FILTRONIC FMA3009_1

FMA3009
2-20GHZ BROADBAND MMIC AMPLIFIER
FEATURES:
•
•
•
•
•
•
•
Pre-Production Datasheet v2.5
FUNCTIONAL SCHEMATIC:
10dB Gain
Single Supply (Self Biased)
26dBm P1dB Output Power at 8.0V
pHEMT Technology
Bias Control
Input Return Loss <-9dB
Output Return Loss <-8dB
VDD
RF Input
RF Output
GENERAL DESCRIPTION:
The FMA3009 is a high performance 2-20GHz
Gallium Arsenide monolithic travelling wave
amplifier. It is suitable for use in broadband
communication, instrumentation and electronic
warfare applications. The die is fabricated
using the Filtronic 0.25µm process. The Circuit
is DC blocked at both the RF input and the RF
output. Bias control is achieved using a
combination of three on chip bias resistors
connected to ground, using the bond wires.
TYPICAL APPLICATIONS:
•
•
•
Test Instrumentation
Electronic Warfare
Broadband Communication Infrastructure
ELECTRICAL SPECIFICATIONS:
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Small Signal Gain
2-20GHz
8.0
10
12
dB
Gain Ripple
2-20GHz
±1
Input Return Loss
2-20GHz
-10
-8
dB
Output Return Loss
2-20GHz
-9
-8
dB
Reverse Isolation
2-20GHz
-30
-25
dB
Output Power at 1dB
2 GHz
24
26.3
compression point
10GHz
20
26
20GHz
19
21.5
Drain Current
8.0V
dB
dBm
250
Noise Figure
4
5
mA
6.5
dB
Note: TAMBIENT = +25°C, Z0 = 50Ω
Performances for on-wafer measurements
All Bias resistors bonded to ground.
1
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
ABSOLUTE MAXIMUM RATINGS:
PAD LAYOUT:
PARAMETER
SYMBOL
ABSOLUTE
MAXIMUM
Max Input Power
Pin
+20dBm
Drain Voltage
VDD
+10V
Ptot
3W
Thermal Resistivity
θJC
32°C/W
Operating Temp
Toper
-40°C to +85°C
Total Power
Dissipation
PAD
REF
PAD
NAME
DESCRIPTION
PIN
COORDINATES
(µm)
A
IN
RF in
(100,396)
B
R1
Enable Different
(1896,100)
C
R2
Source Resistors to be
(2046, 100)
D
R3
grounded
(2196, 100)
E
Source
Test Pad
(2027, 337)
(Resistor bypass)
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
F
OUT
RF Output
(2200, 650)
G
VDD
Drain Voltage
(2156, 1000)
H
GND
Ground
(1738, 995)
I
R5
Cascode Resistors:
(245, 1000)
Enable Different
J
G
H
J
R4
Voltages across the
(95, 1000)
Cascode devices
I
F
A
E
B
C
D
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
DIE SIZE (µm)
DIE THICKNESS (µm)
MIN. BOND PAD PITCH
(µm)
MIN. BOND PAD OPENING
(µm x µm )
2300 x 1100
100
150
100 x 100
DIFFERENT BIAS
CONFIGURATIONS:
The Pads B, C and D can
be bonded to ground or
left unbonded to achieve
different performances,
as shown on the
following table (see also
page 5 for more
information).
PADS GROUNDED
C
D
√
√
√
√
√
√
√
√
√
√
√
B
√
TYPICAL BIAS TYPICAL GAIN AT
CURRENT (MA)
10 GHZ (DB)
230
9.9
210
9.8
200
9.7
179
9.4
178
9.4
145
9.1
112
8.7
2
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS:
All Bias resistors bonded to ground.
Note: Measurement Conditions ID= 230mA, VDD= 8V, TAMBIENT = 25°C.
