Spec. No. DAT E DRAWN Oct.-19-‘07 CHECKED Oct.-19-‘07 CHECKED Oct.-19-‘07 NAME APPROVED DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E l e c t r i c D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y n or u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. S P E C I F I C AT I O N Device Name ： SILICON DIODE Type Name ： TS982C6R ： MS5D3305 Fuji Electric Device Technology Co.,Ltd. MS5D3305 1/12 H04-004-07b Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Revised Records Date Classification Ind. Content Applied date Oct.-19 -2007 Enactment ― ―――――― Issued date Drawn Checked MS5D3305 Approved 2/12 H04-004-06b 1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE TS982C6R 2. OUT VIEW, MOLDING RESIN, CHARACTERISTICS Ordering code Package type TS982C6R T-pack(S) Out view Page Molding resin 9/12 Characteristics Page UL:V-0 10/12∼12/12 Bar code label is EIAJ C-3 specification. Indispensable description items are shown as below. (1) Type name (2) Production code (3) Quantity (4) Lot №(Date code) (5) Company code 3.1 MAXIMUM RATINGS (at Ta=25℃ unless otherwise specified.) Item Repetitive peak reverse voltage Average output current Non-repetitive forward surge current** Operating junction temperature Storage temperature Symbol Conditions Ratings Units 600 V 16 * A 40 A 150 ℃ VRRM 50Hz Square wave duty =1/2 Io Tc = 88℃ IFSM Sine wave, 10ms 1shot Tj Tstg -40∼＋150 * Out put current of center tap full wave connection. **Rating per element ℃ 3.2 ELECTRICAL CHARACTERISTICS (at Ta=25℃ unless otherwise specified.) Item Symbol Conditions Maximum Units Forward voltage*** VF IF = 8 A 3.0 V Reverse current*** IR VR = VRRM 25 μA Reverse recovery time trr IF=0.1A,IR=0.2A,Irec=0.05A 0.026 μs 1.5 ℃/W 1.6 g Thermal resistance Rth(j-c) Junction to case ***Rating per element 3.3 MECHANICAL CHARACTERISTICS Approximate mass Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 3.RATINGS MS5D3305 3/12 H04-004-03a 4.TEST AND INSPECTION 4.1 STANDARD TEST CONDITION Standard test condition is Ta=25℃、65%R.H. If judgment is no doubt, the test condition is possible to test in normal condition Ta=5∼35℃、48∼85%R.H. 4.2 STRUCTURE INSPECTION It inspect with eye and measure, Item 2 shall be satisfied. 4.3 FORWARD AND REVERSE CHARACTERISTICS It inspect on the standard condition, Item 3.2 shall be satisfied. 4.4 TEST 2 Mechanical test T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 1 Test items Vibration Shock Solder ability 1 3 Solder ability 2 4 Resistance to soldering heat Testing methods and conditions Frequency : 100Hz to 2kHz Acceleration : 100m/s2 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. 2 Peak amplitude : 15km/s Duration time : 0.5ms 3times for each X, Y&Z directions. Solder : Sn-37Pb Solder temp. : 235±5℃ Immersion time : 5±0.5s Apply to flux Solder : Sn-3Ag-0.5Cu Solder temp. : 245±5℃ Immersion time : 5±0.5s Apply to flux Soldering temp. : 255±5°C Peak temp.:260℃ Number of times : 2times Infrared reflow Fuji Electric Device Technology Co.,Ltd. DWG.NO. Test No. Reference standard EIAJ ED4701 Sampling Acceptance number number EIAJ ED4701/403 5 test code D EIAJ ED4701/404 5 test code D EIAJ ED4701/303 5 test code A ― 5 ― 5 MS5D3305 (0 : 1) 4/12 H04-004-03a Test No. High temp. Storage Low temp. Storage Temperature humidity storage 1 2 Endurance test 3 4 Temperature humidity bias 5 Unsaturated pressurized vapor 6 Temperature cycle 7 Thermal shock 8 9 10 Steady state operating life Intermittent operating life High temp. Reverse bias Testing methods and conditions Temperature :Ｔstg max Test duration : 1000h Temperature :Ｔstg min Test duration : 1000h Temperature : 85±2°C Relative humidity : 85±5% Test duration : 1000h Temperature : 85±2°C Relative humidity : 85±5% Bias voltage : VRRM× 0.8 Test duration : 1000h Temperature : 130±2°C Relative humidity : 85±5% Vapor pressure : 230kPa Test duration : 48h High temp. side : Tstg max Room temp. : 5∼35℃ Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles Fluid : pure water(running water) High temp. side : 100+0/-5°C Low temp. side : 0+5/-0°C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles Ta=25±5°C Rated load Test duration : 1000h Tj=Tjmax ∼50℃ 3min ON, 3min OFF Test duration : 10000cycles Temperature : Ta=100 °C Bias voltage : VR=VRRM duty=1/2 Test duration : 1000h Reference standard EIAJ ED4701 Sampling number EIAJ ED4701/201 22 EIAJ ED4701/202 22 EIAJ ED4701/103 test code C 22 EIAJ ED4701/103 test code C 22 EIAJ ED4701/103 test code F 22 EIAJ ED4701/105 22 EIAJ ED4701/307 test code A 22 − 22 EIAJ ED4701/106 22 EIAJ ED4701/101 22 Acceptance number (0 : 1) Preparation : Test items required without fail : Test Method B-121,B-122,B-123,B-131,B-141 Baking treatment : 125±5°C, 24hr Humidification treatment : 85±2°C,65±5%RH,168±24hr Soldering heat for surface mounting : Reflow soldering Failure criteria IR ≦USL x 5 VF≦USL x 1.1 Fuji Electric Device Technology Co.,Ltd. 230±5℃ (235℃max.), 10±1sec, 2times. USL : Upper specification limit DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Test items MS5D3305 5/12 H04-004-03a 5.CAUTIONS ・Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. ・The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ・Computers ・OA equipment ・Communications equipment (Terminal devices) ・Measurement equipment ・Machine tools ・AV equipment ・Electrical home appliances ・Personal equipment ・Industrial robots etc. ・The products described in this specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate ・Transportation equipment (automobiles, trains, ships, etc.) ・Backbone network equipment ・Traffic-signal control equipment ・Gas alarms, leakage gas auto breakers ・Submarine repeater equipment ・Burglar alarms, fire alarms, emergency equipment ・Medical equipment ・Nuclear control equipment etc. ・Do not use the products in this specification for equipment requiring strict reliability such as (but not limited to): ・Aerospace equipment ・Aeronautical equipment 6.WARNINGS ・The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. ・The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc…). ・Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. ・You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. ・Consider the possible temperature rise not only for the junction and case, but also for the outer leads. ・Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. ・The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. ・The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) ・The Diodes should not used in an irradiated field since they are not radiation proof. Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. safety measures such as a backup system to prevent the equipment from malfunctioning. MS5D3305 6/12 H04-004-03a INSTALLATION ・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Solder Method temperature 260℃max. Reflow Duration Number of times ≦10sec 2times ・Recommendation temperature profile(Reflow) 300 275 260℃(peak) ≦10sec 225 4.5℃/sec(max.) 230℃ ≧50sec 200 Temperature [℃] Post Cooling -5℃/sec(max.) 175 150 Pre-heat 150∼180℃ 60∼120sec 125 100 75 6℃/sec(max.) 50 25 0 time [sec] ・Recommendation soldering pads Dimensions unit:mm Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 250 MS5D3305 7/12 H04-004-03a STORAGE ・The Diodes must be stored at a standard temperature of 5 to 35℃ and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. ・The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. ・The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. ・The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. ・The Diodes should be stored in antistatic containers or shipping bags. 7.APPENDIX Diphenyl Ether ) , substances. ・This products does not contain Class-I ODS and Class-II ODS substances set force by ‘Clean Air Act of US’ law. ・If you have any questions about any part of this specification, please contact Fuji Electric Device Technology or its sales agent before using the product ・Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. ・This specification does not confer any industrial property rights or other rights, nor constitute a license for such rights. Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. ・This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated MS5D3305 8/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. (TS982C6R) Sn-Ag plating (Pb＜1000ppm) MS5D3305 9/12 H04-004-03a Forward Characteristic (typ.) Reverse Characteristic (typ.) 102 Tj=150°C 101 Tj=125°C 10 IR Reverse Current (µA) Tj=100°C IF Forward Current (A) Tj=150°C Tj=125°C Tj=100°C Tj=25°C 1 10 0 10-1 10-3 0.1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0 2.8 100 200 300 400 500 600 700 VR Reverse Voltage (V) VF Forward Voltage (V) Forward Power Dissipation (max.) Reverse Power Dissipation (max.) 30 0.035 DC 360° 360° 0.030 25 VR (W) I0 λ α (W) 20 Square wave λ=60° Reverse Power Dissipation Forward Power Dissipation 0.025 Square wave λ=120° Sine wave λ=180° 15 Square wave λ=180° DC 10 PR WF 0.020 α=180° 0.015 0.010 5 0.005 Per 1element 0 0 2 4 6 IF(AV) Average Forward Current 8 0.000 0 (A) Fuji Electric Device Technology Co.,Ltd. 100 200 VR DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Tj=25°C 10-2 300 400 Reverse Voltage MS5D3305 500 600 700 (V) 10/12 H04-004-03a Peak Half - Wave Current (A) Tc Case Temperature 100 90 70 Square wave λ=60° 0 2 1 4 6 IF(AV) Average Forward Current 8 10 12 14 16 10 18 20 Cj (°C) 110 DC 80 Junction Capacitance (pF) Square wave λ=180° Sine wave λ=180° Square wave λ=120° (A) Fuji Electric Device Technology Co.,Ltd. DWG.NO. IFSM T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f F u ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 160 Current Derating (IF(AV)-Tc) (max.) 1000 Junction Capacitance Characteristic (typ.) 150 140 130 120 100 10 60 50 40 30 22 1 λ :Conduction angle of forward current for each rectifier element IF(AV):Forward current of center-tap full wave connection 1 10 100 VR Reverse Voltage (V) MS5D3305 1000 1000 Surge Capability (max.) 100 10 1 Number of Cycles at 50Hz 100 11/12 H04-004-03a 10 -3 10 -2 10 -1 t Time Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f F u ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Transient Thermal Impedance (°C/W) 10 2 Transient Thermal Impedance (max.) 10 1 Rth j-c:1.5℃/W 10 0 10 -1 (sec) 10 0 10 1 10 2 MS5D3305 12/12 H04-004-03a