GMT G574SA

G574
Global Mixed-mode Technology Inc.
Dual-Slot PCMCIA/CardBus Power Controller
Features
Description
„
The G574 PC Card power-interface switch provides an
integrated power-management solution for two PC
Cards. All of the discrete power MOSFETs, a logic section, current limiting, and thermal protection for PC Card
control are combined on a single integrated circuit (IC).
The circuit allows the distribution of 3.3V, 5V, and/or
12V card power by means of the Serial interface. The
current-limiting feature eliminates the need for fuses,
which reduces component count and improves reliability.
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Backward Compatible with G570
Fully Integrated VCC and Vpp Switching for Dual
Slot PC CardTM Interface
3-Lead Serial Interface Compatible With
CardBusTM Controllers
3.3V Low Voltage Mode
Meets PC Card Standards
RESET for System Initialization of PC Cards
12V Supply Can Be Disabled Except During
12V Flash Programming
Short Circuit and Thermal Protection
30 Pin SSOP
Compatible With 3.3V, 5V and 12V PC Cards
Low RDS(on) (180-mΩ 5V VCC Switch;
130 mΩ 3.3V VCC Switch)
Break-Before-Make Switching
Internal power-On Reset
Standby mode: 60mA current limit (TYP)
The G574 features a 3.3V low voltage mode that allows
for 3.3V switching without the need for 5V supply. This
facilitates low power system designs such as sleep
mode and pager mode where only 3.3V is available.
The G574 incorporates a reset function, selectable by
one of two inputs, to help alleviate system errors. The
reset function enables PC card initialization concurrent
with host platform initialization, allowing a system reset.
Reset is accomplished by grounding the VCC and VPP
(flash-memory programming voltage) outputs, which
discharges residual card voltage.
Application
„
Notebook PC
Electronic Dictionary
„ POS
This device also has the ability to program the xVpp
outputs independent of the xVCC outputs. A standby
mode that changes all output-current limits to 50mA
(typical) has been incorporated.
„
End equipment for the G574 includes notebook computers, desktop computers, personal digital assistants
(PDAs), digital cameras and bar-code scanners.
The G574 is backward-compatible with the G570.
Ordering Information
ORDER
NUMBER
ORDER NUMBER
(Pb free)
TEMP.
RANGE
PACKAGE
G574SA
G574SAf
-40°C to +85°C
SSOP-30
Pin Configuration
G574
5V
5V
1
30
5V
DATA
2
29
MODE
28
NC
CLOCK
3
4
27
LATCH
5
NC
NC
RESET
6
26
25
12V
24
23
12V
AVPP
7
8
AVCC
9
22
BVCC
AVCC
10
11
21
BVCC
20
12
19
BVCC
STBY
AVCC
GND
NC
BVPP
NC
13
18
RESET
14
17
OC
3.3V
3.3V
15
16
3.3V
SSOP-30
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G574
Global Mixed-mode Technology Inc.
Absolute maximum ratings over operating
free-air temperature (unless otherwise noted)*
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 125°C
Operating free-air temperature range, TA
. . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . .-40°C to 85°C
Storage temperature range,
TSTG. . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to 150°C
Thermal resistance θJA
SSOP-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . .122°C/W
Power dissipation PD (TA ≤ +25°C)
SSOP-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1024mW
ESD. . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . .Note1
Input voltage range for card power:
VI(3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
VI(5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
VI(12V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 14V
Logic input voltage. . . . . . . . . . . . . . . . . . . -0.3V to 6V
Output current (each card):
IO (xVCC) . . . . . . . . . . . . . . . . . . . . . . . . internally limited
IO(xVPP) . . . . . . . . . . . . . . . . . . . . . . . . .internally limited
Operating virtual junction temperature range, TJ
*Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress rating
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Note 1: ESD (electrostatic discharge) sensitive device. Proper ESD precautions are recommended to avoid performance degradation or
less of functionality.
