HANBIT HF08

HANBit
HF08-CS2501
FLASH-ROM MODULE 8MByte (2M x 32-Bit), 80pin-SIMM, 5V
Part No. HF08-CS2501
GENERAL DESCRIPTION
The HF08-CS2501 is a high-speed flash read only memory (FROM) module containing 2,097,152 words organized in a
x32bit configuration. The module consists of four 2M x 8bit FROM mounted on a 80-pin, single-sided, FR4-printed circuit
board.
Commands are written to the command register using standard microprocessor write timings.
Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed for the programming and erase operations. Output enable (/OE) and
write enable (/WE) can set the memory input and output.
When FROM module is disable condition the module is becoming power standby mode, system designer can get low -power
design. All module components may be powered from a single +5V DC power supply and all inputs and outputs are TTL compatible.
PIN ASSIGNMENT
FEATURES
PIN
SYMBOL
PIN
SYMBOL
PIN
SYMBOL
1
VSS
28
DQ14
55
A17
2
VCC
29
DQ13
56
A18
w High-reliability, low-power design
3
NC
30
DQ12
57
A19
w Single + 5V ± 0.5V power supply
4
A3
31
DQ11
58
A20
w Easy memory expansion
5
A2
32
DQ10
59
/CE1
6
A1
33
DQ9
60
/WE1
/OE1
w Access time : 75, 90 and 120ns
w High-density 8MByte design
w All inputs and outputs are TTL-compatible
7
A0
34
DQ8
61
w FR4-PCB design
8
DQ0
35
/CE0
62
VSS
w Low profile 72-pin SIMM
9
DQ1
36
VCC
63
DQ24
w Minimum 1,000,000 write/erase cycle
10
DQ2
37
PD5
64
DQ25
11
DQ3
38
A11
65
DQ26
12
VSS
39
A12
66
DQ27
13
DQ4
40
A13
67
DQ28
w Temporary sector group unprotection
14
DQ5
41
A14
68
DQ29
w The used device is Am29F016B
15
DQ6
42
A15
69
DQ30
16
DQ7
43
VSS
70
DQ31
17
/OE0
44
DQ16
71
NC
18
/WE0
45
DQ17
72
VCC
19
A4
46
DQ18
73
NC
20
A5
47
DQ19
74
NC
21
A6
48
DQ20
75
PD1
22
A7
49
DQ21
76
PD2
23
A8
50
DQ22
77
PD3
24
A9
51
DQ23
78
VSS
25
VSS
52
NC
79
PD4
26
A10
53
A16
80
VSS
27
DQ15
54
VSS
w Sectors erase architecture
w Sector group protection
OPTIONS
MARKING
w Timing
90ns access
-90
w Packages
80-pin SIMM
M
80-PIN SIMM
TOP VIEW
URL : www.hbe.co.kr
REV_02(August,2002)
1
HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
FUNCTIONAL BLOCK DIAGRAM
32
DQ0 - DQ31
21
A0 – A20
A0-20
DQ 0-7
/WE
/WE0
U1
/OE
/CE
RY-BY
/Reset
A0-20
DQ 8-15
/WE0
/WE
/OE0
/OE
U2
/CE
RY-BY
/RY-BY0
/Reset
A0-20
DQ16-23
/WE1
/WE
U3
/OE
/CE
RY-BY
/Reset
A0-20
DQ24-31
/WE1
URL : www.hbe.co.kr
REV_02(August,2002)
/WE
/OE1
/OE
/CE0
/CE
RY-/BY1
RY-BY
/Reset
/Reset
2
U4
HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
TRUTH TABLE
MODE
/OE
/CE
/WE
DQ
POWER
STANDBY
X
H
X
HIGH-Z
STANDBY
NOT SELECTED
H
L
H
HIGH-Z
ACTIVE
READ
L
L
H
Q
ACTIVE
WRITE or ERASE
X
L
L
D
ACTIVE
NOTE: X means don’t care
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
VIN,OUT
-2.0V to +7.0V
Voltage with respect to ground Vcc
VCC
-2.0V to +7.0V
Storage Temperature
TSTG
-65oC to +125oC
TA
-55oC to +125 oC
Voltage with respect to ground all other pins
Operating Temperature
Power Dissipation
PD
4W
w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated
in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER
SYMBOL
MIN
Vcc for ± 10% device Supply Voltages
Vcc
4.5V
Ground
VSS
0
TYP.
