FUJITSU MICROELECTRONICS DATA SHEET DS04-32101-1Ea ASSP SmartCard Microcontroller for Multiapplication SmartCard HIFERRON Series MB94R215B ■ DESCRIPTION MB94R215B is a one-chip micro-controller for IC cards, with a combination of contact/contactless functions. Based around the FR65E core, it includes in built functions such as a timer, FRAM, DES, RSA, contact interface, contactless RF interface, etc. The MB94R215B is optimized for contact/contactless IC card applications. ■ FEATURE • FR CPU • 32-bit RISC, load/store architecture with a five-stage pipeline • 16 - bit fixed length instructions (basic instructions), 1 instruction per cycle • Instruction set optimized for embedded applications : Memory-to-memory transfer, bit manipulation, barrel shift etc. • Instructions adapted for high - level languages : Function entry/exit instructions, multiple - register load/store instructions • Register interlock functions : Facilitating coding in assemblers • Built-in multiplier with instruction-level support 32-bit multiplication with sign : 5 cycles 16-bit multiplication with sign : 3 cycles • Interrupt (PC and PS save) : 6 cycles, 16 priority levels • Harvard architecture allowing program access and data access to be executed simultaneously • Instruction compatible with FR family (Continued) Copyright©2004-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2004.10 MB94R215B (Continued) • Contactless IC card I/F • Operating magnetic field strength : 4.0 to 7.5 A/m (in recommended antenna pattern) • Load modulation strength (Min) : 30/H1.2 (mVpeak) (in recommended antenna pattern) • Antenna input pin capacity : 75 pF • Communication protocol : ISO 14443 TypeB T = CL 106 Kbps, 212 Kbps Input clock frequency = 13.56 MHz • Receive data demodulation and send data modulation for contactless I/F • Variety of error detection function (frame, overrun, exceeding ISO regulation time) • Contact IC card I/F (5 V I/F) • Support for power supply voltage = 5 V ± 0.5 V and input clock frequency = 1 MHz to 5 MHz (ISO 7816 Class-A) • Communication protocol : ISO 7816/T = 0, 1 Operation is confirmed for Fi = 372 with Di = 1, 2, 4, 8, and for Fi = 512 with Di = 1, 2, 4, 8, 16. • Built-in memory • MASK ROM of 128 KB • DATA RAM (SRAM) of 8 KB • FRAM (Nonvolatile memory) of 32 KB • Cryptosystem coprocessor • DES coprocessor • ECB mode corresponding (The CBC mode corresponds by XOR and transfer instruction.) • Operating at 20 coproclocks • RSA coprocessor • Maximum key length 1024 bits • High-speed Montgomery multiplication surplus (REDC) calculations using 32-bit data processing • ECC (Prime Finite Fields) : Maximum key length 224 bits 2 MB94R215B ■ PIN ASSIGNMENT 3.00 1 5 2.40 2 6 2.40 3 7 3.00 0.20 R 2.00 4 8 0.20 11.40 0.20 R 2.20 0.20 4.10 0.20 4.00 0.20 4.10 12.00 Unit : mm (Continued) 3 MB94R215B (Continued) 11.80 9.00 9 R 1.00 0.50 5.00 9.50 13.00 5.00 1.00 2.00 (0.46) 1.80 0.195 ± 0.05 0.90 10 2.00 Unit : mm Pin No. Pin Name Chip Correspondence 1 VCC EXT5V 2 RST INITX Reset input* 3 CLK CLK Clock input* 4 RFU N.C. Empty pin* 5 GND VSS Ground pin* 6 VPP N.C. Program power supply (not used in this module) * 7 I/O SDIO Data input/output* 8 RFU N.C. Empty pin* 9 PWRP PWRP Antenna pin for contactless. Located on rear of module 10 PWRM PWRM Antenna pin for contactless. Located on rear of module * : Refer to ISO/IEC7816-2. 