Surface Mount Chip LEDs Technical Data HSMB-C190/C170/ C110/C150 Features Description • • • • • These Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30°C to +85°C • Right Angle Package Available • SiC Blue Color • Available in 8 mm tape on 7" (178 mm) Diameter Reels Applications • • • • • Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMB-C170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 has the industry standard 1.6 x 0.8 mm footprint, its low 0.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The HSMB-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Device Selection Guide Footprint (mm) 2.00 x 1.25 1.60 x 0.80 3.20 x 1.00[1] 3.20 x 1.60 Note: 1. Right-angle package. SiC Blue HSMB-C170 HSMB-C190 HSMB-C110 HSMB-C150 Parts Per Reel 4000 4000 3000 3000 2 Package Dimensions CATHODE MARK CATHODE MARK LED DIE LED DIE 1.25 (0.049) 0.8 (0.031) 0.62 (0.024) 0.4 (0.016) 1.6 (0.063 ) 2.0 (0.079 ) 1.0 (0.039) POLARITY 1.4 (0.055) DIFFUSED EPOXY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY PC BOARD POLARITY 0.8 (0.031) PC BOARD 0.3 (0.012) 0.8 (0.031) 0.3 (0.012) 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) SOLDERING TERMINAL SOLDERING TERMINAL HSMB-C190 HSMB-C170 CATHODE MARK LED DIE 1.0 (0.039) CATHODE MARK LED DIE 2.6 (0.102 ) 1.6 (0.063) 3.2 (0.126 ) 0.8 (0.031) POLARITY CLEAR EPOXY 3.2 (0.126 ) 1.5 (0.059) PC BOARD DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) 0.5 (0.020) 1.6 (0.063 ) PC BOARD 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) 0.50 ± 0.2 (0.020 ± 0.008) 1.0 (0.039) 1.0 (0.039) SOLDERING TERMINAL CATHODE LINE HSMB-C110 NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. SOLDERING TERMINAL HSMB-C150 3 Absolute Maximum Ratings at TA=25°C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) Maximum LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMB-C190/C170/C110/C150 Units 20 mA 100 mA 92 mW 5 V 95 °C -30 to +85 °C -40 to +85 °C See IR soldering profile (Figure 7) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Optical Characteristics at TA=25°C Part No. Color HSMBC190/C170/C150 HSMB-C110 SiC Blue Luminous Intensity[1] Iv (mcd) @ 20 mA Min. Typ. 1.60 6.0 SiC Blue 1.60 6.5 Peak Wavelength λpeak (nm) Typ. 428 Dominant Wavelength λd (nm) Typ. 466 Viewing Angle 2θ1/2 (degrees)[2] Typ. 170 428 466 130 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25 °C Part No. HSMB-C190/C170/C150 HSMB-C110 Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.8 4.6 3.8 4.6 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 Thermal Resistance RθJ-P ( °C/W) Typ. 300 300 Capacitance C (pF) @ VF = 0 V, f = 1 MHz Typ. 67 67 4 100 80 60 40 20 0 380 480 580 10 1 0.1 680 3.0 WAVELENGTH – nm 3.2 3.4 3.6 3.8 0.8 0.6 0.4 0.2 0 5 10 15 RELATIVE INTENSITY – % 90 15 10 5 80 70 60 50 40 30 20 10 0 0 20 40 60 80 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum Forward Current vs. Ambient Temperature. 100 90 RELATIVE INTENSITY – % 25 Figure 3. Relative Luminous Intensity vs. Forward Current. 100 20 20 IF – FORWARD CURRENT – mA Figure 2. Forward Current vs. Forward Voltage. 25 1.0 0 4.0 VF – FORWARD VOLTAGE – V Figure 1. Relative Intensity vs. Wavelength. IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA RELATIVE INTENSITY – % 100 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle for HSMB-C110. 5 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, and HSMB-C150. TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 1.2 (0.047) –3°C/SEC. MAX. 4°C/SEC. MAX. 1.2 (0.047) OVER 2 MIN. 0.9 (0.035) TIME Figure 7. Recommended Reflow Soldering Profile. 1.2 (0.047) Figure 8. Recommended Soldering Pattern for HSMB-C170. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 0.8 (0.031) 1.5 (0.059) 0.2 (0.008) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 9. Recommended Soldering Pattern for HSMB-C190. Note: 1. All dimensions in millimeters (inches). 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 10. Recommended Soldering Pattern for HSMB-C110. 6 USER FEED DIRECTION 1.5 (0.059) CATHODE SIDE 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) PRINTED LABEL Figure 12. Reeling Orientation. Figure 11. Recommended Soldering Pattern for HSMB-C150. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 13. Reel Dimensions. Note: 1. All dimensions in millimeters (inches). 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 7 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) PART NUMBER HSMx-C110 POSITION IN CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) 1.85 (0.073) 1.85 (0.073) 2.40 (0.094) 3.35 (0.132) 3.75 (0.148) 1.00 (0.039) 1.00 (0.039) 1.60 (0.063) 1.85 (0.073) 2.10 (0.083) Figure 14. Tape Dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 15. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.30 (0.051) Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. www.semiconductor.agilent.com Data subject to change. Copyright © 2000 Agilent Technologies, Inc. Obsoletes 5980-1186E 5980-2427E (9/00)