SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Features Extra thin 0.4mm, Top view, Wide view angle, Bluish White color SMD chip LED . Special for Cellular Phone keypad / LCD backlighting or thin touch button LED backlighting. Packing in 8mm tape on 7" diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Reflow soldering and Wave soldering processes. EIA STD package.(ANSI/EIA-481-B-2001) I.C. compatible, low current application Pb free product and acceptable lead-free process!. PACKAGE OUTLINE DIMENSIONS + - Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm (.004") unless otherwise noted. DRAWING NO. : DS-75-04-0012 DATE : 2004-08-18 PAGE 1 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT CHIP MATERIALS Dice Material : InGaN Light Color : Bluish White Lens Color : Light Yellow Diffused. Absolute Maximum Ratings(Ta=25℃) Symbol Parameter Rating Unit PD Power Dissipation 76 mW IPF Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 80 mA IF Continuous Forward Current 20 mA - De-rating Linear From 25℃ 0.25 mA/℃ 5 V 150 V -20 + 85 ℃ -40 ~ + 85 ℃ VR Reverse Voltage ESD Electrostatic Discharge Threshold(HBM) Topr Operating Temperature Range Tstg Storage Temperature Range Note A - Wave Soldering Condition (Two times Max.) 260 (for 5 seconds) ℃ - Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds) ℃ Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. Electro-Optical Characteristics(Ta=25℃) Parameter Luminous Intensity Viewing Angle Unit Test Condition 60 mcd IF=5mA 130 Deg Note 2 Symbol Min. Typ. IV 25 2θ1/2 Max. CIE Chromaticity X 0.19 0.22 CIE Chromaticity Y 0.14 0.18 Forward Voltage VF Reverse Current IR DRAWING NO. : DS-75-04-0012 2.8 IF=5mA 3.15 V IF = 5mA 50 μA VR = 5V DATE : 2004-08-18 PAGE2 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. 5. Tolerance of CIE Value: ±1%. Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength DRAWING NO. : DS-75-04-0012 DATE : 2004-08-18 PAGE 3 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Typical Electro-Optical Characteristics Curves Luminous lntensity(mcd) (25℃ Ambient Temperature Unless Otherwise Noted) Fig.2 Forward Current vs.Forward Voltage Fig.3 Luminous Intensity vs.Forward Current Relative luminous intensity(%) Relative Luminous lntensity Normalized of 20mA 1000 100 10 1 -60 -40 -20 -0 20 40 60 80 100 Ambient Temperature Ta(℃) Fig.5 Luminous Intensity vs.Ambient Temperature Fig.4 Relative Luminous Intensity vs.Forward Current 0° Forward Current IF(mA) 50 10° 10° 20° 30° 30° 40 40° 30 40° 1.0 0.9 50° 0.9 0.8 60° 70° 80° 90° 0.8 1.0 20 10 0 0° 20° 0.7 0 20 40 60 80 100 0.5 0.3 0.1 0.2 0.4 0.6 50° 60° 70° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta(℃) Fig.6 Forward Current Derating Curve DRAWING NO. : DS-75-04-0012 Fig.7 Relative Intensity vs.Angle Fig.7 Relative Intensity vs.Angle DATE : 2004-08-18 PAGE 4 80° 90° SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Reel Dimensions Notes: 1. Taping Quantity : 3000pcs, (Minimum packing quantity will be 500 pcs for remainders) 2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm. DRAWING NO. : DS-75-04-0012 DATE : 2004-08-18 PAGE 5 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Package Dimensions Of Tape And Reel Progressive direction Cathode Polarity Notes:All dimensions are in millimeters. T LIGH Moisture Resistant Packaging Label Reel Label Desiccant Aluminum moistue-proof bag 240 145 210 255 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. DRAWING NO. : DS-74-03-0007 DATE : 2004-06-07 PAGE 6 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Cleaning If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Suggest Soldering Pad Dimensions Direction of PWB camber and go to reflow furnace Notes : Suggest stencil print screen thickness are 0.10mm maximum. Suggest IR Reflow Soldering Profile Condition: Temperature(℃) 240° C(MAX) Rising +5℃/sec (MAX) C Cooling -5℃/sec (MAX) C +5℃/sec (MAX) Time DRAWING NO. : DS-75-04-0012 DATE : 2004-08-18 PAGE 7 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Bin Code List Luminous Intensity(IV), Unit:mcd@5mA Bin Code Min Max N 28.0 45.0 P 45.0 71.0 Tolerance of each bin are±15% Forward Voltage(VF), Unit:V@5mA Bin Code Min Max 12 2.70 2.80 13 2.80 2.90 14 2.90 3.00 Tolerance of each bin are±0.1Volt CAUTIONS 1.Application Limitation : The LED’s described here are intended to be used for ordinary electronic equipment(such as office equipment, communication equipment and household application).Consult HB’s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage : Before opening the package : The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year. After opening the package : The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours(7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3.Soldering Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. Wave soldering : Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. performed consecutively cooling process is required between 1st and 2nd soldering processes. DRAWING NO. : DS-75-04-0012 DATE : 2004-08-18 PAGE 8 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT 4. Lead-Free Soldering For Reflow Soldering : 1、Pre-Heat Temp: 150-180℃,120sec.Max. 2、Soldering Temp: Temperature Of Soldering Pot Over 230℃,40sec.Max. 3、Peak Temperature: 260℃，5sec. 4、Reflow Repetition: 2 Times Max. 5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1、Iron Tip Temp: 350℃ Max. 2、Soldering Iron: 30w Max. 3、Soldering Time: 3 Sec. Max. One Time. For Dip Soldering : 1、Pre-Heat Temp: 150℃ Max. 120 Sec. Max. 2、Bath Temp: 265℃ Max. 3、Dip Time: 5 Sec. Max. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. DRAWING NO. : DS-75-04-0012 DATE : 2004-08-18 PAGE 9 SURFACE MOUNT DEVICE LED Part No. : 0603LWCT 6.Reliability Test Classification Test Item Operation Life High Temperature Endurance Test High Humidity Storage High Temperature Storage Low Temperature Storage Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90～95% *Test Time= 1000HRS±2HRS MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) Ta= 105±5℃ Test Time= 1000HRS (-24HRS,72HRS) Ta= -55±5℃ *Test Time=1000HRS (-24HRS,72H RS) JIS C 7021:B-12 (1982) MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) Temperature Cycling 105±5℃ 10mins Thermal Shock IR-Reflow In-Board, 2 Times 105±5℃ -55℃±5℃ 10mins 10mins 100 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Tsol= 260 ± 5℃ Dwell Time= 10 ± 1sec MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) Tsol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982) Environmental Test Solder Resistance Solder ability -55±5℃ 10mins MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) 100 Cycles 7.Others: The appearance and specifications of the product may be modified for improvement without notice. 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