FUJITSU MB88346LP

FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-13511-3E
Linear IC Converter
CMOS
D/A Converter for Digital Tuning
(12-channel, 8-bit, on-chip OP amp, low-voltage)
MB88346L
■ DESCRIPTION
The Fujitsu MB88346L is a 12-channel 8-bit D/A converter capable of low-voltage operation that has amplifiers
built into each of the 12 analog output lines to deliver heavy-current drive capability.
The use of serial data input means that only three control lines are required, and enables cascade connection of
multiple MB88346L chips.
The MB88346L is suitable for applications such as electronic volume controls and replacing trimmer potentiometers in tuning systems. In addition, the MB88346L is both function-compatible and pin-compatible the currently
used MB88346B, making it easy to reduce the voltage level of a system by simply replacing the MB88346B with
the MB88346L.
■ FEATURES
•
•
•
•
•
•
•
Low voltage operation (VCC/VDD : 2.7 V to 3.6 V)
Ultra-low power consumption (0.5 mW/ch at VCC = 3 V)
Ultra-compact space-saving package lineup (SSOP-20)
Contains 12-channel R-2R type 8-bit D/A converter
On-chip analog output amps (sink current max. 1.0 mA, source current max. 1.0 mA)
Analog output range from 0 to VCC
Two separate power supply/ground lines for MCU interface block/operational amplifier output buffer block and
D/A converter block
• Serial data input : maximum operating speed 2.5 MHz
(maximum operating speed in cascade connection is 1.5 MHz)
• CMOS process
• Package lineup includes DIP 20-pin, SSOP 20-pin
Copyright©2000-2006 FUJITSU LIMITED All rights reserved
MB88346L
■ PIN ASSIGNMENT
(Top view)
VSS
1
20
GND
AO3
2
19
AO2
AO4
3
18
AO1
AO5
4
17
DI
AO6
5
16
CLK
AO7
6
15
LD
AO8
7
14
DO
AO9
8
13
AO12
AO10
9
12
AO11
VDD
10
11
VCC
(DIP-20P-M02)
(FPT-20P-M03)
2
MB88346L
■ PIN DESCRIPTION
Pin No.
Symbol
I/O
Function
17
DI
I
Serial address/data input to the internal 12-bit shift register : The address/data format is that upper 4 bits (D11 to D8) indicate an address
and lower 8 bits (D7 to D0) indicate data. The D11 (MSB) is the firstin bit and D0 (LSB) is the last-in bit.
14
DO
O
Outputs MSB bit data from 12-bit shift register.
16
CLK
I
Shift clock input to the internal 12-bit shift register : At the rising edge
of CLK data on the DI pin is shifted into the LSB of the shift register
and contents of the shift register are shifted right (to the MSB) .
15
LD
I
Load strobe input for a 12-bit address/data : A high level on the LD pin
latches a 4-bit address (upper 4 bits : D11 to D8) of the internal 12-bit
shift register into the internal address decoder, and writes 8-bit data
(lower 8 bits : D7 to D0) of the shift register into an internal data latch
selected by the latched address.
18
19
2
3
4
5
6
7
8
9
12
13
AO1
AO2
AO3
AO4
AO5
AO6
AO7
AO8
AO9
AO10
AO11
AO12
O
8-bit D/A output pins with OP amps.
11
VCC
⎯
MCU interface and OP amp power supply pin.
20
GND
⎯
MCU interface and OP amp ground pin.
10
VDD
⎯
D/A converter power supply pin.
1
VSS
⎯
D/A converter ground pin.
3
MB88346L
■ BLOCK DIAGRAM
12-bit shift register
DI
CLK
D0
D1
D2
D3
D4
D5
D6
DO
D7
D8
D9
D10
D11
LD
Address decoder
8
1 2 3 4
12
D0
1
D7
12
8-bit latch
8-bit
R-2R
D/A converter
VCC
4
GND
D0
12
D7
8-bit latch
8-bit
R-2R
D/A converter
+
+
–
–
AO1
AO12
VDD
VSS
MB88346L
■ DATA CONFIGURATION
The MB88346L has a 12-bit shift register for controlling the chip. The data passed to the 12-bit shift register
needs to be supplied in the following format.
