ETC 431111500270

ANTENNA PRODUCTS
DATA SHEET
www.phycomp-components.com
2.45 GHz ISM-band antenna for
Bluetooth and WLAN IEEE 802.11b
(Long Shape)
Surface-mount ceramic
multilayer antennas
Product specification
2002 July 08 Rev.0
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth
and WLAN IEEE 802.11b (Long Shape)
FEATURES
DESCRIPTION
ENVIRONMENTAL CARE
œ Designed for 2.45 GHz ISM-band
This 2.45 GHz ceramic multilayer
antenna has been designed to meet
the requirements of the BluetoothTM(1)
and IEEE 802.11b wireless
communications protocol. It consists
of a rectangular block of low-dielectric
ceramic material and is fabricated in a
water-based non-toxic process. The
antenna is capable of providing good
connectivity using near 50 W
microstrip directly onto the PC board.
The foil making process
uses an environmentfriendly aqueous-solvent
technology that fully
complies with today’s green-product
design requirements. All terminations
are lead-free. Packing materials can
be recycled.
œ Simplifies antenna circuitry
œ NiSn lead-free terminations
œ suitable for wave and reflow
soldering
œ Supplied in tape on reel.
APPLICATIONS
œ Telecommunications
œ Computing (PCs, printers, PDAs)
œ Wireless office data
communications including WLAN
œ Consumer electronics (wireless
headphones).
(1) Bluetooth is a trademark owned by
Telefonieaktiebolaget L M Ericsson,
Sweden.
QUICK REFERENCE DATA
DESCRIPTION
VALUE
Center frequency
2.45, 2.60 and 2.70 GHz
Bandwidth
100 MHz
Gain
0 dBi max.
VSWR
2 max.
Polarization
Linear
Azimuth beamwidth
Omni-directional
Impedance
50 W
Power dissipation
1W
Operating temperature
-55 to +125 •C
Terminations
NiSn
Resistance to soldering heat
260 •C for 10 s
Weight
0.16 g
2002 July 08 Rev.0
2
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
MECHANICAL DATA
S1
W
S1
C
L
C
F
T
F
Dimensions in mm
HBK100
For dimensions see Table 1.
Fig.1 Dimensional outline.
Physical dimensions
Table 1
Antenna dimensions
L
W
T
F
C
S1
–
–
–
feed
termination
–
NC
solder
termination
0.9 –0.2
1.25 –0.25
0.5 ±0.3
1.25 –0.35
Dimensions in millimetres
8.0 –0.25
3.5 –0.2
Device marking
CENTER
FREQUENCY
(GHZ)
MARKING
CODE
2.45
no marking
2.60
6
2.70
7
2002 July 08 Rev.0
3
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
ELECTRICAL CHARACTERISTICS
DESCRIPTION
VALUE
Center frequency
2.45, 2.60 and 2.70 GHz
Bandwidth
100 MHz
Gain
0 dBi max.
VSWR
2 max.
Polarization
Linear
Azimuth beamwidth
Omni-directional
Impedance
50 W
Power dissipation
1W
Operating temperature
-55 to +125 •C
Terminations
NiSn
Resistance to soldering heat
260 •C, 10 sec.
FOOTPRINT DIMENSIONS
L
C
C
ANTENNA
S1
F
Dimensions in mm
HBK101
For dimensions see Table 2.
Fig.2 Recommended dimensions of solder lands.
Physical dimensions
Table 2
Recommended solder land pattern
L
F
C
S1
–
feed pad
–
NC
mounting pad
0.90 –0.10
1.40 –0.10
Dimensions in millimetres
9.0 –0.10
1.40 –0.10
2002 July 08 Rev.0
4
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
STANDARD TEST BOARD FOR RADIATION PATTERN AND SWR MEASUREMENTS
SMA
connector
23
5
0.8
2.6
15
1.2
50 Ω
transmisson
line
antenna
chip
Dimensions in mm
HBK104
Fig.3 Typical FR4 test board.
HBK105
insertion loss (dB)
50
50
25
40
100
30
2 GHz
20
10
250
Ω
10
4
+j
0
0
−10
1
3
−20
10
25
1
100
250
∞
−j
4
Ω
2
−30
Ω
2
10
3
3 GHz
250
−40
−50
2.0
100
25
2.2
2.4
2.6
2.8
3.0
f (GHz)
50
CH1 Marker data:
Min.
BW: .225952238 GHz
Cent: 2.4551577144 GHz
Q: 10.866
1 loss: -21.413 dB.
HBK106
Marker data:
1: 42.73 W/-3.05 W; f = 2.485 GHz
2: 47.69 W/-11.76 W; f = 2.455 GHz
3: 82.08 W/-28.19 W; f = 2.34 GHz
4: 37.24 W/-25.78 W; f = 2.568 GHz.
