TECHNOLOGIES INC. Thin Film Passives RF Components Electro-Optics C-BAND SOLID STATE POWER AMPLIFIERS F E AT U R E S • • • • • • C -Band Frequency Output Power: 5 W, 10 W, 20 W High Gain > 53 dB High Linearity Low Noise Figure Unconditionally Stable PA C K A G I N G • • • • • • Hermetically Sealed Input/Output SMA Connectors Coaxial or Waveguide Interface OMT or Bracket Mount Low Profile Weather proof Outdoor Enclosure A P P L I C AT I O N S • Private Data Network • Voice Communications • Transaction Data Interchange Nanowave Technologies Inc. 425 Horner Avenue, Etobicoke, Ontario M8W 4W3 Canada Tel: 416.252.5602 Fax: 416.252.7077 www.nanowavetech.com Subsystem OUTLINE DIAGRAM TC CHARACTERISTICS MODEL MC2393, MC2404, MC2405 MODEL MC2405 MC2404 MC2393 Frequency 5.850 – 6.425 GHz 5.850 – 6.425 GHz 5.850 – 6.425 GHz Small Signal Gain 59 dB typ. at 25 °C 56 dB typ. at 25 °C 53 dB typ. at 25 °C <2.0 dBp -p/575 MHz at P1dB <0.1 dBp -p/2 MHz <0.4 dBp -p/40 MHz <2 dB change over –40°C to 75 °C at any single freq. (temp. measured at baseplate) < 5 dB >20 W (+43.0 dBm) at +75 °C baseplate + 10 dBm > +51 dBm measured for two +37 dBm carriers at +25 °C <3.0 dBp -p/575 MHz at P1dB <0.1 dBp -p/2 MHz <0.4 dBp -p/40 MHz <2 dB change over –40°C to 75 °C at any si ngle freq. (temp. measured at baseplate) < 5 dB >10 W (+40.0 dBm) at +75 °C baseplate + 10 dBm > +48 dBm measured for two +34 dBm carriers at +25 °C <3.0 dBp -p/575 MHz at P1dB <0.1 dBp -p/2 MHz <0.4 dBp -p/40 MHz <2 dB change over –40°C to 75 °C at any single freq. (temp. measured at baseplate) < 5 dB >5 W (+37.0 dBm) at +75 °C baseplate + 10 dBm > +45 dBm me asured for two +31 dBm carriers at +25 °C +12 to +13 VDC 12 A at +25 °C Solder terminal feedthru capacitor with ground terminal or lug. Meets all specs with up to 100 mV p -p at 50 - 1200 kHz ac input ri pple +12 to +13 VDC < 7.0 A at +25 °C Solder terminal feedthru capacitor with ground terminal or lug. Meets all specs with up to 100 mV p -p at 50 - 1200 kHz ac input ripple +12 to +13 VDC < 5.0 A at +25 °C Solder terminal feedthru capacitor with ground ter minal or lug. Meets all specs with up to 100 mV p -p at 50 - 1200 kHz ac input ripple 15 dBm min 15 dBm min 15 dBm min Output Return Loss 15 dBm min 15 dBm min 18 dBm min Inp. Connector SMA-Female (N -Type Optional) SMA-Female (N -Type O ptional) SMA-Female (N -Type Optional) Output Connector SMA-Female (N -Type Optional) SMA-Female (N -Type Optional) SMA-Female (N -Type Optional) RF Detector -40 dBc ± 1.0 dB -40 dBc ± 1.0 dB -40 dBc ± 1.0 dB DC Indicator 2.0 – 2.3 V 2.0 – 2.3 V 2.0 – 2.3 V Noise Figure 10 dB max 10 dB max 10 dB max • -70 dBc 5.8 -6.4 GHz at P1dB -3dB • -70 dBc at 10.95 -12.75 GHz • -70 dBc at 3.7 -4.2 GHz -50 dBc • -70 dBc 5.8 -6.4 GHz at P1dB -3dB • -70 dBc at 10.95 -12.75 GHz • -70 dBc at 3.7 -4.2 GHz -50 dBc • -70 dBc 5.8 -6.4 GHz at P1dB -3dB • -70 dBc at 10.95 -12.75 GHz • -70 dBc at 3.7 -4.2 GHz -50 dBc Unconditionally stable into any load/source condition < 3 °/dB at P1dB Unconditionally stable into any load/source condition < 3 °/dB at P1dB Unconditionally stable into any load/source condition < 2 °/dB at P1dB -40 °C to +65 °C baseplate -54 °C to +85 °C 5 to 95% (housing is laser sealed) No permanent damage after 2 ft drop onto a ?” plywood surface on concrete > 50 000 hrs -40°C to +65 °C baseplate -54°C to +85 °C 5 to 95% (housing is laser sealed) No permanent damage after 2 ft drop onto a ?” plywood surface on concrete > 50 000 hrs -40°C to +65 °C baseplate -54°C to +85 °C 5 to 95% (housing is laser sealed) No permanent damage after 2 ft drop onto a ?” plywood surface on concrete > 50 000 hrs Gain Variation Full Band Per 2MHz Per 40 MHz Gain vs Temp. Gain - 7.3 GHz P1dB Max Input Power rd 3 Order Intercept Point Voltage Current (typ.) Connector DC Inp.Ripple Input Return Loss Spurious Harmonics Stability AM/PM Conversion Temperature Operating Storage Humidity Shock/vibration MTBF Specifications are subject to change without notification. Consult Nanowave Technologies, Inc. for specific applications/requirements. TECHNOLOGIES INC. Thin Film Passives RF Components Electro-Optics Subsystem