HB L-C150KGCT

SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
PACKAGE OUTLINE DIMENSIONS
1.20
1.10
R0.10
0.55
2.10
0.55
5.00°
1.10
0.48 ~ 0.50
0.50
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ± 0.1mm (.004") unless otherwise noted.
Features
Top view, wide view angle, single color Chip LED.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Infrared and Wave soldering reflow solder processes.
EIA STD package.
I.C. compatible.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 1
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Chip Materials
Dice Material : AlInGaP
Light Color : Super Green
Lens Color : Water Clear
Absolute Maximum Ratings(Ta=25℃)
Symbol
Parameter
Rating
Unit
PD
Power Dissipation
60
mW
IPF
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
60
mA
IF
Continuous Forward Current
30
mA
-
De-rating Linear From 25℃
0.25
mA/℃
5
V
2000
V
VR
Reverse Voltage
Note A
ESD
Electrostatic Discharge Threshold(HBM)
Topr
Operating Temperature Range
-40 ~ +85
℃
Tstg
Storage Temperature Range
-40 ~ +85
℃
-
Wave Soldering Condition (Two times Max.)
260 (for 5 seconds)
℃
-
Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds)
℃
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
Electro-Optical Characteristics(Ta=25℃)
Parameter
Luminous Intensity
Symbol
Min.
Typ.
Max.
Unit
Test Condition
IV
16.0
30.0
60.0
mcd
IF=20mA
Viewing Angle
2θ1/2
130
deg
Note 2
Peak Emission
Wavelength
λp
571
nm
Measurement @Peak
Dominant Wavelength
λd
570
nm
IF=20mA
Spectral Line
Half-Width
Δλ
15
nm
Forward Voltage
VF
2.05
Reverse Current
IR
DRAWING NO. : DS-71-03-0005
2.4
V
IF =20mA
100
μA
VR = 5V
DATE : 2004-06-07
PAGE 2
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommend use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 3
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Typical Electro-Optical Characteristics Curves
Luminous lntensity(mcd)
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
Relative luminous intensity(%)
Relative Luminous lntensity
Normalized of 20mA
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.4 Relative Luminous Intensity vs.Forward Current
Fig.5 Luminous Intensity vs.Ambient Temperature
0°
Forward Current IF(mA)
50
10°
20°
30°
40
30
20
10
0
1.0
40°
0.9
50°
0.8
60°
70°
80°
90°
0.7
0
20
40
60
80
100
0.5 0.3
0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.6 Forward Current Derating Curve
DRAWING NO. : DS-71-03-0005
Fig.7 Relative Intensity vs.Angle
DATE : 2004-06-07
PAGE 4
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Label Explanation
BATCH: L1 B9 AC
L1: Luminous Intensity Code
B9: Forward Voltage Code
AC: Dom Wavelength Code
Reel Dimensions
Notes:
1. Taping Quantity : 3000PCS
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 5
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Package Dimensions Of Tape And Reel
Progressive direction
Polarity
Notes:All dimensions are in millimeters.
T
LIGH
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
240
145
210
255
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 6
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Cleaning
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
Suggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
Suggest IR Reflow Soldering Profile Condition:
Temperature(℃)
240° C(MAX)
Rising
+5℃/sec
(MAX)
C
Cooling
-5℃/sec
(MAX)
C
+5℃/sec
(MAX)
Time
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 7
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Bin Code List
Luminous Intensity(IV), Unit:[email protected]
Bin Code
Min
Max
M
16.0
32.0
N
25.0
P
40.0
Forward Voltage(VF), Unit:[email protected]
Bin Code
Min
Max
4
1.85
2.05
50.0
5
1.95
2.15
80.0
6
2.05
2.25
7
2.15
2.35
Including test tolerance
Including test tolerance
Dominant Wavelength (Hue),Unit: [email protected]
Bin Code
Min
Max
GA
566.0
571.0
GB
569.0
574.0
Including±1nm test tolerance
CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application).Consult HB’s sales in advance for information on
application in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life
support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168
hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use
SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 8
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp:150-180℃,120sec.Max.
2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature:260℃,5sec.
4、Reflow Repetition:2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp:350℃ Max.
2、Soldering Iron:30w Max.
3、Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1、Pre-Heat Temp:150℃ Max. 120 Sec. Max.
2、Bath Temp:265℃ Max.
3、Dip Time:5 Sec. Max.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE 9
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
REV:A / 03
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
*Test Time= 1000HRS
(-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90~95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,72H RS)
JIS C 7021:B-12 (1982)
Temperature
Cycling
105±5℃
10mins
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Thermal
Shock
IR-Reflow In-Board, 2 Times
105±5℃
-55℃±5℃
10mins
10mins
100 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)
Operation Life
High Temperature
Endurance Test High Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Environmental
Test
Solder
Resistance
Solder ability
-55±5℃
10mins
100 Cycles
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
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