Gain
Reverse Isolation
14
0
12
-10
|S12| (dB)
|S21| (dB)
10
8
6
4
-20
-30
-40
-50
2
-60
0
-70
2
4
6
8
10 12 14
Frequency (GHz)
16
18
20
2
4
Input Return Loss
|S22| (dB)
|S11| (dB)
-5
-10
-15
-20
-25
4
6
8
10 12 14
Frequency (GHz)
16
18
20
16
18
16
18
20
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
20
2
Noise Figure
4
6
8
10 12 14
Frequency (GHz)
Output Pow er at 1 dB Com pression Point
7
30
6
25
P1dB (dBm)
5
NF (dB)
8
10 12 14
Frequency (GHz)
Output Return Loss
0
2
6
4
3
2
20
15
10
5
1
0
0
2
4
6
8
10 12 14
Frequency (GHz)
16
18
20
2
4
6
8
10 12 14
Frequency (GHz)
16
18
20
3
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS WITH DIFFERENT PADS
CONFIGURATIONS (PADS B, C AND D GROUNDED OR UNBONDED):
Note: VDD= 8V, TAMBIENT = 25°C.
Letters or Group of Letters indicate which Bias resistors are bonded to ground
Gain w ith Different Pad Grounding
Configurations
13
Reverse Isolation
B
12
C
D
10
BC
9
BD
|S12| (dB)
|S21| (dB)
11
CD
8
BCD
7
2
4
6
8
0
-10
-20
-30
-40
-50
-60
-70
-80
B
C
D
BC
BD
CD
BCD
2
10 12 14 16 18 20
4
6
Frequency (GHz)
Input Return Loss
Output Return Loss
0
B
-5
|S22| (dB)
|S11| (dB)
C
D
-10
BC
-15
BD
-20
CD
BCD
-25
2
4
6
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
8 10 12 14 16 18 20
B
C
D
BC
BD
CD
BCD
2
4
6
Frequency (GHz)
Drain Current @ 10 GHz for Different Pad
Grounding Configurations
8 10 12 14 16 18 20
Frequency (GHz)
Output P1dB @ 10 GHz for Different Pad
Grounding Configurations
250
27
200
26
P1dB (dBm)
Id (mA)
8 10 12 14 16 18 20
Frequency (GHz)
150
100
50
25
24
23
22
21
0
20
B
C
D
BC
BD
CD
BCD
B
Grounded Pads
C
D
BC
BD
Grounded Pads
CD
BCD
4
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS OVER TEMPERATURE:
Note: Measurement Conditions ID= 230mA, VDD= 8V. All Bias resistors bonded to ground.
TAMBIENT = 25°C
TCOLD = -40°C
THOT = +85°C
Reverse Isolation
0
-10
|S12| (dB)
|S21| (dB)
Gain
14
13
12
11
10
9
8
7
6
-20
-30
-40
-50
-60
-70
-80
2
4
6
8 10 12 14 16
Frequency (GHz)
18
20
2
4
6
18
20
18
20
Output Return Loss
0
0
-5
-10
-10
|S22| (dB)
|S11| (dB)
Input Return Loss
8 10 12 14 16
Frequency (GHz)
-15
-20
-20
-30
-40
-25
-50
-30
2
4
6
8
10 12 14
Frequency (GHz)
16
18
2
20
4
6
8 10 12 14
Frequency (GHz)
16
P1dB overTem perature
30
P1dB (dBm)
25
20
15
10
5
0
6
8
10
12
14
16
Frequency (GHz)
18
20
5
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
S-PARAMETERS FOR ON-WAFER MEASUREMENTS:
Note: Measurement Conditions ID= 230mA, VDD= 8V and TAMBIENT = 25°C