Recommended Operating Conditions
VI (5V)
VI (3.3V)
Input voltage range, VI
VI (12V)
IO (xVCC) at 25°C
IO (xVPP) at 25°C
Output current
Clock frequency
Operating virtual junction temperature, TJ
Min
Max
Unit
2.7
2.7
------0
-40
5.25
5.25
13.5
1
150
2.5
125
V
V
V
A
mA
MHz
°C
Typical PC Card Power-Distribution Application
AVCC
0.1µF
AVCC
12V
12V
0.1µF
AVCC
VCC
VPP1
PC Card
Connector A
VPP2
10µF
BVCC
12V
(Ceramic)
VCC
BVCC
BVCC
VCC
0.1µF
5V
5V
0.1µF
33µF
G574
0.1µF
PC Card
VPP1 Connector B
VPP2
5V
5V
(Ceramic)
AVPP
VCC
BVPP
0.1µF
3.3V
3.3V
0.1µF
(Ceramic)
33µF
3.3V
DATA
CLOCK
3.3V
DATA
CLOCK
LATCH
LATCH
System Voltage
Supervisor
or
PCI Bus Reset
RESET
RESET
MODE
STBY
PCMCIA
Controller
GPI/O
OC
GND
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G574
Global Mixed-mode Technology Inc.
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
3.3V
15,16,17
I
3.3V VCC input for card power
5V
1,2,30
I
5V VCC input for card power and/or chip power
12V
7,24
I
12V VPP input for card power
AVCC
9,10,11
O
Switched output that delivers 0V, 3.3V, 5V or high impedance to card
AVPP
8
O
Switched output that delivers 0V, 3.3V, 5V, 12V or high impedance to card
BVCC
20,21,22
O
Switched output that delivers 0V, 3.3V, 5V or high impedance
BVPP
23
O
Switch output that delivers 0V, 3.3V, 5V, 12V or high impedance
GND
12
MODE
29
Ground
I
G570 operation when floating or pulled low; must be pulled high externally for G574 operation.
MODE is internally pulled low with a 150kΩ pulldown resistor.
OC
18
O
Logic-level overcurrent. reports output that goes low when an overcurrent condition exists
RESET
6
I
Logic-level reset input active high. Do not connect if RESET pin is used. RESET is internally
pulled low with a 150kΩ pulldown resistor.
RESET
14
I
Logic-level reset input active low. Do not connect if RESET pin is used. The pin is internally
pulled high with a 150kΩ pullup resistor to 5V, if 5V VCC exists. And pulled to 3.3V, if 3.3V VCC
exists only.
STBY
19
Logic-level active low input sets the G574 to standby mode and sets all current limits to 50mA.
The pin is internally pulled high with a 150kΩ pullup resistor to 5V, if 5V VCC exists. And pulled
to 3.3V, if 3.3V VCC exists only.
CLOCK
4
I
Logic level clock for serial data word
DATA
3
I
Logic level serial data word
5
I
Logic level latch for serial data word
LATCH
NC
13,25,26,
27,28
No internal connection
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G574
Global Mixed-mode Technology Inc.