The data structure consists of a total of 12 bits, four for address selection and eight for D/A data output.
1. Shift Register Control Data Configuration
First
MSB
Last
LSB
D0
D1
D2
D3
D4
D5
D6
D7
D/A data output
D8
D9
D10
D11
Address selection
2. D/A Converter Control Signals
D0
D1
D2
D3
D4
D5
D6
D7
0
0
0
0
0
0
0
0
=: VSS
1
0
0
0
0
0
0
0
=: VLB + VSS
0
1
0
0
0
0
0
0
=: VLB × 2 + VSS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
0
1
1
1
1
1
1
1
=: VLB × 254 + VSS
1
1
1
1
1
=: VDD
1
1
1
VLB = (VDD − VSS) /255
D/A data output
•
•
•
5
MB88346L
3. Address Selection Signals
6
D8
D9
D10
D11
Address selection
0
0
0
0
Don’t Care
0
0
0
1
AO1 selection
0
0
1
0
AO2 selection
0
0
1
1
AO3 selection
0
1
0
0
AO4 selection
0
1
0
1
AO5 selection
0
1
1
0
AO6 selection
0
1
1
1
AO7 selection
1
0
0
0
AO8 selection
1
0
0
1
AO9 selection
1
0
1
0
AO10 selection
1
0
1
1
AO11 selection
1
1
0
0
AO12 selection
1
1
0
1
Don’t Care
1
1
1
0
Don’t Care
1
1
1
1
Don’t Care
MB88346L
■ OPERATING DESCRIPTION
1. Timing Chart for Data Condition Setup
MSB
DI
D11
LSB
D10
D9
D8
D2
D1
D0
CLK
LD
D/A data output
2. Analog Output Voltage Range
R-2R ladder output
VDD
OP amp output
VCC
VAOH (V CC)
D/A output range (linear range)
VAOL (GND)
VSS
GND
VCC = VDD
GND = VSS
7
MB88346L
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Condition
VCC
Power supply voltage
VDD*
Input voltage
VIN
Output voltage
GND used as reference,
Ta = + 25 °C
VOUT
Unit
Min
Max
− 0.3
+ 7.0
V
− 0.3
+ 7.0
V
− 0.3
VCC + 0.3
V
− 0.3
VCC + 0.3
V
Power consumption
PD
⎯
⎯
250
mW
Operating temperature
Ta
⎯
− 20
+ 85
°C
Tstg
⎯
− 55
+ 150
°C
Storage temperature
* : VCC ≥ VDD
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Power supply voltage 1
Power supply voltage 2
Symbol
Condition
VCC
GND
VDD
VSS
Value
Unit
Min
Typ
Max
⎯
2.7
⎯
3.6
V
⎯
⎯
0
⎯
V
2.0
⎯
VCC
V
GND
⎯
VCC − 2.0
V
VDD − VSS ≥ 2.0 V
Analog output source current
IAL
VCC = 3.0 V
⎯
⎯
1.0
mA
Analog output sink current
IAH
VCC = 3.0 V
⎯
⎯
1.0
mA
Oscillator limiting output capacity
CAL
⎯
⎯
⎯
0.1
µF
Digital data value range
⎯
⎯
#00
⎯
#FF
⎯
Operating temperature
Ta
⎯
− 20
⎯
+ 85
°C
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
8
MB88346L
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics
(1) Digital Block
(VDD, VCC = 2.7 V to 3.6 V (VCC ≥ VDD) , GND = VSS = 0 V, Ta = −20 °C to +85 °C)
Parameter
Symbol
Power supply voltage
VCC
Power supply current 1
ICC
Input leak current
IILK
L level input voltage
VIL
H level input voltage
VIH
L level output voltage
VOL
H level output voltage
VOH
Pin
Value
Condition
VCC
Typ
Max
⎯
2.7
3.0
3.6
V
Stationary (CLK signal
stopped) , no load
⎯
1.2
3.0
mA
− 10
⎯
+ 10
µA
⎯
⎯
⎯
0.2 VCC
V
⎯
0.8 VCC
⎯
⎯
V
⎯
⎯
0.4
V
VCC − 0.4
⎯
⎯
V
VIN = 0 to VCC
CLK, DI,
LD
IOL = 2.5 mA
DO
Unit
Min
IOH = − 400 µA
(2) Analog Block 1
(VDD, VCC = 2.7 V to 3.6 V (VCC ≥ VDD) , GND = VS = 0 V, Ta = –20 °C to +85 °C)
Parameter
Power consumption
Analog voltage
Value
Symbol
Pin
Condition
IDD
VDD
Maximum setting value
from #00 to #FF
VDD
VDD
VSS
VSS
Resolution
Res
Monotonic increase
Rem
Nonlinearity error
LE
Differential linearity error
DLE
VDD – VSS ≥ 2.0
⎯
AO1 to AO12 VDD ≤ VCC − 0.1 V,
VSS ≥ 0.1 V, no load
Unit
Min
Typ
Max
⎯
0.6
1.5
mA
2.0
⎯
VCC
V
GND
⎯
VCC − 2.0
V
⎯
8
⎯
bit
⎯
8
⎯
bit
− 1.5
⎯
+ 1.5
LSB
− 1.0
⎯
+ 1.0
LSB
Nonlinearity error : Deviation (error) in input/output curves with respect to an ideal straight line connecting
output voltage at “00” and output voltage at “FF.”