Units: GHZ (Frequency), dB (S-parameters magnitude), radian (S-parameters angle)
S11
S21
Frequency Mag
Angle
Mag
Angle
1.85
-12.85
1.23
9.61
2.05
-12.87
1.18
9.65
2.25
-12.78
1.12
9.64
2.45
-12.59
1.06
9.62
2.65
-12.34
1.00
9.58
2.85
-12.20
0.92
9.52
3.05
-12.08
0.86
9.49
3.25
-11.94
0.80
9.45
3.45
-11.72
0.73
9.39
3.65
-11.64
0.67
9.35
3.85
-11.56
0.61
9.33
4.05
-11.42
0.55
9.29
4.25
-11.34
0.49
9.25
4.45
-11.26
0.44
9.22
4.65
-11.20
0.38
9.20
4.85
-11.16
0.32
9.17
5.05
-11.13
0.27
9.15
5.25
-11.12
0.21
9.13
5.45
-11.15
0.15
9.11
5.65
-11.17
0.10
9.09
5.85
-11.23
0.05
9.09
6.05
-11.31
-0.01
9.09
6.25
-11.39
-0.06
9.09
6.45
-11.51
-0.12
9.09
6.65
-11.66
-0.17
9.10
6.85
-11.82
-0.22
9.11
7.05
-12.01
-0.27
9.13
7.25
-12.23
-0.33
9.15
7.45
-12.49
-0.37
9.17
7.65
-12.77
-0.43
9.20
7.85
-13.12
-0.48
9.28
8.05
-13.53
-0.52
9.41
8.25
-13.94
-0.56
9.47
8.45
-14.43
-0.60
9.49
8.65
-14.93
-0.64
9.54
8.85
-15.52
-0.67
9.58
9.05
-16.13
-0.70
9.62
9.25
-16.86
-0.73
9.67
Mag
-0.32
-0.44
-0.56
-0.68
-0.79
-0.89
-0.99
-1.08
-1.18
-1.27
-1.36
-1.45
-1.53
1.52
1.44
1.36
1.27
1.19
1.11
1.03
0.95
0.87
0.79
0.71
0.63
0.56
0.48
0.40
0.32
0.25
0.17
0.09
0.01
-0.08
-0.17
-0.25
-0.33
-0.41
S12
S22
Angle
Mag
Angle
-58.57
0.26
-13.78
-0.25
-62.80
0.35
-14.07
-0.26
-62.11
0.41
-14.32
-0.29
-61.89
0.61
-14.55
-0.33
-57.78
0.28
-14.85
-0.34
-57.97
0.53
-15.13
-0.38
-56.03
0.51
-15.36
-0.41
-53.36
0.25
-15.75
-0.43
-57.90
-0.19
-15.93
-0.45
-55.80
0.04
-16.21
-0.49
-56.38
-0.22
-16.54
-0.50
-58.71
0.00
-17.02
-0.54
-55.81
-0.02
-17.26
-0.57
-54.83
-0.07
-17.67
-0.58
-54.10
-0.12
-18.40
-0.61
-53.61
-0.21
-18.88
-0.64
-53.06
-0.20
-19.35
-0.63
-52.56
-0.36
-20.20
-0.66
-51.79
-0.42
-20.90
-0.68
-51.11
-0.43
-21.37
-0.65
-50.95
-0.57
-22.35
-0.65
-50.29
-0.64
-23.38
-0.68
-49.78
-0.72
-24.17
-0.65
-49.40
-0.75
-25.38
-0.60
-49.24
-0.89
-26.82
-0.67
-48.49
-0.94
-28.32
-0.63
-47.97
-1.06
-30.53
-0.41
-47.71
-1.15
-34.49
-0.40
-47.37
-1.24
-41.79
-0.06
-47.14
-1.35
-36.69
-1.52
-47.30
-1.41
-29.12
-1.22
-48.02
-1.42
-24.56
-1.44
-46.62
-1.48
-22.10
1.44
-46.47
-1.51
-21.21
1.35
-45.51
1.54
-21.18
1.29
-45.61
1.46
-20.39
1.28
-44.75
1.34
-19.58
1.33
-44.60
1.27
-19.05
1.28
6
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
S-PARAMETERS CONTINUED
S11
S21
S12
S22
Frequency Mag
Angle
Mag
Angle
Mag
Angle
Mag
Angle
9.45
-17.68
-0.74
9.75
-0.49
-43.92
1.16
-18.35
1.26
9.65
-18.55
-0.74
9.78
-0.58
-44.02
1.07
-17.66
1.29
9.85
-19.45
-0.72
9.81
-0.67
-43.32
