ETC AMC7580-X.XP

AMC DOC. #: AMC7580_E (LF)
Feb 2005
AMC7580
®
ADD MICROTECH CORP.
DESCRIPTION
7A LOW DROPOUT REGULATOR
FEATURES
The AMC7580 is a high performance low dropout regulator
rated for 7A output current with fixed 2.5V/3.3V/5.0V and
adjustable output. It is designed for use in applications requiring
low dropout characteristics over the rated current range.
When the second low-current input voltage is applied, the drop
out voltage can be as low as 100mV at light loads and up to
500mV at maximum output current. On chip trimming adjusts
the reference voltage to 1%. These features are ideal for low
voltage microprocessor applications requiring a regulated 2.5V
to 3.6V power supply.
In addition, the AMC7580 provides the device protections
including over current and thermal shutdown. The AMC7580
series are ideal to the next generation microprocessor on
motherboards where both 5V and 3.3V are available.
APPLICATIONS
Input-Output differential of
typical 500mV at 7A and low
quiescent current
Output current is excess of 7A
Remote sense pin available
Reverse battery protection
Short circuit protection
Internal thermal overload protection
Available in 5L plastic TO-220 and
surface mount 5L TO-263 packages
Pin assignment identical to EZ1585
series.
PACKAGE PIN OUT
VPOWER
VCONTROL
VOUT
Gnd/Adj
SENSE
Pentium® Processor Supplies
PowerPCTM Supplies
Computer Add-On Cards
Other Applications Requiring Low
Dropout Voltage Over Rated Current.
5-Pin Plastic TO-220
(Top View)
AMC7580-2.5 – 2.5V Fixed
AMC7580-3.3 – 3.3V Fixed
AMC7580-5.0 – 5.0V Fixed
AMC7580-ADJ – Adjustable
VPOWER
VCONTROL
VOUT
Gnd/Adj
SENSE
5-Pin Plastic TO-263
Surface Mount
(Top View)
ORDER INFORMATION
Plastic TO-263
Plastic TO-220
DD
5-pin
5-pin
0 to 70
AMC7580-X.XP
AMC7580-X.XDD
0 to 70
AMC7580-X.XPF (Lead Free)
AMC7580-X.XDDF (Lead Free)
0 to 70
AMC7580-ADJP
AMC7580-ADJDD
0 to 70
AMC7580-ADJPF (Lead Free)
AMC7580-ADJDDF (Lead Free)
Note: 1.All surface-mount packages are available in Tape & Reel. Append the letter “T” to part number (i.e.,
AMC7580-X.XDDT).
2.The letter “F” is marked for Lead Free process.
TA (OC)
P
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
TYPICAL APPLICATION
1
Power In
Control In
5
SENSE
VPOWER
4
VCONTROL
VOUT
3
X.XV Output
Gnd
C1
33µF
C2
10µF
2
C3
68µF
Ground
AMC7580-X.X application schematic
SENSE
VPOWER
VOUT
VCONTROL
ADJ
Power In
Control In
C1
33µF
Output
R1
1%
C2
10µF
C3
68µF
R2
1%
Ground
VOUT = VREF (1+(R2/R1)) + IADJR2
AMC7580-ADJ application schematic
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Voltage (Vpower)
Input Voltage (Vcontrol)
Operating Junction temperature
Storage Temperature Range
Lead temperature (Soldering, 10 seconds)
Note 1:
7V
13V
150 OC
-65 OC to 150 OC
300 OC
Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.
Currents are positive into, negative out of the specified terminal.
Package
θJA
( C/W )
O
POWER DISSIPATION TABLE
Derating factor ( mW/OC )
TA ≤ 25 OC
TA=70 OC
O
TA ≥ 25 C
Power rating(mW) Power rating(mW)
TA= 85 OC
Power rating (mW)
P
45
22.2
2775
1776
1443
PF
DD
45
45
22.2
22.2
2775
2775
1776
1776
1443
1443
DDF
45
22.2
2775
1776
Note :
1. θJA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption.
Junction Temperature Calculation: TJ = TA + (PD × θJA), Po = DF × ( Tj- TA)
The θJA numbers are guidelines for the thermal performance of the device/PC-board system.
All of the above assume no ambient airflow.
2.
1443
θJT: Thermal Resistance-Junction to Tab, TC: case(Tab) temperature, TJ = TC + (PD × θJT)
For P and DD packages, θJT = 3.0 OC / W.
