EVERLIGHT R3DB-AFGC

Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Features
․High luminous intensity output
․Oval Shape
․Well defined spatial radiation
․Wide viewing angle (2θ1/2) : 110o / 50 o
․UV resistant epoxy
․The product itself will remain within RoHS compliant version
Descriptions
․This precision optical performance oval LED is specifically
designed for passenger information signs
․This lamp has matched radiation patterns with yellow, blue
or green mixing color applications
Applications
․Color Graphic Signs
․Message boards
․Variable message signs (VMS)
․Commercial outdoor advertising
Device Selection Guide
LED Part No.
3474AN/R3DB-AFGC/R/MS
3474AN/R3DB-AFGC/PR/MS
Chip Material Emitted Color
AlGaInP
Brilliant Red
Lens Color
Red Diffused
Stopper
No
Yes
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 1 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Package Dimensions
Stopper Type
No Stopper Type
Notes:
․Other dimensions are in millimeters, tolerance is 0.25mm except being specified.
․Protruded resin under flange is 1.5mm Max LED.
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 2 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Absolute Maximum Rating (Ta=25℃)
Parameter
Forward Current
Pulse Forward Current (Duty1/10@ 1KHz)
Operating Temperature
Storage Temperature
Soldering Temperature
Power Dissipation
Reverse Voltage
Electrostatic Discharge
Symbol
IF
Absolute Maximum Rating
50
Unit
mA
IFP
160
mA
Topr
Tstg
Tsol
Pd
VR
ESD
-40 ~ +85
-40 ~ +100
260
120
5
2K
℃
℃
℃
mW
V
V
Notes: Soldering time≦5 seconds.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Luminous Intensity
Viewing Angle
Peak Wavelength
Dominant Wavelength
Spectrum Half width
Forward Voltage
Reverse Current
Symbol
IV
2θ1/2
λp
λd
Δλ
VF
IR
Min.
510
--620
-2.0
--
Typ.
-X:110Y:50
632
-20
---
Max.
1020
--632
-2.6
10
Unit
mcd
deg
Condition
nm
IF=20mA
V
μA
VR=5V
Rank Combination (IF=20mA)
Rank
Luminous Intensity
F1
F2
G1
G2
510~610
610~720
720~860
860~1020
*Measurement Uncertainty of Luminous Intensity: ±10%
Rank
1
2
Dominant Wavelength
620~626
626~632
Unit:mcd
*Measurement Uncertainty of Dominant Wavelength ±1.0nm
Unit:nm
Everlight Electronics Co., Ltd.
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Rev 1
Page: 3 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength
Forward Current vs. Forward Voltage
50
Forward Current(mA)
Relative Intensity(a.u.)
1.0
0.8
0.6
0.4
0.2
0.0
500
550
600
650
40
30
20
10
0
1.0
700
1.5
2.0
Relative Intensity vs. Ambient Temp.
1.5
1.0
0.5
0.0
25
30
35
40
45
50
55
2.5
3.0
3.5
Forward Voltage(V)
60
65
70
Relative Luminous Intensity(a.u.)
Relative Luminous Intensity(a.u.)
Wavelength(nm)
2.0
2.5
Relative Intensity vs. Forward Current
2.0
1.5
1.0
0.5
0.0
0
10
O
20
30
40
50
Forward Current(mA)
Ambient Temperature Ta( C)
Forward Current vs. Ambient Temp.
Radiation Characteristics
Forward Current(mA)
60
50
40
30
20
10
0
0
20
40
60
80
100
O
Ambient Temperature Ta( C)
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 4 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Taping Dimensions
Everlight Electronics Co., Ltd.
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Rev 1
Page: 5 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Taping Sizes
Specifications
Symbol Items
Symbol
Avg.
mm
Inch
Tolerance
(mm)
Tape Feed Hole Diameter
D
4.00
0.157
±0.2
Component Lead Pitch
F
2.54
0.100
±0.3
△H
2.0
0.078
Max
Feed Hole to Button of Component
H1
H2
0.729
0.969
±1.0
Feed Hole to Overall Component Height
18.5
24.6
±1.0
Lead Length after Component Removal
L
11.00
0.433
Max
Feed Hole Pitch
P
12.70
0.500
±0.3
Lead Location
P1
5.10
0.200
±0.7
Center of Component Location
P2
6.35
0.250
±1.2
Overall Taped Package Thickness
T
1.42
0.056
Max
Feed Hole Location
W0
9.00
0.354
±0.5
Adhesive Tape Width
W1
13.00
0.512
±0.5
Adhesive Tape Position
W2
4.00
0.157
Max
Tape Width
W3
18.00
0.709
±0.75
Front-to-Read Deflection
Everlight Electronics Co., Ltd.
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Rev 1
Page: 6 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Packing Specification
■
Inner Carton
EVERLIGHT
CPN:
P/N:XXXXXXXXXX
RoHS
XXX/XXXX-XXXX
QTY:XXXX
CAT:XX
HUE:XX
REF:XX
LOT NO:
MADE IN TAIWAN
■
■
Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Intensity
HUE: Rank of Dominant Wavelength
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Outside Carton
■
Packing Quantity
1. 2500 PCS/1 Inner Carton
2. 10Inner Cartons/1 Outside Carton
Everlight Electronics Co., Ltd.
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Rev 1
Page: 7 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
Notes
1. Lead Forming
„ During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
„
Lead forming should be done before soldering.
„
Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
„
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
„
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration
of the epoxy resin and this will degrade the LEDs.
2. Storage
„ The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
„
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
„ Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is
recommended.
„
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
300℃ Max. (30W
Max.)
Preheat temp.
100℃ Max. (60 sec
Max.)
Soldering time
3 sec Max.
Bath temp. & time
260 Max., 5 sec Max
Distance
3mm Min.(From
solder joint to
epoxy bulb)
Distance
3mm Min. (From
solder joint to epoxy
bulb)
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 8 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
„
Recommended soldering profile
laminar wave
Fluxing
Prehead
„
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
„
Dip and hand soldering should not be done more than one time
„
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
„
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
„
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
„
Wave soldering parameter must be set and maintain according to recommended
temperature and dwell time in the solder wave.
4. Cleaning
„ When necessary, cleaning should occur only with isopropyl alcohol at room temperature
for a duration of no more than one minute. Dry at room temperature before use.
„
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not
cause damage to the LED
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 9 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen
Technical Data Sheet
3474AN/R3DB-AFGC/XR/MS
5. Heat Management
„ Heat management of LEDs must be taken into consideration during the design stage of
LED application. The current should be de-rated appropriately by referring to the de-rating
curve found in each product specification.
„
The temperature surrounding the LED in the application should be controlled. Please refer
to the data sheet de-rating curve.
6. ESD (Electrostatic Discharge)
„ Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
„
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling
LEDs.
„
All devices, equipment and machinery must be properly grounded.
„
Use ion blower to neutralize the static charge which might have built up on surface of the
LEDs plastic lens as a result of friction between LEDs during storage and handing.
7. Other
„ Above specification may be changed without notice. EVERLIGHT will reserve authority
on material change for above specification.
„
When using this product, please observe the absolute maximum ratings and the
instructions for using outlined in these specification sheets. EVERLIGHT assumes no
responsibility for any damage resulting from use of the product which does not comply
with the absolute maximum ratings and the instructions included in these specification
sheets.
„
These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936
Fax: 886-2267-6244, 2267-6189, 2267-6306
http:\\www.everlight.com
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 10 of 10
Device Number : DT1-347-020
Prepared date: 03-10-20088
Prepared by: Grace Shen