MAX
5.5V
0
0
DC AND OPERATING CHARACTERISTICS (0oC ≤ TA ≤ 70 oC ; Vcc = 5V ± 0.5V )
PARAMETER
TEST CONDITIONS
SYMBOL
MIN
MAX
UNITS
Input Leakage Current
Vcc=Vcc max, VIN= GND to Vcc
IL1
±1.0
µA
Output Leakage Current
Vcc=Vcc max, VOUT= GND to Vcc
IL0
±1.0
µA
Output High Voltage
IOH = -2.5mA, Vcc = Vcc min
VOH
Output Low Voltage
IOL = 12mA, Vcc =Vcc min
VOL
0.45
V
Vcc Active Current for Read(1)
/CE = VIL, /OE=VIH,
ICC1
40
mA
/CE = VIL, /OE=VIH
ICC2
60
mA
/CE= VIH
ICC3
1.0
mA
4.2
V
2.4
V
Vcc Active Current for Program
or Erase(2)
Vcc Standby Current
Low Vcc Lock-Out Voltage
VLKO
3.2
Notes:
1. The Icc current listed is typically less than 2mA/MHz, with /OE at V IH.
2. Icc active while embedded algorithm (program or erase) is in progress
3. Maximum Icc current specifications are tested with Vcc=Vcc max
URL : www.hbe.co.kr
REV_02(August,2002)
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HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
ERASE AND PROGRAMMING PERFORMANCE
LIMITS
PARAMETER
UNIT
MIN.
TYP.
COMMENTS
MAX.
Excludes 00H programming
Sector Erase Time
-
1
8
sec
prior to erasure
Byte Programming Time
-
7
300
Excludes system-level
µs
overhead
Excludes system-level
Chip Programming Time
-
14.4
43.2
sec
overhead
TSOP CAPACITANCE
PARAMETER
PARAMETER
SYMBOL
DESCRIPTION
CIN
TEST SETUP
MIN
MAX
UNIT
VIN = 0
6
7.5
pF
VOUT = 0
8.5
12
pF
VIN = 0
7.5
9
pF
Input Capacitance
COUT
Output Capacitance
CIN2
Control Pin Capacitance
o
Notes : Test conditions TA = 25 C, f=1.0 MHz.
AC CHARACTERISTICS
u Read Only Operations Characteristics
PARAMETER
SYMBOLS
JEDEC
STANDARD
tAVAV
tRC
tAVQV
tACC
DESCRIPTION
TEST SETUP
Read Cycle Time
-75
-90
UNIT
Min
70
90
ns
Max
70
90
ns
Max
70
90
ns
/CE = V IL
Address to Output Delay
/OE = VIL
tELQV
tCE
Chip Enable to Output Delay
/OE = VIL
tGLQV
tOE
Chip Enable to Output Delay
Max
40
40
ns
tEHQZ
tDF
Chip Enable to Output High-Z
Max
20
20
ns
tGHQZ
tDF
Output Enable to Output High-Z
Max
20
20
ns
tAXQX
tQH
Min
0
0
ns
Output Hold Time From Addresses,
/CE or /OE, Whichever Occurs First
URL : www.hbe.co.kr
REV_02(August,2002)
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HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
TEST SPECIFICATIONS
TEST CONDITION
ALL SPEED OPTIONS
Output load
UNIT
1TTL gate
Output load capacitance,
100
pF
20
ns
0.45-2.4
V
Input timing measurement reference levels
0.8
V
Output timing measurement reference levels
2.0
V
CL (Including jig capacitance)
Input rise and full times
Input pulse levels
5.0V
2.7kΩ
IN3064
or Equivalent
Device
Under
Test
CL
6.2kΩ
Diodes = IN3064
or Equivalent
Note : CL = 100pF including jig capacitance
Erase/Program Operations
PARAMETER
SYMBOLS
DESCRIPTION
-75
-90
UNIT
JEDEC
STANDARD
tAVAV
tWC
Write Cycle Time
Min
70
90
ns
tAVWL
tAS
Address Setup Time
Min
0
0
ns
tWLAX
tAH
Address Hold Time
Min
40
45
ns
tDVWH
tDS
Data Setup Time
Min
40
45