3. If power consumption is over above rating, adequate heat sink is required to dissipate heat.
Input Voltage (VIN)
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol Recommended Operating Conditions Units
Min.
Typ.
Max.
VPOWER
2
7
V
2.75
12
VCONTROL
Load Current (with adequate heatsinking)
IO
0.010
7
A
Input Capacitor (VIN to GND)
10
µF
Output Capacitor with ESR of 10Ω max., (VOUT to GND)
33
µF
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
BLOCK DIAGRAM
VPOWER
VOUT
VCONTROL
SENSE
THERMAL
LIMIT
Gnd
1.25V
VREF
AMC7580-X.X circuit schematic
VCONTROL
VPOWER
1.25V
VREF
THERMAL
LIMIT
VOUT
SENSE
ADJ
AMC7580-ADJ circuit schematic
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, these specifications apply TJ = 25°C for AMC7580; IO = 10mA, VOUT = VSENSE, and are
for DC characteristics only. (Low duty cycle pulse testing techniques are used which maintains junction and case
temperatures equal to the ambient temperature.)
Parameter
Symbol
AMC7580-2.5
Min.
AMC7580
Typ. Max.
Units
VCONTROL = 5.0V, VPOWER = 3.3V
2.474
2.500
2.525
VCONTROL = 5.8V, VPOWER = 3.8V
3.267
3.300
3.333
AMC7580-5.0
VCONTROL = 7.5V, VPOWER = 5.5V
4.950
5.000
5.050
AMC7580-2.5
VCONTROL = 5.0V,
VPOWER = 3.3V
2.460
2.500
2.540
3.247
3.300
3.353
4.920
5.000
5.080
1.238
1.250
1.262
1.230
1.250
1.270
0.04
0.2
%
0.08
0.3
%
1.00
1.15
1.15
0.10
0.45
1.30
0.17
0.50
50
120
µA
80
135
mA
10
A
mA
Output Voltage AMC7580-3.3
Output Voltage AMC7580-3.3
VOUT
VOUT
AMC7580-5.0
Reference
Voltage
Test Conditions
AMC7580-ADJ
VREF
Line Regulation (Note 2)
VOI
Load regulation (Note 2)
VOL
Dropout Voltage
VCONTROL - VOUT (Note 3)
V
Dropout Voltage
VPOWER- VOUT (Note 3)
V
Adjust Pin Current
IADJ
Control Pin Current
ICTNL
Current Limit
Minimum Load Current (Note 4)
ICL
Imin
Ripple Rejection (Note 5)
Thermal Regulation
RR
VCONTROL = 5.0V,
VPOWER = 4.1V
IO = 7A
VCONTROL = 6.5V,
VPOWER = 5.8V
VCONTROL = 5.0V, VPOWER = 3.3V,
(Note 1)
VCONTROL = (VOUT + 1.5V) to 12V,
VPOWER = (VOUT + 0.8V) to 7V,
IO = 10mA to 7A
(1.5V + VOUT) ≤ VCONTROL ≤ 12V,
0.8V ≤ (VPOWER - VOUT ) ≤ 5.5V
VCONTROL = VOUT + 2.5V,
VPOWER = VOUT + 0.8V,
IO = 10mA to 7A
IO = 10mA
VPOWER = VOUT + 0.8V
IO = 7A
IO = 10mA
VCONTROL = VOUT +
2.5V
IO = 7A
VCONTROL = 2.75V,
VPOWER = 2.05V, IO = 10mA
VCONTROL = VOUT + 2.5V,
VPOWER = VOUT + 0.8V,
IO = 10mA to 7A
(VIN - VOUT)=1.5V
VCONTROL = 5.0V, VPOWER = 3.3V
VCONTROL = VPOWER = VOUT + 2.5V,
VRIPPLE = 1VPP, IO = 2.5A
TA = 25°C
V
V
V
7
60
8
5
V
V
80
dB
0.003
%/W
Note 1 Output voltage is set to be 2.5V.
Note 2: Line and load regulations are guaranteed up to maximum power dissipation determined by input/output
differential and the output current. However, the maximum power will not be available over the full
input/output voltage range.
Note 3: The dropout voltage is measured by either minimum control voltage or power voltage. The specifications
represent the minimum input/output voltage required to maintain 1% regulation.