Electrical Characteristics
(TA=TJ =25°C, VI(5V)=5V, VI(3.3V)=3.3V, VI(12V)=12V, STBY floating, all outputs unloaded (unless otherwise noted)
DC Characteristics
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
5V to xVCC
3.3V to xVCC
3.3V to xVCC
5V to xVPP
3.3V to xVPP
12V to xVPP
3.3V/5V to xVCC
3.3V/5V to xVPP
12V to xVPP
Switch resistance*
VI(5V) = 5V, VI(3.3V) =3.3V
VI(5V) = 0V, VI(3.3V) =3.3V
STBY = low, IO = 30mA
VO(xVPP) Clamp low voltage
VO(xVCC) Clamp low voltage
IIKG Leakage current
IPP high impedance State
ICC high-impedance State
Normal operation
and in reset mode
II
☉
Input current
Shutdown mode
IOS Short-circuit*
Output current Limit
Thermal shutdown
※
IPP at 10mA
ICC at 10mA
TA = 25°C
TA = 25°C
II(3.3V)
II(5V)
II(12V)
II(3.3V)
II(5V)
II(12V)
II(3.3V)
II(5V)
II(12V)
IO(xVCC)
IO(xVPP)
Standby mode, 3.3V to xVCC
Standby mode, 5V to xVCC
Standby mode, 3.3V to xVPP
Standby mode, 5V to xVPP
Standby mode, 12V to xVPP
Trip point, TJ
Hysteresis
VO(xVCC) = VO(xVCC) = 5V
VI(5V) = 0, VO(xVCC) = 3.3V
VO(xVPP) = 12V
VO(xVCC) = Hi-Z, VO(xVPP) = Hi-Z
Output powered into a short to
GND
TJ = 25°C Output powered into a
short to GND
STBY =0V
--------------------------------------------0.8
120
---------------
150
100
110
3
2.9
1.3
1.2
12
5
0.18
0.13
0.3
0.3
6
110
5
82
0
17
--2
------55
70
44
78
60
155
10
180
130
150
4
4
2
2
12.5
6.5
0.8
0.8
1
1
15
150
15
150
mΩ
Ω
Ω
V
V
µA
µA
µA
45
1
10
1
2.2
450
120
120
120
120
110
-----
µA
A
mA
mA
°C
* Pulse-testing techniques are used to maintain junction temperature close to ambient temperatures; thermal effects must be taken into account separately.
☉Input currents do not include logic input currents (presented in electrical characteristics for logic section); clock is inactive.
※Specified by design, not tested in production.
Logic Section
PARAMETER
II (RESET) or ( RESET )*
Logic input current
II (MODE)*
*
II ( STBY )
TEST CONDITION
MIN
TYP
MAX
VI(RESET) = 5V or VI ( RESET ) = 0V
VI(RESET) = 0V or VI ( RESET ) = 5V
-------------
35
--35
----35
50
1
50
1
1
50
---
---
1
2
2
VI(5V)-0.4
VI(3.3V)-0.4
---------
--0.8
-----
V
V
---
---
0.4
V
VI(MODE) = 5V
VI(MODE) = 0V
VI ( STBY )= 5V
VI ( STBY )= 0V
II(CLOCK) or II(DATA) or II
(LATCH)
Logic input high level
Logic input low level
Logic output high level, OC
Logic output low level, OC
VI(5V) = 5V, IO = 1mA
VI(5V) = 0V, IO = 1mA
IO = 1mA
UNIT
µA
V
*RESET and MODE have internal 150kΩ pulldown resistors; RESET and STBY have internal 150kΩ pullup resistors.
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G574
Global Mixed-mode Technology Inc.
