IL260 IL261 High Speed Five Channel Digital Couplers Functional Diagram Features • • • • • • • • • • • 3.3 V or 5 V CMOS/TTL Compatible 110 Mbps Data Rate 2500 VRMS Isolation (1 min) 2 ns Typical Pulse Width Distortion 4 ns Typical Propagation Delay Skew 10 ns Typical Propagation Delay 30 kV/ms Typical Transient Immunity 2 ns Channel to Channel Skew 0.3'' and 0.15'' 16–Pin SOIC Packages Extended Temperature Range (-40°C to +85°C) UL1577 Approval Pending • IEC 61010-1 Approval Pending Applications • • • • • • • • • • • ADCs and DACs Multiplexed Data Transmission Data Interfaces Board-To-Board Communication Digital Noise Reduction Operator Interface Ground Loop Elimination Peripheral Interfaces Parallel Bus Logic Level Shifting Plasma Displays Description NVE's family of high-speed digital isolators are CMOS devices created by integrating active circuitry and our GMRbased and patented* IsoLoop® technology. The IL260 and IL261 are five channel versions of the world's fastest digital isolator with a 110 Mbps data rate. This device provides the designer with the most compact isolated logic devices yet available. All transmit and receive channels operate at 110 Mbps over the full temperature and supply voltage range. The symmetric magnetic coupling barrier provides a typical propagation delay of only 10 ns and a pulse width distortion of 2 ns achieving the best specifications of any isolator device. Typical transient immunity of 30 kV/µs is unsurpassed. High channel density make them ideally suited to isolating multiple ADCs and DACs, parallel buses and peripheral interfaces. Performance is specified over the temperature range of -40°C to +85°C without any derating. . Isoloop® is a registered trademark of NVE Corporation. *U.S. Patent number 5,831,426; 6,300,617 and others. ISB-DS-001-IL612-A, January 20, 2005 NVE Corp., 11409 Valley View Road, Eden Prairie, MN 55344-3617, U.S.A. Telephone: 952-829-9217, Fax 952-829-9189, www.isoloop.com © 2005 NVE Corporation IL260 IL261 Absolute Maximum Ratings Parameters Storage Temperature Ambient Operating Temperature Supply Voltage Input Voltage Output Voltage Output Current Lead Solder Temperature ESD Symbol Min. TS TA VDD1 ,VDD2 VI VO IO -55 -55 -0.5 -0.5 -0.5 -10 Typ. Max. Units Test Conditions °C °C V V V mA °C Drive Channel 10 s Max. Units Test Conditions 85 5.5 5.5 VDD 0.8 1 °C V V mA V µsec Max. Units 175 125 7 VDD+0.5 VDD+0.5 10 280 2 kV Human Body Model Recommended Operating Conditions Parameters Ambient Operating Temperature(1) Supply Voltage Supply Voltage Logic High Input Voltage Logic Low Input Voltage Minimum Input Signal Rise and Fall Times Symbol Min. TA VDD1 ,VDD2 VDD1 ,VDD2 VIH VIL tIR, tIF -40 3.0 4.5 2.4 0 Symbol Min. Typ. 3.3/5.0 V Operation 5 V Operation Insulation Specifications Parameters Creepage Distance (external) 0.15'' SOIC 0.30'' SOIC Leakage Current(5) Barrier Impedance (5) Typ. 4.026 8.077 mm mm µARMS Ω || pC 0.2 >1014||7 Test Conditions 240 VRMS Safety & Approvals IEC61010-1 Approval Pending TUV Certificate Numbers: Classification Model IL260, IL261 IL260-3, IL261-3 .30'' 16-pin SOIC Pollution Degree II Material Group III Max. Working Voltage 300 VRMS .15'' 16-pin SOIC II III 150 VRMS Package UL 1577 Component Recognition program. File #: Approval Pending Rated 2500VRMS for 1 minute (SOIC, PDIP), 1000VRMS for 1 minute (MSOP) Electrostatic Discharge Sensitivity This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. 2 IL260 IL261 IL260 Pin Connections 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 IN1 GND1 IN2 IN3 IN4 VDD1 IN5 GND1 GND2 OUT5 OUT4 OUT3 OUT2 OUT1 GND2 VDD2 Input 1 Ground Pins 2 and 8 connected internally Input 2 Input 3 Input 4 Supply Voltage 1 Input 5 Ground Pins 2 and 8 connected internally Ground Pins 9 and 15 connected internally Output 5 Output 4 Output 3 Output 2 Output 1 Ground Pins 9 and 15 connected internally Supply Voltage 2 IL260 * Pins 2 and 8 internally connected ** Pins 9 and 15 internally connected IL260 Pin Connections 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD1 GND1 IN1 IN2 IN3 IN4 OUT5 GND1 GND2 IN5 OUT4 OUT3 OUT2 OUT1 GND2 VDD2 Supply Voltage 1 Ground Pins 2 and 8 connected internally Input 1 Input 2 Input 3 Input 4 Output 5 Ground Pins 2 and 8 connected internally Ground Pins 9 and 15 connected internally Input 5 Output 4 Output 3 Output 2 Output 1 Ground Pins 9 and 15 connected internally Supply Voltage 2 IL261 * Pins 2 and 8 internally connected ** Pins 9 and 15 internally connected 3 IL260 IL261 3.3 Volt Electrical Specifications Electrical Specifications are Tmin to Tmax Parameters Input Quiescent Current IL260 IL261 Output Quiescent Current IL260 IL261 Logic Input Current Logic High Output Voltage Logic Low Output Voltage Maximum Data Rate Minimum Pulse Width Propagation Delay Input to Output (High to Low) Propagation Delay Input to Output (Low to High) Pulse Width Distortion |tPHL-tPLH| (2) Propagation Delay Skew (3) Output Rise Time (10-90%) Output Fall Time (10-90%) Common Mode Transient Immunity (Output Logic High to Logic Low)(4) Channel to Channel Skew Dynamic Power Consumption(6) Symbol IDD1 Min. Typ. 30 1.5 6.5 5.5 IDD2 Ii VOH VOL PW tPHL -10 VDD-0.1 0.8*VDD VDD VDD-0.5 0 0.5 Switching Specifications 100 110 10 12 Max. 50 2.0 10 8 10 0.1 0.8 Units