Note 4: The minimum load current is the minimum current required to maintain regulation. Normally the current in
the resistor divider used to set the output voltage is selected to meet the minimum load current requirement.
Note 5: These parameters, although guaranteed, are not tested in production prior to shipment
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
APPLICATION INFORMATION
General
The AMC7580 series is designed to power the new generation of microprocessors. It is designed to make use of
multiple power supplies, present in most systems, to reduce the dropout voltage. One of the advantages of the twosupply approach is maximizing the efficiency.
The second supply is at least 1V greater than output voltage and is providing the power for the control circuitry and
supplies the drive current to the NPN output transistor. This allows the NPN output transistor to be driven into
saturation. For the control voltage the current requirement is small, about 1% of the output current or approximately
50 mA for a 7A load. This drive current becomes part of the output current. The maximum voltage on the Control
pin is 13 V. The maximum voltage at the Power pin is 7 V. By trying the control and power inputs together the
AMC7580 can also be operated as a single supply device. In single supply operation, the dropout voltage will be
determined by the minimum the Control voltage.
The new generation of microprocessors cycle load current from several hundred milliamperes to several amperes in
tens of nanoseconds. Output voltage tolerances are tighter and include transient response as part of the specification.
Designed to meet the fast current load step requirements of these microprocessors, the AMC7580-X.X also saves
total cost by needing less output capacitance to maintain regulation.
The sense pin permits very accurate regulation of output voltage. As a result, over an output current range of 100mA
to 7A, the typical load regulation is less than 1mV.
In addition to the enhancements mentioned, the reference accuracy has been improved a factor of two with a
guaranteed initial tolerance of ±1% at 25°C and 1.6% accuracy over the full temperature and load current range.
Typical applications for the AMC7580 include 3.3V to 2.5 V conversion with a 5V control supply, 5V to 4.2V
conversion with a 12V control supply or 5V to 3.6V conversion with a 12V control supply. It is easy to obtain
dropout voltages of less than 0.5V at 2.5A along with excellent static and dynamic specifications. The device is fully
protected against over current and over temperature conditions.
Grounding and Output Sensing
The AMC7580-ADJ allows true Kelvin sensing for both the high and low side of the load. As a result the voltage
regulation at the load can be easily optimized. Voltage drops due to parasitic resistances between the regulator and
the load can be placed inside the regulation loop. The advantages of remote sensing are illustrated in figures 1
through 3.
Figure 1 shows the device connected as a conventional 3 terminal regulator with the Sense lead connected directly to
the output of the device. Rp is the parasitic resistance of the connections between the device and the load. Trace A of
figure 3 illustrates the effect of Rp.
Figure 2 shows the device connected to take advantage of the remote sense feature. The Sense pin and the top of the
resistor divider are connected to the top of the load; the bottom of the resistor divider is connected to the bottom of
the load. The effect on output regulation can be seen in trace B of figure 3.
It is important to note that the voltage drops due to Rp are not eliminated; they will add to the dropout voltage of the
regulator regardless. TheAMC7580-ADJ can control the voltage at the load as long as the input-output voltage is
greater than the total of the dropout voltage of the device plus the voltage drop across Rp.
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
Control
Sense
Control
Power
Sense
Power
VOUT
VOUT
RP
ADJ
ADJ
RP
R1
R1
R2
LOAD
LOAD
RP
R2
RP
Figure 1. Conventional Load Sensing
Figure 2. Remote Load Sensing
(∆IOUT)(RP)
VOUT
Figure 1
A
VOUT
Figure 2
B
IOUT
TIME
Figure 3. Remote Sensing Improves Load Regulation
Stability
The Circuit design used in the AMC7580 series requires the use of an output capacitor as part of the device
frequency compensation. The addition of 150µF Aluminum electrolytic or a 22µF solid tantalum on the output will
ensure stability for all operating conditions. In order to meet the transient performance of the processor larger value
capacitors are needed. To limit the high frequency noise generated by the processor, high quality bypass capacitors
must be used. In order to limit parasitic inductance (ESL) and resistance (ESR) in capacitors to acceptable limits,
multiple small ceramic capacitor in addition to high quality solid tantalum capacitors are required.
When the adjustment terminal is bypassed to improve the ripple rejection, the requirement for an output capacitor
increases. To further improve stability and transient response of these devices larger values of output capacitor can
be used. The modern processors generate large high frequency current transients.