Differential linearity error : Deviation (error) in amplification with respect to theoretical increase in amplification
per 1-bit increase in digital value.
Analog output
Ideal straight line
VAOH
Non linearity error
VAOL
Digital setting
#00
#FF
Note : The value of VAOH and VDD, and
the value of VAOL and VSS are not
necessarily equivalent.
9
MB88346L
(3) Analog Block 2
(VDD, VCC = 2.7 V to 3.6 V (VCC ≥ VDD) , GND = VSS = 0 V, Ta = −20 °C to +85 °C)
Parameter
Output minimum
voltage 1
Output minimum
voltage 2
Output minimum
voltage 3
Output minimum
voltage 4
Output minimum
voltage 5
Symbol
Pin
Output maximum
voltage 2
Output maximum
voltage 3
Output maximum
voltage 4
Output maximum
voltage 5
10
Value
Unit
Min
Typ
Max
VAOL1
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAL = 0 µA
Digital data = #00
VSS
⎯
VSS + 0.1
V
VAOL2
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAL = 500 µA
Digital data = #00
VSS − 0.2
VSS
VSS + 0.2
V
VAOL3
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAH = 500 µA
Digital data = #00
VSS
⎯
VSS + 0.2
V
VAOL4
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAL = 1.0 mA
Digital data = #00
VSS − 0.3
VSS
VSS + 0.3
V
VAOL5
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAH = 1.0 mA
Digital data = #00
VSS
⎯
VSS + 0.3
V
VAOH1
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAL = 0 µA
Digital data = #FF
VDD − 0.1
⎯
VDD
V
VAOH2
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAL = 500 µA
Digital data = #FF
VDD − 0.2
⎯
VDD
V
VAOH3
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAH = 500 µA
Digital data = #FF
VDD − 0.2
VDD
VDD + 0.2
V
VAOH4
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAL = 1.0 mA
Digital data = #FF
VDD − 0.3
⎯
VDD
V
VAOH5
VDD = VCC = 3.0 V,
VSS = GND = 0.0 V,
IAH = 1.0 mA
Digital data = #FF
VDD − 0.3
VDD
VDD + 0.3
V
AO1 to AO12
Output maximum
voltage 1
Condition
MB88346L
2. AC Characteristics
(VDD, VCC = 2.7 V to 3.6 V (VCC ≥ VDD) , GND = VSS = 0 V, Ta = − 20 °C to +85 °C)
Parameter
Symbol
Condition
Clock L level pulse width
tCKL
Clock H level pulse width
Value
Unit
Min
Max
⎯
200
⎯
ns
tCKH
⎯
200
⎯
ns
Clock rise time
Clock fall time
tCr
tCf
⎯
⎯
200
ns
Data setup time
tDCH
⎯
30
⎯
ns
Data hold time
tCHD
⎯
60
⎯
ns
Load setup time
tCHL
⎯
200
⎯
ns
Load hold time
tLDC
⎯
100
⎯
ns
Load H level pulse width
tLDH
⎯
100
⎯
ns
Data output delay time
tDO
Refer to “• Load condition 1”
70
600
ns
D/A output settling time
tLDD
Refer to “• Load condition 2”
⎯
300
µs
• Load condition 1
• Load condition 2
Measurement point
Measurement point
CL = 20 pF
to 100 pF
R AL = 10 kΩ
CAL = 50 pF
11
MB88346L
• Input/output timing
