TIC216 SERIES SILICON TRIACS ● Sensitive Gate Triacs ● 6 A RMS ● Glass Passivated Wafer MT1 1 ● 400 V to 800 V Off-State Voltage MT2 2 ● Max IGT of 5 mA (Quadrants 1 - 3) G 3 TO-220 PACKAGE (TOP VIEW) Pin 2 is in electrical contact with the mounting base. MDC2ACA absolute maximum ratings over operating case temperature (unless otherwise noted) RATING SYMBOL VALUE TIC216D TIC216M Repetitive peak off-state voltage (see Note 1) TIC216S 600 VDRM V 700 TIC216N Full-cycle RMS on-state current at (or below) 70°C case temperature (see Note 2) UNIT 400 800 IT(RMS) 6 A Peak on-state surge current full-sine-waveat (or below) 25°C case temperature (see Note 3) ITSM 60 A Peak gate current IGM ±1 A Peak gate power dissipation at (or below) 85°C case temperature (pulse width ≤ 200 µs) PGM 2.2 W Average gate power dissipation at (or below) 85°C case temperature (see Note 4) PG(AV) 0.9 W Operating case temperature range TC -40 to +110 °C Storage temperature range Tstg -40 to +125 °C TL 230 °C Lead temperature 1.6 mm from case for 10 seconds NOTES: 1. These values apply bidirectionally for any value of resistance between the gate and Main Terminal 1. 2. This value applies for 50-Hz full-sine-wave operation with resistive load. Above 70°C derate linearly to 110°C case temperature at the rate of 150 mA/°C. 3. This value applies for one 50-Hz full-sine-wave when the device is operating at (or below) the rated value of on-state current. Surge may be repeated after the device has returned to original thermal equilibrium. During the surge, gate control may be lost. 4. This value applies for a maximum averaging time of 20 ms. electrical characteristics at 25°C case temperature (unless otherwise noted ) PARAMETER IDRM IGT Repetitive peak off-state current TEST CONDITIONS MIN VD = rated VDRM IG = 0 TC = 110°C TYP MAX UNIT ±2 mA Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs 5 Gate trigger Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs -5 current Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs -5 Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs 10 mA † All voltages are with respect to Main Terminal 1. DECEMBER 1971 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. 1 TIC216 SERIES SILICON TRIACS electrical characteristics at 25°C case temperature (unless otherwise noted) (continued) PARAMETER VGT VT TYP MAX tp(g) > 20 µs 2.2 Gate trigger Vsupply = +12 V† RL = 10 Ω tp(g) > 20 µs -2.2 voltage Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs -2.2 On-state voltage Holding current IL Latching current dv/dt(c) MIN RL = 10 Ω IH dv/dt TEST CONDITIONS Vsupply = +12 V† Critical rate of rise of off-state voltage Critical rise of commutation voltage Vsupply = -12 V† RL = 10 Ω tp(g) > 20 µs 3 IT = ±8.4 A IG = 50 mA (see Note 5) ±1.7 Vsupply = +12 V† IG = 0 Init’ ITM = 100 mA 30 Vsupply = -12 V† IG = 0 Init’ ITM = -100 mA -30 Vsupply = +12 V† Vsupply = -12 V† 4 (see Note 6) IG = 0 TC = 110°C VDRM = Rated VDRM ITRM = ±8.4 A TC = 70°C ±2 V V mA mA -2 VDRM = Rated VDRM UNIT ±20 V/µs ±5 V/µs † All voltages are with respect to Main Terminal 1. NOTES: 5. This parameter must be measured using pulse techniques, t p = ≤ 1 ms, duty cycle ≤ 2 %. Voltage-sensing contacts separate from the current carrying contacts are located within 3.2 mm from the device body. 6. The triacs are triggered by a 15-V (open-circuit amplitude) pulse supplied by a generator with the following characteristics: R G = 100 Ω, tp(g) = 20 µs, tr = ≤ 15 ns, f = 1 kHz. thermal characteristics PARAMETER RθJC Junction to case thermal resistance RθJA Junction to free air thermal resistance MIN 2 TYP MAX UNIT 2.5 °C/W 62.5 °C/W DECEMBER 1971 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. TIC216 SERIES SILICON TRIACS MECHANICAL DATA TO-220 3-pin plastic flange-mount package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. TO-220 4,70 4,20 ø 10,4 10,0 3,96 3,71 1,32 1,23 2,95 2,54 6,6 6,0 15,32 14,55 18,0 TYP. 6,1 5,6 1,47 1,07 0,97 0,66 1 2 14,1 12,7 3 2,74 2,34 5,28 4,68 0,64 0,41 2,90 2,40 ALL LINEAR DIMENSIONS IN MILLIMETERS NOTE A: The centre pin is in electrical contact with the mounting tab. DECEMBER 1971 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. 3