FUJI 6MBI150U2B-060

6MBI150U2B-060
IGBT Modules
IGBT MODULE (U series)
600V / 150A
Features
· Low VCE(sat)
· Compact Package
· P.C. Board Mount Module
Applications
· Inverter for Motoe Drive
· AC and DC Servo Drive Amplifier
· Uninterruptible Power Supply
Maximum ratings and characteristics
Absolute maximum ratings (Tc=25°C unless otherwise specified)
I
Item
Collector-Emitter voltage
Gate-Emitter voltage
Collector current
Collector power disspation
Operating junction temperature
Storage temperature
Isolation between terminal and copper base *2
voltage between thermistor and others *3
Mounting screw torque
Symbol
VCES
VGES
IC
ICP
-IC
-IC pulse
PC
Tj
Tstg
Viso
Condition
Continuous
1ms
1 device
AC : 1 minute
*1 Recommendable value : 2.5 to 3.5 N·m (M5)
*2 All terminals should be connected together when isolation test will be done.
*3 Two thermistor terminals should be connected together, each other terminals should be
connected together and shorted to base plate when isolation test will be done.
Rating
600
±20
150
300
150
300
500
+150
-40 to +125
AC 2500
AC 2500
3.5 *1
Unit
V
V
A
W
°C
°C
V
V
N·m
6MBI150U2B-060
IGBT Module
Electrical characteristics (Tj=25°C unless otherwise specified)
Item
Symbol
ICES
IGES
VGE(th)
VCE(sat)
(terminal)
VCE(sat)
(chip)
Cies
ton
tr
tr(i)
toff
tf
VF
(terminal)
VF
(chip)
trr
Inverter
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Turn-on time
Turn-off time
Forward on voltage
Thermistor
Reverse recovery time of FRD
Lead resistance, terminal-chip *
Resistance
R lead
R
B
B value
Condition
VCE=600V, VGE=0V
VCE=0V, VGE=±20V
VCE=20V, IC=150mA
Tj=25°C
VGE=15V
Tj=125°C
Ic=150A
Tj=25°C
Tj=125°C
VGE=0V, VCE=10V, f=1MHz
V CC=300V
IC=150A
VGE=±15V
RG= 24 Ω
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
VGE= 0 V
IF=150A
IF=150A
T=25°C
T=100°C
T=25/50°C
Min.
6.2
-
Characteristics
Typ.
Max.
1.0
200
6.7
7.7
2.30
2.60
2.55
1.80
2.05
12
0.40
1.20
0.22
0.60
0.16
0.48
1.20
0.07
0.45
2.10
2.45
2.15
1.60
1.65
0.35
3.4
-
465
3305
5000
495
3375
520
3450
Unit
mA
nA
V
V
nF
µs
V
µs
mΩ
Ω
K
* Biggest internal terminal resistance among arm.
Thermal resistance Characteristics
Item
Symbol
Condition
Characteristics
Typ.
Max.
Min.
IGBT
FWD
Contact thermal resistance
*
Rth(c-f)
With thermal compound
* This is the value which is defined mounting on the additional cooling fin with thermal compound
Thermal resistance ( 1 device )
Rth(j-c)
-
0.05
0.25
0.48
-
Equivalent Circuit Schematic
16,17,18
30,31,32
1
2
5
6
U
27,28,29
3
4
33,34,35
9
10
V
24,25,26
7
8
W
21,22,23
11
12
13,14,15
19
20
Unit
°C/W
6MBI150U2B-060
IGBT Module
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage (typ.)
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
Tj= 125°C / chip
400
400
VGE=20V15V
Collector current : Ic [A]
Collector current : Ic [A]
VGE=20V 15V 12V
300
10V
200
12V
300
10V
200
100
100
8V
8V
0
0
0
1
2
3
4
0
5
Collector-Emitter voltage : VCE [V]
1
2
Collector current vs. Collector-Emitter voltage (typ.)