4 Function Power supply pin* MB94R215B ■ BLOCK DIAGRAM FR CPU core 32 32 Bit search SRAM 8 KB Bus converter ROM 128 KB FRAM 32 KB RSA DES 32 32 to 16 adapter PLL Clock generator 16 Power supply warning and detection circuit Interrupt controller 3 ch reload timer PWRP PWRM Contactless RF I/F Interrupt management BSIO INITX CLK Each register Contact I/F SDIO CLK/RST controller 5 MB94R215B ■ HANDLING DEVICES 1. Preventing Latchup Latch-up may occur in a CMOS IC if a voltage greater than VCC or less than VSS is applied to an input or output pin, or if an above-rating voltage is applied between VCC and VSS. A latchup, if it occurs, significantly increases the power supply current and may cause thermal destruction of an element. When you use a CMOS IC, be very careful not to exceed the absolute maximum rating. 2. Treatment of N.C. pins Be sure to use NC pins in open state. 3. Rising time for power supply voltage Ensure that the power supply rise time is 100 µs or less when using contact mode operation but, which may cause misoperation resulting in the corruption of FRAM data. 4. Power supply off time Ensure that the power supply off time is 1ms or longer when using contact mode operation. 5. Magnetic field strength rise time See the “■ RF INTERFACE in CONTACTLESS OPERATION” section for points to note regarding contactless operation. 6. When using both contact and contactless operation When operating in contact mode, ensure there is no RF input from the antenna. When operating in contactless mode, ensure that the contact terminals are open circuit. 6 MB94R215B ■ ABSOLUTE MAXIMUM RATINGS Parameter Rating Symbol Min Max Unit Power supply voltage VCC − 0.5 6.0 V Input voltage VIN − 0.5 VCC + 0.5 V VOUT − 0.5 VCC + 0.5 V TA − 20 + 80 °C Storage temperature TSTG − 40 + 85 °C Voltage between antenna pins (Peak-Peak voltage) VANT 20 V Output voltage Operating temperature WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Symbol Value Min Typ Max Unit Power supply voltage VCC 4.5 5.0 5.5 V “H” level input voltage VIN VCC + 0.5 V “L” level input voltage VOUT − 0.5 + 0.6 V Operating temperature TA − 20 + 80 °C Operating magnetic field strength* 4.0 7.5 A/m Load modulation level 30 1/H1.2 (mVpeak) VANT 20 V Voltage between antenna pins (Peak-Peak voltage) * : In reference antenna pattern WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. 7 MB94R215B ■ ELECTRICAL CHARACTERISTICS 1. DC Characteristics (1) Power supply voltage and current Parameter Symbol Conditions Operating power supply current ICC Standby current ICS Value Unit Min Typ Max *1 8.0 mA *2 2.0 mA *1 : 4.5 V < VCC < 5.5 V, CLK input = 3.57 MHz, no PLL using, at Java Card OS operating *2 : 4.5 V < VCC < 5.5 V, CLK stop (2) I/O pin Parameter Symbol Conditions “H” level input voltage VIH “L” level input voltage Value Unit Min Typ Max 0.7 × VCC VCC V VIL 0.0 0.15 × VCC V “H” level input current IIH *1 − 10 + 10 µA “L” level input current IIL *1 − 200 + 10 µA “H” level output voltage VOH *2 0.7 × VCC VCC V “L” level output voltage VOL *3 0.0 0.15 × VCC V “H” level output current IOH *4 − 1000 + 10 µA “L” level output current IOL *5 − 0.01 + 8.0 mA *1 : VCC = 5.5 V *2 : Chip external pull-up resistance : 20 kΩ *3 : IOL = 1 mA *4 : VOH = 0.7 × VCC *5 : VOL = 0.15 × VCC (3) CLK pin Parameter Symbol Conditions “H” level input voltage VIH “L” level input voltage Unit Min Typ Max 0.7 × VCC VCC V VIL 0.0 0.5 V “H” level input current IIH * − 10 + 10 µA “L” level input current IIL * − 100 + 10 µA * : VCC = 5.5 V 8 Value MB94R215B (4) RST pin Parameter Symbol Conditions “H” level input voltage VIH “L” level input voltage Value Unit Min Typ Max 0.8 × VCC VCC V VIL 0.0 0.12 × VCC V “H” level input current IIH * − 10 + 10 µA “L” level input current IIL * − 200 + 10 µA * : VCC = 5.5 V (5) Antenna pin Parameter Symbol