Switching Characteristics *, **
PARAMETER
tr
Output rise time
tf
Output fall time
TEST CONDITION
VO (xVCC)
VO (xVPP) (12V)
VO (xVPP) (3.3V or 5V)
VO (xVCC)
VO (xVPP)
tpd(on)
tpd(off)
tpd(on)
tpd(off)
tpd(on)
tpd(off)
tpd(on)
tpd(off)
tpd(on)
tpd(off)
tpd(on)
tpd(off)
LATCH↑to VO(xVPP(12V)
LATCH↑to VO(xVPP= xVCC) (3.3V), VI(5V) = 5V
tpd
Propagation delay (see
Figure 1)
LATCH↑to VO(xVPP= xVCC) (5V)
LATCH↑to VO(xVCC) (3.3V), VI(5V) = 5V
LATCH↑to VO(xVCC) (5V)
LATCH↑to VO(xVCC) (3.3V), VI(5V) = 0V
MIN
TYP
MAX
-----------------------------------
2
0.04
0.4
0.01
0.01
0.2
1.8
1.7
2.2
1.7
2.2
2.4
8.5
1
8.5
2.6
8.2
-----------------------------------
UNIT
ms
ms
ms
ms
ms
ms
ms
ms
* Refer to Parameter Measurement Information
**Switching Characteristics are with CL = 0.1µF
Parameter Measurement Information
xVPP
xVCC
IO(xVPP)
IO(xCC)
LOAD CIRCUIT
VDD
VDD
50%
50%
GND
LATCH
GND
LATCH
tpd(off)
tpd(off)
tpd(on)
tpd(on)
90%
VO(xVPP)
90%
VO(xVCC)
GND
10%
Propagation Delay (xVPP)
Propagation Delay (xVCC)
tf
tr
tf
tr
90%
VO(xVPP)
90%
VO(xVCC)
GND
10%
GND
10%
GND
10%
Rise/Fall Time (xVPP)
Rise/Fall Time (xVCC)
VDD
VDD
50%
50%
LATCH
GND
LATCH
GND
toff
toff
ton
ton
90%
VO(xVPP)
90%
VO(xVCC)
GND
10%
Turn on/off Time (xVPP)
10%
GND
Turn on/off Time (xVCC)
VOLTAGE WAVEFORMS
Figure 1. Test Circuits and Voltage Waveforms
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G574
Global Mixed-mode Technology Inc.
DATA
D10
D9
D8
D7
D5
D6
Data Setup Time
D4
D3
D2
Data Hold Time
D1
D0
Latch Delay Time
LATCH
Clock Delay Time
CLOCK
Note:Data is clocked in on the positive edge of the clock. The positive edge of the latch signal should occur before the next
positive edge of the clock. For definition of D0 to D10, see the control logic table.
Figure 2. Serial-Interface Timing for Independent xVPP Switching When MODE=5V or 3.3V
DATA
D8
Data Setup Time
D7
D6
D5
D4
D3
D2
D1
D0
Latch Delay Time
Data Hold Time
LATCH
Clock Delay Time
CLOCK
Note:Data is clocked in on the positive edge of the clock. The positive edge of the latch signal should occur before the next
positive edge of the clock. For definition of D0 to D8, see the control logic table.
Figure 3. Serial-Interface Timing When MODE = 0V or Floating
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Global Mixed-mode Technology Inc.
G574
Switching Characteristics
Switching Characteristics
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Global Mixed-mode Technology Inc.
G574
Switching Characteristics
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Global Mixed-mode Technology Inc.
G574
Switching Characteristics
Switching Characteristics
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Global Mixed-mode Technology Inc.
Ver: 1.2
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G574
TEL: 886-3-5788833
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Global Mixed-mode Technology Inc.
G574
Application Information
tional voltage losses. Second, when an overcurrent
condition is detected, the G574 asserts a signal at
OC that can be monitored by the microprocessor to
initiate diagnostics and/or send the user a warning
message. In the event that an overcurrent condition
persists, causing the IC to exceed its maximum junction temperature, thermal-protection circuitry activates,
shutting down all power outputs until the device cools
to within a safe operating region.
Overview
PC Cards were initially introduced as a means to add
EEPROM (flash memory) to portable computers with
limited on-board memory. The idea of add-in cards
quickly took hold; modems, wireless LANs, Global
Positioning Satellite (GPS), multimedia, and hard-disk
versions were soon available. As the number of PC
Card applications grew, the engineering community
quickly recognized the need for a standard to ensure
compatibility across platforms. To this end, the
PCMCIA was established, comprised of members
from leading computer, software, PC Card, and semiconductor manufactures. One key goal was to realize
the “plug-and play” concept. Cards and hosts from
different vendors should be compatible—able to communicate with one another transparently.
