AGILENT MSA-0505-TR1

Cascadable Silicon Bipolar
MMIC␣ Amplifier
Technical Data
MSA-0505
Features
Description
• Cascadable 50 Ω Gain Block
The MSA-0505 is a high performance medium power silicon
bipolar Monolithic Microwave
Integrated Circuit (MMIC) housed
in a low cost, surface mount
package. This MMIC is designed
for use as a general purpose 50 Ω
gain block. Typical applications
include narrow and broad band IF
and RF amplifiers in commercial
systems.
• High Output Power:
18.0 dBm Typical P1 dB at
1.0␣ GHz
• Low Distortion:
29.0 dBm Typical IP3 at 1.0␣ GHz
• 7.0 dB Typical Gain at
1.0␣ GHz
• Surface Mount Plastic
Package
• Tape-and-Reel Packaging
Option Available[1]
Note:
1. Refer to PACKAGING section
“Tape-and-Reel Packaging for
Semiconductor Devices.”
The MSA-series is fabricated using
HP’s 10 GHz fT, 25␣ GHz f MAX,
silicon bipolar MMIC process
which uses nitride self-alignment,
ion implantation, and gold metallization to achieve excellent
performance, uniformity and
reliability. The use of an external
bias resistor for temperature and
current stability also allows bias
flexibility.
Typical Biasing Configuration
R bias
VCC > 12 V
RFC (Optional)
4
C block
C block
3
IN
1
2
5965-9581E
OUT
MSA
Vd = 8.4 V
6-354
05 Plastic Package
MSA-0505 Absolute Maximum Ratings
Absolute Maximum[1]
135 mA
1.5 W
+25 dBm
200°C
–65 to 150°C
Parameter
Device Current
Power Dissipation[2,3]
RF Input Power
Junction Temperature
Storage Temperature
Electrical Specifications[1], TA = 25°C
Symbol
P1 dB
GP
Parameters and Test Conditions: Id = 80 mA, ZO = 50 Ω
Output Power at 1 dB Gain Compression
Power Gain (|S21| 2)
∆GP
Gain Flatness
f3 dB
3 dB Bandwidth[2]
VSWR
Thermal Resistance[2,4]:
θjc = 85°C/W
Notes:
1. Permanent damage may occur if
any of these limits are exceeded.
2. TCASE = 25°C.
3. Derate at 11.8 mW/°C for TC > 73°C.
4. See MEASUREMENTS section
“Thermal Resistance” for more
information.
Units
Min.
Typ.
f = 0.5 GHz
f = 1.0 GHz
dBm
dBm
16.0
19.0
18.0
f = 0.5 GHz
f = 1.0 GHz
dB
6.0
7.5
7.0
f = 0.1 to 1.5 GHz
dB
± 0.75
GHz
2.3
Input VSWR
f = 0.1 to 1.5 GHz
1.6:1
Output VSWR
f = 0.1 to 1.5 GHz
2.0:1
IP3
Third Order Intercept Point
f = 1.0 GHz
dBm
29.0
NF
50 Ω Noise Figure
f = 1.0 GHz
dB
6.5
tD
Group Delay
f = 1.0 GHz
psec
Vd
Device Voltage
dV/dT
Device Voltage Temperature Coefficient
V
mV/°C
Max.
190
6.7
8.4
10.1
–16.0
Notes:
1. The recommended operating current range for this device is 60 to 100 mA. Typical performance as a function of current
is on the following page.
2. Referenced from 0.1 GHz Gain (GP).
Part Number Ordering Information
Part Number
MSA-0505-TR1
MSA-0505-STR
No. of Devices
500
10
Container
7" Reel
Strip
For more information, see “Tape and Reel Packaging for Semiconductor Devices”.
6-355
MSA-0505 Typical Scattering Parameters (TA = 25°C, Id = 80 mA)
S11
S21
S12
S22
Freq.
MHz
Mag
Ang
dB
Mag
Ang
dB
Mag
Ang
Mag
Ang
k
5
25
50
100
200
400
600
800
1000
1500
2000
2500
3000
.56
.24
.15
.13
.12
.12
.13
.13
.14
.21
.30
.40
.52
–39
–103
–130
–155
–170
178
172
168
166
159
148
136
121
14.9
9.7
8.2
7.8
7.7
7.5
7.4
7.2
7.0
6.4
5.2
4.1
2.7
5.56
3.05
2.57
2.45
3.43
2.37
2.34
2.29
2.24
2.09
1.82
1.60
1.36
161
156
163
165
161
148
134
119
105
72
42
17
–7
–18.5
–13.9
–13.7
–13.7
–13.5
–13.6
–13.6
–13.6
–13.4
–13.3
–13.1
–12.9
–12.6
.120
.202
.207
.207
.211
.209
.209
.209
.213
.217
.222
.227
.234
39
12
7
3
1
–1
–2
–3
–4
–6
–9
–11
–16
.65
.25
.15
.11
.11
.14
.17
.21
.25
.34
.42
.48
.55
–36
–90
–116
–132
–145
–146
–151
–157
–164
176
159
146
133
0.60
0.97
1.15
1.21
1.21
1.23
1.23
1.23
1.21
1.16
1.12
1.05
0.92
A model for this device is available in the DEVICE MODELS section.
Typical Performance, TA = 25°C
(unless otherwise noted)
10
120
8
90
20
0.5 GHz
4
P1 dB (dBm)
0.1 GHz
6
Id (mA)
GAIN (dB)
22
TC = +85°C
TC = +25°C
TC = –25°C
60
1.0 GHz
1.5 GHz
2.0 GHz
2
0.5 GHz
18
1.0 GHz
16
30
14
2.0 GHz
0
0
8
10
12
14
16
18
20
22
0
24
3
9
12
Vd (V)
POWER OUT (dBm)
Figure 1. Typical Gain vs. Power Out,
TA = 25°C, Id = 80 mA.
34
IP3 (dBm)
12
10
30
IP3
26
8
22
P1 dB (dBm)
6
4
2
0
.01
.05
0.1
0.5 1.0
FREQUENCY (GHz)
Figure 4. Gain vs. Frequency,
Id = 80 to 100 mA.
5.0
18
14
60
P1 dB
70
80
90
100
Id (mA)
Figure 5. Output Power at 1 dB Gain
Compression, Third Order Intercept
vs. Case Temperature, f = 1.0 GHz.
6-356
12
–25
0
+25
+85
TEMPERATURE (°C)
Figure 2. Device Current vs. Voltage.
14
Gp (dB)
6
Figure 3. Output Power at 1 dB Gain
Compression, vs. Case Temperature,
Id = 80 mA.
05 Plastic Package Dimensions
4
GROUND
0.030
DIA
0.76
0.030
0.89
RF OUTPUT
AND DC BIAS
RF INPUT
5
3
1
0.030 ± 0.010
0.76 ± 0.25
(4 PLCS)
GROUND
0.135 ± 0.015
3.42 ± 0.25
(4 PLCS)
0.020
0.51
0.145
3.68
0.008 ± 0.002
0.20 ± 0.05
Notes:
(unless otherwise specified)
1. Dimensions are in
mm
2. Tolerances
in .xxx = ± 0.005
mm .xx = ± 0.13
2
0.030
0.76
0.050
1.27
0.100 ± 0.010
2.54 ± 0.25
0.0005 ± 0.010
(0.013 ± 0.25)
6-357