Conditions Capacity between antenna pins Cant Load modulation circuit resistance Rmod Value Unit Min Typ Max 0.1 Vrms 60 68 75 pF Resistance between antenna and GND 600 750 900 Ω 9 MB94R215B 2. AC Characteristics (1) Contact operation Parameter Symbol Conditions Input CLK frequency FCLK Communication speed Value Unit Min Typ Max 1 5 MHz CRATE 112 Kbps Output signal rising tr * 1.0 µs Output signal falling tf * 1.0 µs * : External capacitance of I/O pins = 50 pF (2) Contactless operation Parameter Symbol Conditions Antenna input frequency Fin Resonant frequency ASK modulation level Value Unit Min Typ Max Antenna connection 13.553 13.560 13.567 MHz Fr Antenna connection 16.0 MHz Vask Antenna connection 8 14 % Vsub Antenna connection 4.0 A/m (Magnetic Field Strength) 30 1/H1.2 (mVpeak) Operating magnetic field strength H Antenna connection 4.0 7.5 A/m Communication speed Antenna connection 106 Kbps Load modulation level 3. Pin capacity Parameter Symbol Value Min Typ Max Unit I/O CIH 8.0 pF CLK CIL 8.0 pF RST CIH 8.0 pF Note : Capacitance between pins and ground (measured by 0.1 Vpp and 1 MHz signal) 4. FRAM characteristics (data retaining characteristics) Parameter 10 Conditions Value Min Typ Max Unit Data retaining Ta ≤ + 55 °C 10 year Number of writes Ta ≤ + 55 °C 1010 number MB94R215B ■ REFERENCE ANTENNA PATTERN The pattern below is intended for reference data when designing the antenna. When developing a card, please take note of the module characteristics when designing the antenna pattern. 3.00 mm 3.00 mm 16.89 mm 2.00 mm 94RXXX 2.00 mm 39.98 mm 16.12 mm 71.60 mm R = 0.5 mm 11 MB94R215B ■ RF INTERFACE in CONTACTLESS OPERATION 1. Flow at carrier ON Communications between PICC (card) and PCD (R/W) is based on a "PCD Talk First" protocol in accordance with the procedure described below. (1) RF power is supplied to PICC by the magnetic field generated by PCD. (2) PICC is able to receive within 5 ms of RF power on. (3) PICC waits with no response until receiving a command from PCD (receive standby state). (4) PCD sends a command to PICC (sent approx. 10 ms after RF power on). (5) PICC executes the operation specified by the PCD instruction and sends a response to PCD on completion. • Time standard at carrier ON 5 ms (Max) 2 ms (Max) Carrier ON PICC : ASK reception enabled 100 µs to 500 µs 2. Power supply (1) Carrier frequency fc : 13.56 MHz ± 7 kHz (2) PICC operating magnetic field strength (when not modulated) : 4.0 A/m to 7.5 A/m 12 MB94R215B 3. Interface of signal (1) Data transmission from PCD to PICC • Communication speed fb : 105.9375 Kbps / 211.8750 Kbps • Method of modulation type : ASK • Modulation level m : PICC : 8.0% to 14.0% PCD : 30/H1.2 (mVpeak) • Bit coding Logic “1” : High magnetic field amplitude (with no modulation) Logic “0” : Low magnetic field amplitude The modulation level m is defined by the formula m = (a − b) / (a + b) as shown in the figure below. Here, a and b are the maximum and minimum amplitudes of the magnetic field strength generated by PCD. The rising and falling edges of these amplitude changes are monotonic. The transition times are 1 µs or less. • Definition of modulation level v a v = 0.2 × (a − b) b tf tr (2) Data transmission from PICC to PCD • Communication speed fb : 105.9375 Kbps (fc/128) • Method of data transmission : Load Modulation PCD always sends logic “1” during data transfer from PICC. • Load modulation sub-carrier frequency fs : 847.5 kHz (fc/16) • Method of sub-carrier modulation : BPSK Phase changes occur at valid timings on the sub-carrier rise and fall. The sub-carrier