The load current step contains higher order frequency components than the output coupling network must handle
until the regulator throttles to the load current level. Because they contain parasitic resistance and inductance,
capacitors are not ideal elements. These parasitic elements dominate the change in output voltage at the beginning
of a transient load step change. The ESR of the output capacitors produces and instantaneous step in output voltage
at the beginning of a transient load step change. The ESR of the output capacitors produces an instantaneous step in
out voltage ∆V = ∆I(ESR). The ESL of the output capacitors produces a droop proportional to the rate of change of
the output current ∆V = L(∆I/∆t). The output capacitance produces a change in output voltage proportional to the
time until the regulator can respond ∆V = ∆t(∆I/C). Figure 4 illustrates these transient effects.
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
ESR
Effects
ESL
Effects
Capacitance
Effects
Slope, V/t = ∆I/C
Point at which regulator
takes control
Figure 4.
Output Voltage
The AMC7580-ADJ develops a 1.25V reference voltage between the Sense pin and the Adjust pin (Figure 5).
Placing a resistor between these two terminals causes a constant current to flow thought R1 and down though R2 to
set the output voltage. In general R1 is chosen so that this current is the specified minimum load current of 10 mA.
The current out of the Adjust pin is small, typically 50µA and it adds to the current for R1. For best regulation the
top of the resistor divider should be connected directly to the Sense pin.
VCONTROL
VOUT
VPOWER
AMC7580
-ADJ
ADJ
VCONTROL
SENSE
VREF
VPOWER
R1
AMC7580
-ADJ
ADJ
D1
D2
SENSE
R1
IADJ = 50µA
R2
R2
Figure 5 Setting Output Voltage
Copyright © 2002, ADD Microtech Corp.
Figure 6. Optional Clamp Diodes Protect
Against Input Crowbar Circuit
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
Protection Diodes
In normal operation, AMC7580 family does not need any protection diodes between the adjustment pin and the
output and from the output to the input to prevent die overstress. Internal resistors are limiting the internal current
paths on the ADJ pin. Therefore even with bypass capacitors on the adjust pin no protection diode is needed to
ensure device safety under short-circuit conditions. The Adjust pin can be driver on a transient basis ±7V with
respect to the output without any device degradation.
A protection diode between the Output pin and VPOWER pin is not usually needed. Microsecond surge currents of 50A
to 100A can be handled by the internal diode between the Output pin and VPOWER pin of the device. In normal
operations it is difficult to get those values of surge currents even with the use of large output capacitances. Only
with high value output capacitors, such as 1000µF to 5000µF and the VPOWER pin is instantaneously shorted to
ground, damage an occur. A diode from output to input is recommended (Figure 6). If AMC7851 is connected as
single supply device with the control and power input pins shorted together the internal diode between the output and
power input pin will protect the control input pin.
Thermal Consideration
The AMC7580-ADJ series has internal power and thermal limiting circuitry designed to protect the device under
overload conditions. However maximum junction temperature ratings should not be exceeded under continuous
normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to
ambient, including junction-to-case, case-to-heat sink interface and heat sink resistance itself.
Junction temperature of the Control section can run up to 125 OC. Junction temperature of the Power section can run
up to 150 OC. Due to the thermal gradients between the power transistor and the control circuitry there is a significant
difference in thermal resistance between the Control and Power sections.
Virtually all the power dissipated by the device is dissipated in the power transistor. The temperature rise in the
power transistor will be greater than the temperature rise in the Control section making the thermal resistance lower
in the Control section. At power levels below 12W, the temperature gradient will be less than 25 OC and the
maximum ambient temperature will be determined by the junction temperature of the Control section. This is due to
the lower maximum junction temperature in the Control section. At power levels above 12W, the temperature
gradient will be greater than 25 OC and the maximum ambient temperature will be determined by the Power section.
In both cases the junction temperature is determined by the total power dissipated in the device. For most low
dropout applications the power dissipation will be less than 12W.
The power in the device is made up of two components: the power in the output transistor and the power in the
control circuit.
The power in the control circuit is negligible, which is equal to: PCONTROL = (VCONTROL – VOUT) / ICONTROL,
where ICONTROL is equal IOUT / 100(typ)
The power in the output transistor is equal to: POUTPUT = (VPOWER –VOUT) / IOUT
The total power is equal to: PCONTROL + POUTPUT
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die.
