Min Typ. Max J3 33 ---- 39 J4 39 ---- 45 45 ---- 52 K1 52 ---- 60 U2 2.05 ---- 2.35 2.35 ---- 2.65 2.65 ---- 2.95 ---- 130 ---- 620 ---- 625 625 ---- 630 J5 U3 Symbol Фv VF U4 Viewing Angle(3) ---- 2θ1/2 R5 Wavelength(4) R6 λd Unit Condition lm IF=350mA V deg nm Note. 1. Luminous Flux measurement tolerance: ±10% 2. Forward Voltage measurement tolerance: ±0.1V 3. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 4. Wavelength measurement tolerance : ±1nm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 3 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 Typical Electro-Optical Characteristics Curves Forward Voltage vs Forward Current, T Ambient=25ºC Relative Spectral Distribution, IF=350mA, T Ambient=25ºC 2.6 0.8 Forward Voltage (V) Relative Luminous Intenstiy 1.0 0.6 0.4 0.2 0.0 400 500 600 700 800 2.4 2.2 2.0 1.8 0 100 200 Wavelength(nm) 400 500 Forward Current (mA) Forward Current Derating Curve, Derating based on TjMAX=125°C Relative Luminous Intensity vs Forward Current, T Ambient=25ºC 1.6 400 1.4 Forward Current (mA) Relative Luminous Intensity 300 1.2 1.0 0.8 0.6 0.4 350 300 250 200 150 0.2 100 0.0 0 100 200 300 400 500 0 20 40 60 80 100 o Ambient Temperature ( C) Forward Current (mA) Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 4 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 Typical Representative Spatial Radiation Pattern Relative Luminous Intensity 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2θ) Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 5 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 Label explanation CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Dominant Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Tube Packing Specifications 1. Tube 2. Inner Carton 3. Outside Carton z Packing Quantity 1. 60 Pcs / Per Tube 2. 20 Tubes / Inner Carton 3. 12 Inner Cartons / Outside Carton Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 6 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 Precautions For Use 1. Over-current-proof Though EHP-A08 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. Storage i. Do not open moisture proof bag before the products are ready to use. ii. Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. iii. The LEDs should be used within a year. iv. After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less. v. The LEDs should be used within 168 hours (7 days) after opening the package. vi. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. vii. Pre-curing treatment : 60±5℃ for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A08 series LED package should be mounted on a metal core printed circuit board (MCPCB) with proper thermal connection to dissipate approximately 1W of thermal energy under 350mA operation. ii. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. iii. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 4. Soldering Condition Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 7 of 8 EVERLIGHT ELECTRONICS CO.,LTD. EHP-AX08LS/SUR01A-P01 i. Lead reflow soldering temperature profile ii. Reflow soldering should not be done more than two times. iii. While soldering, do not put stress on the LEDs during heating. iv. After soldering, do not warp the circuit board 5. Soldering Iron i. For prototype builds or small series production runs it is possible to place and solder the LED by hand. ii. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. iii. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. iv. Be careful because the damage of the product is often started at the time of the hand solder. Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1.0 Device No. : Prepared date: Mar 05, 2008 Prepared by: Jessie Chueh Page: 8 of 8