12V Supply Not Required
Most PC Card switches use the externally supplied
12V VPP power for switch-gate drive and other chip
functions, which requires that power be present at all
times. The G574 offers considerable power savings by
using an internal charge pump to generate the required higher voltages from 5V or 3.3V input; therefore,
the external 12V supply can be disable except when
needed for flash-memory functions, thereby extending
battery lifetime. Do not ground the 12V input if the 12V
input is not used. Additional power savings are realized by the G574 during a software shutdown in which
quiescent current drops to a typical of 2µA.
PC Card Power Specification
System compatibility also means power compatibility.
The most current set of specifications (PC Card Standard) set forth by the PCMCIA committee states that
power is to be transferred between the host and the
card through eight of the 68 terminals of the PC Card
connector. This power interface consists of two VCC,
two VPP, and four ground terminals. Multiple VCC and
ground terminals minimize connector-terminal and line
resistance. The two VPP terminals were originally
specified as separate signals but are commonly tied
together in the host to form a single node to minimize
voltage losses. Card primary power is supplied
through the VCC terminals; flash-memory programming
and erase voltage is supplied through the VPP terminals.
3.3V Low Voltage Mode
The G574 operates in 3.3V low voltage mode when
3.3V is the only available input voltage (VI(5V)=0,
VI(12V)=0).This allows host and PC Cards to be operated in low power 3.3V only modes such as sleep
modes or pager modes. Note that in this operation
mode, the G574 derives its bias current from the 3.3V
input pin and only 3.3V can be delivered to the Card.
The 3.3V switch resistance increases, but the added
switch resistance should not be critical, because only
a small amount of current is delivered in this mode.
Overcurrent and Over-Temperature Protection
PC Cards are inherently subject to damage that can
result from mishandling. Host systems require protection against short-circuited cards that could lead to
power supply or PCB-trace damage. Even systems
robust enough to withstand a short circuit would still
undergo rapid battery discharge into the damaged PC
Card, resulting in the rather sudden and unacceptable
loss of system power. Most hosts include fuses for
protection. However, the reliability of fused systems is
poor, as blown fuses require troubleshooting and repair, usually by the manufacturer.
Voltage Transitioning Requirement
PC Cards, like portables, are migrating from 5V to
3.3V to minimize power consumption, optimize board
space, and increase logic speeds. The G574 is designed to meet all combinations of power delivery as
currently defined in the PCMCIA standard. The latest
protocol accommodates mixed 3.3V/5V systems by
first powering the card with 5V, then polling it to determine its 3.3V compatibility. The PCMCIA specification requires that the capacitors on 3.3V compatible
cards be discharged to below 0.8 V before applying
3.3V power. This ensures that sensitive 3.3V circuitry
is not subjected to any residual 5V charge and functions as a power reset. The G574 offer a selectable
VCC and VPP ground state, in accordance with PCMCIA
3.3V/5V switching specifications, to fully discharge the
card capacitors while switching between VCC voltage.
The G574 takes a two-pronged approach to overcurrent protection. First, instead of fuses, sense FETs
monitor each of the power outputs. Excessive current
generates an error signal that linearly limits the output
current, preventing host damage or failure. Sense
FETs, unlike sense resistors or polyfuses, have an
added advantage in that they do not add to the series
resistance of the switch and thus produce no addi-
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Global Mixed-mode Technology Inc.
Shutdown Mode
In the shutdown mode, which can be controlled by bit
D8 of the input serial DATA word, each of he xVCC
and xVPP outputs is forced to a high-inpedance state.
In this mode, the chip quiescent current is limited to
2µA or less to conserve battery power.
G574
Power Supply Considerations
The G574 has multiple pins for each of its 3.3V, 5V,
and 12V power inputs and for switched VCC outputs.
Any individual pin can conduct the rated input or output current. Unless all pins are connected in parallel,
the series resistance is significantly higher than that
specified, resulting in increased voltage drops and lost
power. Both 12V inputs must be connected for proper
VPP switching; it is recommended that all input and
output power pins be paralleled for optimum operation.