This is the lowest resistance path for the heat flow. In order to ensure the best possible thermal flow this area of the
package to the heat sink proper mounting is required. Thermal compound at the case-to-heat sink interface is
recommended. A thermally conductive spacer can be used, if the case of the device must be electrically isolated, but
its added contribution to thermal resistance has to be considered.
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
Maximum Power Calculation:
TJ(MAX) – TA(MAX)
θJA
TJ(OC): Maximum recommended junction temperature
TA(OC): Ambient temperature of the application
θJA(OC/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating
materials.
The maximum power dissipation of a single-output regulator :
PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ
PD(MAX)=
Where: VOUT(NOM) = the nominal output voltage
IOUT(NOM) = the nominal output current, and
IQ = the quiescent current the regulator consumes at IOUT(MAX)
VIN(MAX) = the maximum input voltage
Then θJA = (150 OC – TA) / PD
Thermal consideration:
When power consumption is over about 1.2W( at 70oC ambient temperature), additional heat sink is required to control the
junction temperature below 125OC.
The junction temperature is: Tj = P D (θJT + θCS + θSA ) + T A
P D:Dissipated power.
θJT:Thermal resistance from the junction to the mounting tab of the package.
θCS:  T hermal resistance through the interface between the IC and the surface on which it is mounted. (typically,
θCS < 1.0 °C / W)
θSA:Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.
59
PCB θSA (°C / W )
2
PCB heat sink size (mm ) 500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Recommended figure of PCB area used as a heat sink.
through hole vias
(Top View)
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(Bottom View)
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
5-Pin Plastic TO-220
INCHES
S
B
MIN
TYP
A
0.560
-
TYP
MAX
0.650 14.23
-
16.51
B
0.380
-
0.420
9.66
-
10.66
C 0.140
-
0.190
3.56
-
4.82
D 0.018
-
0.035
0.46
-
0.89
F
0.140
-
0.160
3.56
-
4.06
G 0.134
-
-
3.40
-
-
J
0.012
-
0.045
0.31
-
1.14
K
0.500
-
0.580 12.70
-
14.73
C
T
F
A
N
K
D
MILLIMETERS
MAX
MIN
0.268 TYP
6.80 TYP
R 0.080
-
0.115
2.04
-
2.92
S
0.045
-
0.055
1.14
-
1.39
T
0.230
-
0.270
5.85
-
6.85
R
G
N
J
5-Pin Plastic TO-263
INCHES
C
A
D
I
B
K
N
MIN
TYP
A
0.400
-
B
0.351
MILLIMETERS
MAX
MIN
TYP
MAX
0.420 10.16
-
10.67
-
0.361
8.92
-
9.17
C 0.171
-
0.181
4.34
-
4.59
D 0.045
-
0.055
1.14
-
1.40
E
0.013
-
0.017 0.330
-
0.432
F
0.029
-
0.035 0.737
-
0.889
G 0.062
-
0.072
1.57
-
1.83
I
-
-
0.065
-
-
1.65
K
0.575
0.625 14.60
15.87
L
0.090
0.110
2.79
M
L
E
F
G
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2.29
M
7°
7°
N
3°
3°
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AMC7580
AMC DOC. #: AMC7580_E (LF)
Feb
7A LOW DROPOUT REGULATOR
2005
IMPORTANT NOTICE
ADD Microtech (ADDM) reserves the right to make changes to its products or to discontinue any integrated circuit
product or service without notice, and advises its customers to obtain the latest version of relevant information to
verify, before placing orders, that the information being relied on is current.
A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe
property or environmental damage. ADDM integrated circuit products are not designed, intended, authorized, or
warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of
ADDM products in such applications is understood to be fully at the risk of the customer. In order to minimize
risks associated with the customer’s applications, the customer should provide adequate design and operating
safeguards.
ADDM assumes to no liability to customer product design or application support. ADDM warrants the performance
of its products to the specifications applicable at the time of sale.
U.S.
Asia Pacific region
ADD Microtech Inc.
492 Altamont Drive
Milpitas, CA 95035
ADD Microtech Corp
13F, NO. 287, Sec. 3, Nan Jing E. Rd.,
Taipei, Taiwan 105
T E L : (408) 9410420
F A X : (408) 9410864
T E L : 2-27132800
F A X : 2-27132805
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