Pb Free Plating Product ISSUED DATE :2005/03/01 REVISED DATE :2005/12/12B GU60L02 BVDSS RDS(ON) ID N-CHANNEL ENHANCEMENT MODE POWER MOSFET 25V 13m 50A Description The GU60L02 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-263 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features *Simple Drive Requirement *Low Gate Charge *Fast Switching Package Dimensions REF. A b L4 c L3 L1 E Millimeter REF. Min. Max. 4.40 4.80 c2 0.76 1.00 b2 0.00 0.30 B D 0.36 0.5 e 1.50 REF. L 2.29 2.79 9.80 10.4 L2 Millimeter Min. Max. 1.25 1.45 1.17 1.47 8.6 9.0 2.54 REF. 14.6 15.8 0˚ 8˚ 1.27 REF. Absolute Maximum Ratings Parameter Symbol Ratings Unit Drain-Source Voltage VDS 25 V Gate-Source Voltage VGS ±20 V Continuous Drain Current, VGS@10V ID @TC=25 50 A Continuous Drain Current, VGS@10V ID @TC=100 32 A 180 A 62.5 W Pulsed Drain Current 1 IDM Total Power Dissipation PD @TC=25 Linear Derating Factor 0.5 Operating Junction and Storage Temperature Range Tj, Tstg -55 ~ +150 Symbol Value W/ Thermal Data Parameter Unit Thermal Resistance Junction-case Max. Rthj-case 2.0 /W Thermal Resistance Junction-ambient Max. Rthj-amb 62 /W GU60L02 Page: 1/5 ISSUED DATE :2005/03/01 REVISED DATE :2005/12/12B Electrical Characteristics (Tj = 25 Parameter unless otherwise specified) Symbol Min. Typ. Max. Unit Drain-Source Breakdown Voltage BVDSS 25 - - V Breakdown Voltage Temperature Coefficient BVDSS / Tj - 0.037 - Gate Threshold Voltage VGS(th) 1.0 - 3.0 V VDS=VGS, ID=250uA gfs - 30 - S VDS=10V, ID=25A IGSS - - ±100 nA VGS= ±20V - - 1 uA VDS=25V, VGS=0 - - 25 uA VDS=20V, VGS=0 - - 13 - - 26 Forward Transconductance Gate-Source Leakage Current Drain-Source Leakage Current(Tj=25 ) Drain-Source Leakage Current(Tj=150 ) Static Drain-Source On-Resistance IDSS RDS(ON) V/ m Test Conditions VGS=0, ID=250uA Reference to 25 , ID=1mA VGS=10V, ID=25A VGS=4.5V, ID=20A Total Gate Charge2 Qg - 21 - Gate-Source Charge Qgs - 2.8 - Gate-Drain (“Miller”) Change Qgd - 16 - Td(on) - 8 - Tr - 75 - Td(off) - 22 - Tf - 20 - Input Capacitance Ciss - 605 - Output Capacitance Coss - 415 - Reverse Transfer Capacitance Crss - 195 - Symbol Min. Typ. Max. Unit VSD - - 1.26 V IS=50A, VGS=0V, Tj=25 IS - - 50 A VD=VG=0V, VS=1.26V ISM - - 180 A Symbol Min. Typ. Max. Unit Test Conditions Single Pulse Avalanche Energy2 EAS - - 61 mJ Avalanche Current IAR - - 35 A VDD=25V, ID=35A, L=100uH VGS=10V Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time nC ID=25A VDS=20V VGS=5V ns VDS=15V ID=20A VGS=10V RG=3.3 RD=0.75 pF VGS=0V VDS=25V f=1.0MHz Source-Drain Diode Parameter 2 Forward On Voltage Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) 1 Test Conditions Drain-Source Avalanche Ratings Parameter Notes: 1. Pulse width limited by safe operating area. 2. Pulse width 300us, duty cycle 2%. GU60L02 Page: 2/5 ISSUED DATE :2005/03/01 REVISED DATE :2005/12/12B Characteristics Curve Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Maximum Drain Current v.s. Case Temperature Fig 6. Type Power Dissipation GU60L02 Page: 3/5 ISSUED DATE :2005/03/01 REVISED DATE :2005/12/12B Fig 7. Maximum Safe Operating Area Fig 9. Gate Charge Characteristics Fig 11. Forward Characteristics of Reverse Diode GU60L02 Fig 8. Effective Transient Thermal Impedance Fig 10. Typical Capacitance Characteristics Fig 12. Gate Threshold Voltage v.s. Junction Temperature Page: 4/5 ISSUED DATE :2005/03/01 REVISED DATE :2005/12/12B Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform Fig 15. Gate Charge Circuit Fig 16. Gate Charge Waveform Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165 GU60L02 Page: 5/5