Standby Mode
The G574 can be put in standby mode by pulling
STBY low to conserve power during low-power operation. In this mode, all of the power outputs (xVCC and
xVPP) will have a nominal current limit of 50mA.
STBY has an internal 150kΩ pullup resistor. The output-switch status of the device must be set, allowing
the output capacitors to charge, prior to enabling the
standby mode. Changing the setting of the output
switches with the device in standby mode may cause
an overcurrent response to be generated.
Although the G574 is fairly immune to power input
fluctuations and noise, it is generally considered good
design practice to bypass power supplies typically with
a 1µF electrolytic or tantalum capacitor paralleled by a
0.047µF to 0.1µF ceramic capacitor. It is strongly recommended that the switched VCC and VPP outputs be
bypassed with a 0.1µF or larger capacitor; doing so
improves the immunity of the G574 to electrostatic
discharge (ESD). Care should be taken to minimize
the inductance of PCB traces between the G574 and
the load. High switching currents can produce large
negative-voltage transients, which forward biases substrate diodes, resulting in unpredictable performance.
Similarly, no pin should be taken below –0.3V.
Mode
The mode pin programs the switches in either G574 or
G570 mode. An internal 150 kΩ pulldown resistor is
connected to the pin. Floating or pulling the mode pin
low sets the switches in G570 mode; pulling the mode
pin high sets the switches in G574 mode. In
G570mode, xVPP outputs are dependent on xVCC
outputs. In G574 mode, xVPP is programmed independent of xVCC. Refer to G574 control-logic tables
for more information.
RESET or RESET Inputs
To ensure that cards are in a known state after power
brownouts or system initialization, the PC Cards
should be reset at the same time as the host by applying a low impedance to the xVCC and xVPP terminals
to ground. A low impedance output state allows discharging of residual voltage remaining on PC Card
filter capacitance, permitting the system (host and PC
Cards) to be powered up concurrently. The RESET or
RESET input will closes internal switches S1, S4, S7,
and S11 with all other switches left open (see G574
control logic table). The G574 remains in the low impedance output state until the signal is deasserted and
further data is clocked in and latched. RESET or
RESET are provided for direct compatibility with systems that use either an active-low or active-high reset
voltage supervisor. The unused pin is internally pulled
up or down and should be left unconnected.
Output Ground Switches
Several PCMCIA power distribution switches on the
market do not have an active grounding FET switch.
These devices do not meet the PC Card specification
requiring a discharge of VCC within 100ms. PC Card
resistance can not be relied on to provide a discharge
path for voltages stored on PC Card capacitance because of possible high impedance isolation by power
management schemes. A method commonly shown to
alleviate this problem is to add to the switch output an
external 100kΩ resistor in parallel with the PC Card.
Considering that this is the only discharge path to
ground, a timing analysis show that the RC time constant delays the required discharge time to more than
2 seconds. The only way to ensure timing compatibility
with PC Card standards is to use a power-distribution
switch that has an internal ground switch, like that of
the G574, or add an external ground FET to each of
the output lines with the control logic necessary to select it.
Overcurrent and Thermal Protection
The G574 uses sense FETs to check for overcurrent
conditions in each of the VCC and VPP outputs. Unlike
sense resistors or polyfuses, these FETs do not add to
the series resistance of the switch; therefore, voltage
and power losses are reduced. Overcurrent sensing is
applied to each output separately. When an overcurrent condition is detected, only the power output affected is limited; all other power outputs continue to
function normally. The OC indicator, normally a logic
high, is a logic low when any overcurrent condition is
detected, providing for initiation of system diagnostics
and/or sending a warning message to the user.
In summary, the G574 is a complete single-chip
dual-slot PC Card power interface. It meets all currently defined PCMCIA specifications for power delivery in 5V, 3.3V, and mixed systems, and offers a serial
control interface. The G574 offers functionality, power
savings, overcurrent and thermal protection, and fault
reporting in one 30 pin SSOP surface-mount package
for maximum value added to new portable designs.