VGE=15V / chip
5
Tj=25°C / chip
10
Collector - Emitter voltage : VCE [ V ]
Tj=25°C Tj=125°C
300
200
100
0
8
6
4
Ic=300A
Ic=150A
Ic= 75A
2
0
0
1
2
3
4
5
Collector-Emitter voltage : VCE [V]
10
15
20
Gate - Emitter voltage : VGE [ V ]
Capacitance vs. Collector-Emitter voltage (typ.)
Dynamic Gate charge (typ.)
VGE=0V, f= 1MHz, Tj= 25°C
Vcc=300V, Ic=150A, Tj= 25°C
Cies
10.0
Cres
Coes
500
25
400
20
300
15
[V]
Collector-Emitter voltage : VCE [ V ]
100.0
1.0
25
VGE
200
10
100
5
VCE
0
0.1
0
10
20
Collector-Emitter voltage : VCE [V]
30
0
0
200
400
600
Gate charge : Qg [ nC ]
800
Gate - Emitter voltage : VGE
Collector current : Ic [A]
4
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
400
Capacitance : Cies, Coes, Cres [ nF ]
3
Collector-Emitter voltage : VCE [V]
6MBI150U2B-060
IGBT Module
Switching time vs. Collector current (typ.)
Switching time vs. Collector current (typ.)
Vcc=300V, VGE=±15V, Rg=24Ω, Tj= 25°C
Vcc=300V, VGE=±15V, Rg=24Ω, Tj=125°C
10000
Switching time : ton, tr, toff, tf [ nsec ]
Switching time : ton, tr, toff, tf [ nsec ]
10000
1000
ton
toff
tr
100
tf
0
50
100
150
200
250
50
100
150
200
250
Collector current : Ic [ A ]
Collector current : Ic [ A ]
Switching time vs. Gate resistance (typ.)
Switching loss vs. Collector current (typ.)
Vcc=300V, Ic=150A, VGE=±15V, Tj= 25°C
Vcc=300V, VGE=±15V, Rg=24Ω
300
Switching loss : Eon, Eoff, Err [ mJ/pulse ]
15
1000
ton
toff
tr
100
tf
Eoff(125°C)
Eon(125°C)
Eoff(25°C)
10
Eon(25°C)
5
Err(125°C)
Err(25°C)
10
0
1
10
100
0
Gate resistance : Rg [ Ω ]
100
200
300
Collector current : Ic [ A ]
Switching loss vs. Gate resistance (typ.)
Reverse bias safe operating area (max.)
Vcc=300V, Ic=150A, VGE=±15V, Tj= 125°C
+VGE=15V,-VGE <= 15V, RG >= 24Ω ,Tj <= 125°C
20
400
15
300
Collector current : Ic [ A ]
Switching loss : Eon, Eoff, Err [ mJ/pulse ]
tf
0
300
10000
Switching time : ton, tr, toff, tf [ nsec ]
100
10
10
10
Eoff
5
toff
ton
tr
1000
Eon
200
100
Err
0
0
1
10
Gate resistance : Rg [ Ω ]
100
0
200
400
600
Collector - Emitter voltage : VCE [ V ]
800
IGBT Module
6MBI150U2B-060
Forward current vs. Forward on voltage (typ.)
Reverse recovery characteristics (typ.)
chip
Vcc=300V, VGE=±15V, Rg=24Ω
1000
Reverse recovery current : Irr [ A ]
Reverse recovery time : trr [ nsec ]
Forward current : IF [ A ]
400
300
Tj=25°C
Tj=125°C
200
100
trr (125°C)
trr (25°C)
100
Irr (125°C)
Irr (25°C)
10
0
0
1
2
0
3
100
Forward on voltage : VF [ V ]
100
Resistance : R [ kΩ ]
10.00
Thermal resistanse : Rth(j-c) [ °C/W ]
300
Temperature characteristic (typ.)
Transient thermal resistance (max.)
1.00
FWD
IGBT
0.10
0.01
0.001
200
Forward current : IF [ A ]
10
1
0.1
0.010
0.100
Pulse width : Pw [ sec ]
1.000
-60 -40 -20
0
20 40 60 80 100 120 140 160 180
Temperature [°C ]
6MBI150U2B-060
IGBT Module
Outline Drawings, mm
(
) shows reference dimension.