tCr
tCKH
tCf
CLK
tCKL
tLDC
DI
tLDH
tDCH
tCHD
tCHL
LD
tLDD
90 %
D/A output
10 %
tDO
DO
Note: Decision levels: 80 % and 20 % of VCC
■ VAO vs. IAO CHARACTERISTICS : EXAMPLE
Ta = +25°C
3.0 V
3.0 V
Source current
MB88346L
Pattern input
VDD
DI
CLK
LD
VSS
VCC
AO1
to
AO12
GND
Sink current
V
(Continued)
12
MB88346L
(Continued)
#FF setting
[mV]
3,000
2,980
Analog output level
2,960
2,940
2,920
2,900
2,880
2,860
2,840
2,820
2,800
1.0
0.8
0.6
0.4
0.2
0.0
0.2
Sink current
0.4
0.6
0.8
1.0
[mA]
Source current
#80 setting
[mV]
1,600
1,580
Analog output level
1,560
1,540
1,520
1,500
1,480
1,460
1,440
1,420
1,400
1.0
[mV]
0.8
0.6
0.4
Sink current
0.2
0.0
0.2
0.4
0.6
0.8
Source current
1.0
[mA]
0.2
0.0
0.2
0.4
0.6
0.8
Source current
1.0
[mA]
#00 setting
200
180
Analog output level
160
140
120
100
80
60
40
20
0
1.0
0.8
0.6
0.4
Sink current
13
MB88346L
■ ORDERING INFORMATION
Part number
MB88346LP
MB88346LPFV
14
Package
20-pin plastic DIP
(DIP-20P-M02)
20-pin plastic SSOP
(FPT-20P-M03)
Remarks
MB88346L
■ PACKAGE DIMENSIONS
20-pin plastic DIP
Lead pitch
2.54mm(100mil)
Row spacing
7.62mm(300mil)
Sealing method
Plastic mold
(DIP-20P-M02)
20-pin plastic DIP
(DIP-20P-M02)
+0.20
24.64 –0.30
+.008
.970 –.012
INDEX-1
6.20±0.25
(.244±.010)
INDEX-2
0.51(.020)MIN
4.36(.172)MAX
0.25±0.05
(.010±.002)
3.00(.118)MIN
0.46±0.08
(.018±.003)
+0.30
0.86 –0
+.012
.034 –0
1.27(.050)
MAX
C
+0.30
1.27 –0
+.012
.050 –0
7.62(.300)
TYP
15°MAX
2.54(.100)
TYP
1994 FUJITSU LIMITED D20003S-3C-4
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/fj/DATASHEET/ef-ovpklv.html
(Continued)
15
MB88346L
(Continued)
20-pin plastic SSOP
Lead pitch
0.65 mm
Package width ×
package length
4.40 × 6.50 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.45 mmMAX
Weight
0.09g
Code
(Reference)
P-SSOP20-4.4×6.5-0.65
(FPT-20P-M03)
20-pin plastic SSOP
(FPT-20P-M03)
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
*1 6.50±0.10(.256±.004)
0.17±0.03
(.007±.001)
11
20
*24.40±0.10 6.40±0.20
(.173±.004) (.252±.008)
INDEX
Details of "A" part
+0.20
1.25 –0.10
+.008
.049 –.004
LEAD No.
1
10
0.65(.026)
"A"
0.24±0.08
(.009±.003)
0.13(.005)
M
0.10(.004)
C
2003 FUJITSU LIMITED F20012S-c-4-6
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/fj/DATASHEET/ef-ovpklv.html
16
(Mounting height)
0~8˚
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.10±0.10
(Stand off)
(.004±.004)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB88346L
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
The company names and brand names herein are the trademarks or
registered trademarks of their respective owners.
Edited
Business Promotion Dept.
F0612