0.97
-16.90
1.27
10.05
-20.51
-0.69
9.88
-0.75
-43.38
0.90
-16.33
1.23
10.25
-21.65
-0.63
9.95
-0.83
-43.53
0.77
-15.87
1.25
10.45
-22.95
-0.50
9.98
-0.92
-43.32
0.70
-15.32
1.23
10.65
-23.58
-0.29
10.03
-1.01
-43.10
0.67
-14.49
1.18
10.85
-23.52
-0.08
10.10
-1.10
-42.82
0.54
-13.89
1.16
11.05
-22.97
0.10
10.11
-1.18
-42.71
0.50
-13.44
1.16
11.25
-22.03
0.24
10.11
-1.27
-42.47
0.41
-12.67
1.13
11.45
-20.90
0.34
10.16
-1.37
-42.44
0.33
-12.07
1.08
11.65
-19.77
0.40
10.25
-1.45
-41.96
0.19
-11.75
1.04
11.85
-18.62
0.42
10.24
-1.54
-42.27
0.08
-11.09
0.99
12.05
-17.64
0.43
10.14
1.50
-42.51
0.00
-10.19
0.93
12.25
-16.75
0.42
10.12
1.41
-43.34
-0.06
-9.70
0.82
12.45
-15.97
0.39
10.19
1.34
-43.82
-0.06
-9.81
0.67
12.65
-15.23
0.37
10.19
1.26
-43.35
-0.01
-10.32
0.62
12.85
-14.58
0.33
10.22
1.16
-42.38
-0.04
-10.65
0.61
13.05
-13.97
0.29
10.30
1.07
-41.92
-0.11
-10.67
0.57
13.25
-13.41
0.24
10.27
0.98
-41.40
-0.24
-10.45
0.58
13.45
-12.93
0.20
10.17
0.90
-41.13
-0.29
-10.33
0.58
13.65
-12.48
0.14
10.18
0.80
-40.78
-0.35
-10.11
0.52
13.85
-12.12
0.09
10.29
0.72
-40.86
-0.42
-9.99
0.50
14.05
-11.80
0.04
10.27
0.64
-39.83
-0.50
-9.95
0.49
14.25
-11.47
-0.02
10.16
0.54
-39.91
-0.58
-9.67
0.43
14.45
-11.19
-0.08
10.15
0.44
-39.98
-0.65
-9.38
0.38
14.65
-10.97
-0.14
10.22
0.36
-39.88
-0.74
-9.46
0.35
14.85
-10.80
-0.20
10.15
0.29
-39.46
-0.77
-9.39
0.31
15.05
-10.60
-0.26
10.12
0.20
-39.37
-0.87
-9.19
0.27
15.25
-10.50
-0.32
10.25
0.10
-39.02
-0.93
-9.39
0.21
15.45
-10.41
-0.38
10.25
0.02
-39.17
-1.00
-9.52
0.16
15.65
-10.35
-0.45
10.15
-0.06
-38.70
-1.11
-9.33
0.13
15.85
-10.34
-0.51
10.16
-0.15
-38.29
-1.16
-9.38
0.09
16.05
-10.38
-0.58
10.25
-0.24
-38.37
-1.22
-9.71
0.03
16.25
-10.44
-0.64
10.27
-0.31
-37.69
-1.25
-9.87
-0.01
16.45
-10.51
-0.70
10.27
-0.40
-37.81
-1.34
-9.95
-0.04
16.65
-10.68
-0.77
10.33
-0.50
-37.37
-1.46
-10.17
-0.11
16.85
-10.85
-0.83
10.47
-0.58
-37.44
-1.49
-10.34
-0.15
17.05
-11.05
-0.90
10.44
-0.66
-36.70
-1.57
-10.54
-0.14
17.25
-11.34
-0.96
10.44
-0.75
-36.30
1.52
-10.81
-0.19
7
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
S-PARAMETERS CONTINUED
S11
S21
S12
S22
Frequency Mag
Angle
Mag
Angle
Mag
Angle
Mag
Angle
17.45
-11.67
-1.02
10.60
-0.85
-35.91
1.43
-11.13
-0.25
17.65
-12.06
-1.08
10.76
-0.93
-35.58
1.33
-11.61
-0.27
17.85
-12.56
-1.14
10.81
-1.02
-35.39
1.23
-12.09
-0.30
18.05
-13.13
-1.20
10.89
-1.12
-35.00
1.15
-12.46
-0.37
18.25
-13.80
-1.25
11.04
-1.22
-34.55
1.06
-13.22
-0.40
