PDI-C172SMF Photodiode in Plastic Surface Mount Package PACKAGE DIMENSIONS INCH [mm] PACKAGE DIMENSIONS INCH [mm] .158 [4.00] .079 [2.00] .043 [1.10] CATHODE MARK .019 [0.48] CATHODE 2X .020 [0.51] .085 [2.15] 130° VIEWING ANGLE .197 [5.00] .158 [4.00] .173 [4.40] .012 [0.30] ANODE .142 [3.61] 2X .047 [1.19] CHIP DIMENSIONS INCH [mm] CHIP DIMENSIONS INCH [mm] 2X .158 [4.00] .118 [3.00] SQUARE SURFACE MOUNT SUGGESTEDPACKAGE PAD LAYOUT .109 [2.77] SQUARE ACTIVE AREA FEATURES • • • • Surface mount Photoconductive Low cost High speed FOR REFLOW SOLDERING SURFACE MOUNT PACKAGE DESCRIPTION APPLICATIONS The PDI-C172SMF is a blue enhanced PIN silicon photodiode ideal for high speed photoconductive or photovoltaic applications packaged in a black plastic surface mount package. • • • • ABSOLUTE MAXIMUM RATING (TA)= 23°C UNLESS OTHERWISE NOTED PARAMETER VBR Reverse Voltage TSTG Storage Temperature TO Operating Temperature TS Soldering Temperature* MIN MAX SPECTRAL RESPONSE 0.8 UNITS 60 V -55 +100 -40 +80 °C °C +260 °C 0.7 Responsivity (A/W) SYMBOL Photointerrupters Oximeter sensors Barcode Glucometers 0.6 0.5 0.4 0.3 0.2 0.1 * 1/16 inch from case for 3 seconds max. 0 250 350 450 550 650 750 850 950 1050 1150 Wavelength (nM) ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED SYMBOL ISC ID RSH CJ lrange VBR NEP tr CHARACTERISTIC TEST CONDITIONS Short Circuit Current Dark Current Shunt Resistance Junction Capacitance Spectral Application Range Breakdown Voltage Noise Equivalent Power Response Time H = 100 fc, 2850 K VR = 10 V VR = 10 mV VR = 10 V, f = 1 MHz Spot Scan I = 10 μA VR = 10V @ l=Peak RL = 1KΩ,VR = 10 V MIN TYP 90 4 400 15 840 60 MAX 30 1050 4x10-14 20 UNITS μA nA MW pF nm V W/ √ Hz nS **Response time of 10% to 90% is specified at 660nm wavelength light. Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change without notice. www.lasercomponents.com Issue: 08/06 / V1 / HW / api/si-pin/plastic-encap-sm/ pdi-c172smf.pdf Germany and other countries: LASER COMPONENTS GmbH, Phone: +49 8142 2864 0, Fax: +49 8142 2864 11, [email protected] Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, [email protected]