Ver: 1.2
Jul 28, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
12
G574
Global Mixed-mode Technology Inc.
Logic Input and Outputs
The serial interface consists of DATA, CLOCK, and
LATCH leads. The data is clocked in on the positive
leading edge of the clock (see Figure 2 and 3 ). The bit
(D0 through D10 serial data word is loaded during the
positive edge of the latch signal. The latch signal
should occur before the next positive leading edge of
the block.
During power up, the G574 controls the rise time of
the VCC and VPP outputs and limits the current into a
faulty card or connector. If a short circuit is applied
after power is established (e.g., hot insertion of a bad
card), current is initially limited only by the impedance
between the short and the power supply. In extreme
cases, as much as 10A to 15A may flow into the short
before the current limiting of the G574 engages. If the
VCC or VPP outputs are driven below ground, the G574
may latch nondestructively in an off state. Cycling
power will reestablish normal operation.
The shutdown bit of the data word places all VCC and
VPP outputs in a high-impedance state and reduces
chip quiescent current to 2µA to conserve battery
power.
Overcurrent limiting for the VCC outputs is designed to
activate, if powered up, into a short in the range of
0.8A to 2.2A. The VPP outputs limit from 120mA to
450mA. The protection circuitry acts by linearly limiting
the current passing through the switch rather than initiating a full shutdown of the supply. Shutdown occurs
only during thermal limiting.
The G574 serial interface is designed to be compatible
with serial-interface PCMCIA controllers and current
PCMCIA and Japan Electronic Industry Development
Association (JEIDA) standards.
An overcurrent output ( OC ) is provided to indicate an
overcurrent condition in any of the VCC or VPP outputs
as previously discussed.
Thermal limiting prevents destruction of the IC from
overheating if the package power-dissipation ratings are
exceeded. Thermal limiting disables all power outputs
(both A and B slots) until the device has cooled.
Functional Block Diagram
9
G574
10
3.3V
3.3V
3.3V
15
S1
11
AVCC
AVCC
AVCC
16
17
S2
CS
S7
8
AVPP
S3
CS
S8
CS
S9
CS
20
S10
1
5V
5V
5V
2
CS
21
S4
22
BVCC
BVCC
BVCC
30
S5
CS
S11
23
S6
BVPP
CS
S12
CS
12V
12V
S13
7
CS
S14
24
CS
Internal
Current Monitor
29
19
3
4
5
6
14
18
M ODE
STBY
DATA
CLOCK
LATCH
RESET
RESET
OC
T herm al
GND
12
Both 12V pins m ust be connected together.
Ver: 1.2
Jul 28, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
13
G574
Global Mixed-mode Technology Inc.
G574 control logic
G574 mode (MODE pulled high)
xVPP
AVPP CONTROL SIGNALS
BVPP CONTROL SIGNALS
D8 ( SHDN )
D0
D1
D9
OUTPUT
V_AVPP
D8 ( SHDN )
D4
D5
D10
OUTPUT
V_BVPP
1
1
1
1
1
0
0
0
0
1
1
×
0
1
1
0
1
×
×
0
1
×
×
×
0V
3.3V
5V
12V
Hi-Z
Hi-Z
1
1
1
1
1
0
0
0
0
1
1
×
0
1
1
0
1
×
×
0
1
×
×
×
0V
3.3V
5V
12V
Hi-Z
Hi-Z
xVCC
D8 ( SHDN )
1
1
1
1
0
AVCC CONTROL SIGNALS OUTPUT
V_AVCC
D3
D2
0
0
1
1
×
0
1
0
1
x
BVCC CONTROL SIGNALS
D8 ( SHDN )
D6
D7
OUTPUT
V-BVCC
1
1
1
1
0
0
0
1
1
×
0
1
0
1
x
0V
3.3V
5V
0V
Hi-Z
0V
3.3V
5V
0V
Hi-Z
G570 mode (MODE floating or pulled low)
xVPP
AVPP CONTROL SIGNALS
BVPP CONTROL SIGNALS
D8 ( SHDN )
D0
D1
OUTPUT
V_AVPP
D8 ( SHDN )
D4
D5
OUTPUT
V-BVPP
1
0
0
0V
1
0
0
0V
1
1
0
1
1
0
V_AVCC
12V
1
1
0
1
1
0
V_BVCC
12V
1
0
1
×
1
x
Hi-Z
Hi-Z
1
0
1
×
1
x
Hi-Z
Hi-Z
xVCC
AVCC CONTROL SIGNALS OUTPUT
V_AVCC
D3
D2
BVCC CONTROL SIGNALS
D7
OUTPUT
V-BVCC
D8 ( SHDN )
D6
1
1
0
0
0
1
0V
3.3V
1
1
0
0
0
1
0V
3.3V
1
1
0
1
1
×
0
1
x
5V
0V
Hi-Z
1
1
0
1
1
×
0
1
x
5V
0V
Hi-Z
D8 ( SHDN )
Ver: 1.2
Jul 28, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
14
G574
Global Mixed-mode Technology Inc.