fs is modulated by the data using BPSK modulation. The carrier fc is further amplitude modulated by the phase-changed sub-carrier. • Bit coding : NRZ-L • Load Modulation load resistance : Modulation circuit resistance 150 Ω 13 MB94R215B 4. Notes on carrier When handling the device for the contactless IC cards, observe the following to prevent the improper operation or damage to the device. Keep in mind, however, that the transmission characteristics are dependent on the antenna design and reader/writer characteristics, so the values below are only for reference and the values below are not intended to guarantee the finished card characteristics. Ensure that operation and transmission characteristics have no problems in the environments where you use a card. (1) Rising of carrier Ensure that the carrier rise time is in the range 100 µs to 500 µs and that the carrier rises continuously with a deviation of ± 2.4% or less. • Rising waveform of carrier Deviation = (A − B) / (A + B) A B Rising Time = 100 µs to 500 µs (2) Falling of carrier Ensure that the carrier fall time is in the range 100 µs to 100 ms and that the carrier falls continuously with a deviation of ± 2.4% or less. • Falling waveform of carrier Deviation = (A − B) / (A + B) B A Falling time = 100 µs to 100 ms 14 MB94R215B (3) Stop of carrier The MB94R215B has internal capacitance to smooth the power supply and similar. Accordingly, always provide a gap of 100 ms or longer between halting and restarting the carrier to allow the internal state to stabilize. • Stop time of carrier Carrier stop time ≥ 100 ms (4) Carrier deviation (noise, momentary stop, etc.) Ensure that the deviation when not modulated is ± 2.4% or less. The following problems may occur if variation (noise) in excess of this limit occurs. • If the carrier falls within the ASK modulation level range (8 to 14%), this may be misinterpreted as a modulation signal. However, if the frame is determined to be invalid, the command receive block will be cleared and the device will return to the command standby state. • If the carrier variation exceeds the ASK modulation level range in the region 0 A/m to 12 A/m, misoperation may occur and internal circuits may reset. In this case, temporarily turn off the carrier in accordance with the precautions in "(3) Stop of carrier". If the carrier is not turned off, misoperation may corrupt internal data. • If the carrier exceeds the ASK modulation level range over 12A/m, the device may be damaged due to the increase in internal voltage. • Carrier deviation 12 A/m 4 A/m C D E Deviation = (C − D) / (C + D) × 100 = (E − C) / (E + C) × 100 15 MB94R215B (5) Operating conditions Contactless devices (cards) can only be used in a one-to-one communication with a reader/writer. Do not try to use the MB94R215B embedded card to a reader/writer with multiple other contactless cards. Use of multiple contactless devices may corrupt data or cause the device to misoperate. Using the device in the presence of strong magnetic fields (12 A/m or stronger) or with reader/writers that do not match the specifications may cause data corruption. 16 MB94R215B ■ MARKING MB94R215BPMB Seal diagram MB94R215B 9 XXX Font Character height 9 XXX : Gothic : 1 mm : Year code 1 character : Month code 1 character : Factory symbol : Serial number 2 characters : ROM code ■ ORDERING INFORMATION Part number Package Remarks MB94R215BPMB CRD-10P-M05 For Dual Interface 17 MB94R215B MEMO 18 MB94R215B MEMO 19 FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. 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