Fig.4 Typical SWR and characteristic impedance measurements.
2002 July 08 Rev.0
5
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
0°
0°
−40
−90°
−30
−20
−10
0 dBi
−40
−90°
90°
−20
−10
0
dBi
90°
HBK102
180°
HBK103
180°
−30
H-plane
E-plane
Fig.5 Typical radiation patterns.
APPLICATION EXAMPLE
8
2
CLEARANCE
(no ground plane)
GROUND PLANE (on back side)
6
ANTENNA
CHIP
BLUETOOTH OR OTHER
RF MODULE
CLEARANCE
(no ground plane)
6
HBK099
Dimensions in mm
50 Ω transmisson line
(micrstrip or coplaner waveguide)
Note:
The ground termination can be
optionally connected to RF ground.
Fig.6 Suggested layout.
2002 July 08 Rev.0
6
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
ORDERING INFORMATION
Components may be ordered by using either a simple 16-digit clear text code or Phycomp’s unique 12NC.
Ordering example for a 2.45 GHz antenna, 1000 pieces supplied in blister tape on 180 mm reel.
Clear text ordering code
EXAMPLE: AN2450000708031K
PRODUCT
CENTER
FREQUENCY
BANDWIDTH
MATERIAL
SIZE
QUANTITY
PACKING
AN
2450
00
07
0803
1
K
AN = antenna
2450 = 2.45 GHz
2600 = 2.60 GHz
2700 = 2.70 GHz
00 = 100 MHz
07 = K7
0803 =
8.0 ™ 3.5 ™ 0.9 mm
1 = 1000 pcs
4 = 4000 pcs
K = 180 mm; 7" blister
F = 330 mm; 13" blister
B = bulk case
12NC ordering code
EXAMPLE: 4311 115 00245
4 3XX 1 1 5 0 0XXX
Family
43 antenna
Center frequency
245 2.45 GHz
260 2.60 GHz
270 2.70 GHz
Packing
11 180 mm / 7” reel, blister, 1000 pcs
12 330 mm / 13” reel, blister, 4000 pcs
13 bulk, 1000 pcs
Tolerance
00 100 MHz bandwidth
(VSWR <2)
Material
1 high-frequency material
Size
15
2002 July 08 Rev.0
7
8.0 ™ 3.5 ™ 0.9 mm
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
TESTS AND REQUIREMENTS
Table 3
Test procedures and requirements
IEC
60 384-10
CECC
32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
4.4
mounting
The antenna may be mounted on a
printed-circuit boards or ceramic
substrates by applying wave
soldering, reflow soldering (including
vapour phase soldering) or
conductive adhesive
4.5
visual inspection any applicable method using ™10
and dimension
magnification
check
REQUIREMENTS
no visual damage
no cracks or fissures larger than
4 mm
4.6.1
antenna
frequency: 2.45 GHz @ 20 •C
standard test board from Fig.3
4.8
adhesion
a force of 5 N applied for 10 s to the
line joining the terminations and in a
plane parallel to the substrate
no visible damage
4.9
bond strength of
plating on end
face
mounted in accordance with
CECC 32 100, paragraph 4.4
no visible damage
conditions: bending 1 mm at a rate of
1 mm/s; radius jig: 340 mm; 2 mm
warp on FR4 board of 90 mm length
no visible damage
resistance to
soldering heat
260 –5 •C for 10 –0.5 s in a static
solder bath
the terminations shall be well
tinned after recovery; center
frequency shift within –6%
resistance to
leaching
260 –5 •C for 30 –1 s in a static
solder bath
using visual enlargement of
™10; dissolution of the
terminations shall not exceed
10%
4.10
20 (Tb)
4.11
20 (Ta)
solderability
zero hour test and test after storage the terminations must be well
(20 to 24 months) in original packing tinned for at least 75%
in normal atmosphere; unmounted
chips completely immersed for
2 –0.5 s in a solder bath at 235 –5 •C
4.12
4 (Na)
rapid change of
temperature
-55 •C (30 minutes) to +125 •C
(30 minutes); 100 cycles
no visual damage; center
frequency shift within –6%
4.14
3 (Ca)
damp heat
500 –12 hours at 60 •C; 90 to 95%
RH
no visual damage; 2 hours
recovery; center frequency shift
within –6%
endurance
500 –12 hours at 125 •C
no visual damage; 2 hours
recovery; center frequency shift
within –6%
4.15
2002 July 08 Rev.0
8
www.phycomp-components.com
Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for Bluetooth and
WLAN IEEE 802.11b (Long Shape)
REVISION HISTORY
Revision
Date
Change
Notification
Description
Rev.0
2002 Jul 08
–
- First issue of this specification
2002 July 08 Rev.0
9
www.phycomp-components.com