18.45
-14.60
-1.29
11.14
-1.31
-34.35
0.97
-14.20
-0.42
18.65
-15.56
-1.32
11.23
-1.41
-34.03
0.90
-14.94
-0.44
18.85
-16.63
-1.32
11.37
-1.52
-33.85
0.80
-16.16
-0.44
19.05
-17.87
-1.29
11.50
1.52
-33.73
0.70
-18.02
-0.42
19.25
-19.21
-1.21
11.59
1.41
-33.08
0.60
-19.15
-0.32
19.45
-20.43
-1.06
11.67
1.30
-32.79
0.48
-19.93
-0.15
19.65
-21.00
-0.85
11.78
1.18
-32.69
0.34
-21.30
0.09
19.85
-20.78
-0.61
11.83
1.08
-32.53
0.24
-21.17
0.44
20.05
-19.99
-0.42
11.88
0.96
-32.70
0.11
-19.15
0.73
8
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
BIASING CIRCUIT SCHEMATIC:
VDD
100pF
100nF
RF Output
RF Input
ASSEMBLY DIAGRAM:
It is recommended that the RF connections be made using bond wires with 25µm diameter and a
maximum length of 300µm. Optimum input and output return loss can be achieved, to compensate for
bond wire inductance, with the addition of a microstrip transformer, shown in the diagram below.
Ground connections should be made according to the required bias conditions.
To Evaluation Board via an 0402
Surface Mounted capacitor (100nF)
100pF Chip Capacitor
Substrate: Alumina
Thickness: 635µm
Dimensions in mm
3.5 Turn Air Coil
0.9
0.9
0.61
0.61
1.0
1.0
Ground Connections
Transformer Impedance 41Ω
Electrical Length 32º at 10GHz
BILL OF MATERIALS:
COMPONENT
All RF tracks should be 50Ω characteristic material
Capacitor, 100pF, chip capacitor
Capacitor, 100nF, 0402
6 nH – 3.5 Turn Air Coil (Manufacturer: Sycopel, model: HMG/3.5/500/50/100)
9
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
PREFERRED ASSEMBLY INSTRUCTIONS:
ORDERING INFORMATION:
PART NUMBER
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
DESCRIPTION
Die in Waffle-pack
FMA3009
(Gel-pak available on request)
The recommended die attach is gold/tin
eutectic solder under a nitrogen atmosphere.
Stage temperature should be 280-290°C;
maximum time at temperature is one minute.
The recommended wire bond method is
thermo-compression wedge bonding with 0.7
or 1.0 mil (0.018 or 0.025 mm) gold wire.
Stage temperature should be 250-260°C.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be exercised during handling.
Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing.
These
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MILHDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including Sparameters available on request.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
10
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com