ns
tWHDX
tDH
Data Hold Time
Min
0
0
ns
tOES
Output Enable Setup Time
Min
0
0
ns
tGHWL
tGHWL
Read Recover Time Before Write
Min
0
0
ns
tELWL
tCS
/CE Setup Time
Min
0
0
ns
tWHEH
tCH
/CE Hold Time
Min
0
0
ns
tWLWH
tWP
Write Pulse Width
Min
40
45
ns
tWHWL
tWPH
Write Pulse Width High
Min
20
20
ns
tWHWH1
tWHWH1
Byte Programming Operation
Typ
7
7
µs
URL : www.hbe.co.kr
REV_02(August,2002)
5
HANBit Electronics Co. Ltd
HANBit
tWHWH2
HF08-CS2501
tWHWH2
tVCS
Sector Erase Operation (Note1)
Typ
1
1
sec
Vcc set up time
Min
50
50
µs
-75
-90
UNIT
Notes :
1. This does not include the preprogramming time
2. This timing is only for Sector Pro tect operations
u Erase/Program Operations
Alternate /CE Controlled Writes
PARAMETER SYMBOLS
DESCRIPTION
JEDEC
STANDARD
tAVAV
tWC
Write Cycle Time
Min
70
90
ns
tAVWL
tAS
Address Setup Time
Min
0
0
ns
tWLAX
tAH
Address Hold Time
Min
40
45
ns
tDVWH
tDS
Data Setup Time
Min
40
45
ns
tWHDX
tDH
Data Hold Time
Min
0
0
ns
tOES
Output Enable Setup Time
Min
0
0
ns
tGHWL
tGHWL
Read Recover Time Before Write
Min
0
0
ns
tELWL
tCS
/CE Setup Time
Min
0
0
ns
tWHEH
tCH
/CE Hold Time
Min
0
0
ns
tWLWH
tWP
Write Pulse Width
Min
40
45
ns
tWHWL
tWPH
Write Pulse Width High
Min
20
20
ns
tWHWH1
tWHWH1
Byte Programming Operation
Typ
7
7
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note1)
Typ
1
1
sec
Notes :
1. This does not include the preprogramming time
2. This timing is only for Sector Protect operations
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REV_02(August,2002)
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HANBit
HF08-CS2501
u READ OPERATIONS TIMING
u RESET TIMING
URL : www.hbe.co.kr
REV_02(August,2002)
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HANBit
HF08-CS2501
u PROGRAM OPERATIONS TIMING
u CHIP/SECTOR ERASE OPERATION TIMINGS
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REV_02(August,2002)
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HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
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REV_02(August,2002)
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HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
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REV_02(August,2002)
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HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
PACKAGE DIMENSIONS
<FRONT SIDE>
<REAR SIDE>
2.54 mm
MIN
0.25 mm MAX
1.27
Gold: 1.04±0.10 mm
Solder: 0.914±0.10 mm
1.27(±0.08)
(Solder & Gold Plating)
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REV_02(August,2002)
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HANBit Electronics Co. Ltd
HANBit
HF08-CS2501
ORDERING INFORMATION
Part Number
Density
Org.
Package
HF08-CS2501
8MByte
2M×32bit
80Pin-SIMM
URL : www.hbe.co.kr
REV_02(August,2002)
12
Component
Number
4EA
Vcc
SPEED
5.0V
90ns
HANBit Electronics Co. Ltd