through the PC Card connector. Bypassing the outputs
with 0.1µF capacitors protects the devices from discharges up to 10kV.
ESD Protection
The xVCC and xVPP outputs can be exposed to potentially higher discharges from the external environment
AVCC
0.1µF
AVCC
12V
12V
0.1µF
AVCC
VCC
VPP1
PC Card
Connector A
VPP2
10µF
BVCC
12V
(Ceramic)
VCC
BVCC
BVCC
VCC
0.1µF
5V
5V
0.1µF
33µF
G574
0.1µF
PC Card
VPP1 Connector B
VPP2
5V
5V
(Ceramic)
AVPP
VCC
BVPP
0.1µF
3.3V
3.3V
0.1µF
(Ceramic)
33µF
3.3V
DATA
CLOCK
3.3V
DATA
CLOCK
LATCH
LATCH
System Voltage
Supervisor
or
PCI Bus Reset
RESET
RESET
MODE
STBY
PCMCIA
Controller
GPI/O
OC
GND
Figure 3. Detailed Interconnections and Capacitor Recommendations
Ver: 1.2
Jul 28, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
15
G574
Global Mixed-mode Technology Inc.
Package Information
c
D
L1
E1
L
E
1 .1 5
3 .6
θ
A1
e
b
A
A2
Note:
1. Dimensional tolerance ±0.10mm
2. Plating thickness 5~15µm
3. Dimensions “D” does not include burrs, however dimension including protrusions or gate burrs
Shall be MAX. 0.20mm
4. Dimension “E1” does not include inter-lead flash or protrusion. Inter-lead flash or protrusion small not exceeds 0.25 per side.
SYMBOL
A
A1
A2
b
C
D
E
E1
L1
L
e
θ
MIN.
DIMENSION IN MM
NOM.
1.80
1.75
0.05
0.25
0.10
10.10
7.50
5.20
0.53
1.10
1°
1.90
1.80
0.10
0.30
0.15
10.15
----5.25
0.68
1.20
0.65 BSC
4°
MAX.
MIN.
2.00
1.85
0.15
0.35
0.20
10.20
7.90
5.30
0.83
1.30
0.071
0.069
0.002
0.010
0.004
0.398
0.295
0.205
0.021
0.043
7°
1°
DIMENSION IN INCH
NOM.
0.075
0.071
0.004
0.012
0.006
0.400
----0.207
0.027
0.047
0.026BSC
4°
MAX.
0.079
0.073
.006
0.014
0.008
.402
0.311
0.209
0.033
0.051
7°
Taping Specification
PACKAGE
Q’TY/REEL
SSOP-30
2,000 ea
Feed Direction
Typical SSOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Ver: 1.2
Jul 28, 2006
TEL: 886-3-5788833
http://www.gmt.com.tw
16