µA mA mA mA µA V V 18 Mbps ns ns Test Conditions IO = -20 µA, VI=VIH IO = -4 mA, VI=VIH IO = 20 µA, VI=VIL IO = 4 mA, VI=VIL CL = 15 pF 50% Points, VO CL = 15 pF, tPLH 12 18 ns CL = 15 pF, PWD tPSK tR tF |CMH|,|CML| 2 4 2 2 30 3 6 4 4 ns ns ns ns kV/µs CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF VCN = 300 V 2 200 3 240 ns µA/MHz CL = 15 pF per channel Typ. 30 2.5 10 8 Max. 50 3.0 15 12 10 Units µA mA mA mA µA V 20 5 Volt Electrical Specifications Electrical Specifications are Tmin to Tmax Parameters Input Quiescent Current IL260 IL261 Output Quiescent Current IL260 IL261 Logic Input Current Logic High Output Voltage Logic Low Output Voltage Maximum Data Rate Minimum Pulse Width Propagations Delay Input to Output (High to Low) Propagations Delay Input to Output (Low to High) Pulse Width Distortion |tPHL-tPLH| (2) Propagation Delay Skew (3) Output Rise Time (10-90%) Output Fall Time (10-90%) Common Mode Transient Immunity (Output Logic High to Logic Low) Channel to Channel Skew Dynamic Power Consumption(6) Symbol IDD1 Min. IDD2 Ii VOH VOL PW tPHL -10 VDD-0.1 0.8*VDD VDD VDD-0.5 0 0.5 Switching Specifications 100 110 10 10 0.1 0.8 V 15 Mbps ns ns Test Conditions IO = -20 µA, VI=VIH IO = -4 mA, VI=VIH IO = 20 µA, VI=VIL IO = 4 mA, VI=VIL CL = 15 pF 50% Points, VO CL = 15 pF, tPLH 10 15 ns CL = 15 pF, PWD tPSK tR tF |CMH|,|CML| 2 4 1 1 30 3 6 3 3 ns ns ns ns kV/µs CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF VCN = 300 V 2 280 3 340 ns µA/MHz CL = 15 pF per channel 20 4 IL260 IL261 Notes: (Apply to both 3.3 V and 5 V specifications.) 1. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not guarantee performance. 2. PWD is defined as | tPHL– tPLH |. %PWD is equal to the PWD divided by the pulse width. 3. tPSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at 25°C. 4. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. CML is the maximum common mode input voltage that can be sustained while maintaining VO < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 5. Device is considered a two terminal device: pins 1-8 shorted and pins 9-16 shorted. 6. Dynamic power consumption numbers are calculated per channel and are supplied by the channel’s input side power supply. 5 IL260 IL261 Application Notes Data Transmission Rates The reliability of a transmission system is directly related to the accuracy and quality of the transmitted digital information. For a digital system, those parameters which determine the limits of the data transmission are pulse width distortion and propagation delay skew. Dynamic Power Consumption Isoloop® devices achieve their low power consumption from the manner by which they transmit data across the isolation barrier. By detecting the edge transitions of the input logic signal and converting these to narrow current pulses, a magnetic field is created around the GMR Wheatstone bridge. Depending on the direction of the magnetic field, the bridge causes the output comparator to switch following the input logic signal. Since the current pulses are narrow, about 2.5ns wide, the power consumption is independent of markto-space ratio and solely dependent on frequency. This has obvious advantages over optocouplers whose power consumption is heavily dependent on its on-state and frequency. Propagation delay is the time taken for the signal to travel through the device. This is usually different when sending a low-to-high than when sending a high-to-low signal. This difference, or error, is called pulse width distortion (PWD) and is usually in ns. It may also be expressed as a percentage: PWD% = Maximum Pulse Width Distortion (ns) Signal Pulse Width (ns) The approximate power supply current per channel for x 100% For example: For data rates of 12.5 Mb PWD% = 3 ns 80 ns Power Supply Decoupling Both power supplies to these devices must be decoupled with low ESR 100 nF ceramic capacitors. For data rates in excess of 10MBd, use of ground planes for both GND1 and GND2 is highly recommended. Capacitors should be located as close as possible to the device. x 100% = 3.75% This figure is almost three times better than for any available optocoupler with the same temperature range, and two times better than any optocoupler regardless of published temperature range. The IsoLoop® range of isolators will run at almost 35 Mb before reaching the 10% limit. Propagation delay skew is the difference in time taken for two or more channels to propagate their signals. This becomes significant when clocking is involved since it is undesirable for the clock pulse to arrive before the data has settled. A short propagation delay skew is therefore critical, especially in high data rate parallel systems, to establish and maintain accuracy and repeatability. The IsoLoop® range of isolators all have a maximum propagation delay skew of 6 ns, which is five times better than any optocoupler. The maximum channel-to-channel skew in the IsoLoop® coupler is only 3 ns which is ten times better than any optocoupler. Signal Status on Start-up and Shut Down To minimize power dissipation, the input signals are differentiated and then latched on the output side of the isolation barrier to reconstruct the signal. This could result in an ambiguous output state depending on power up, shutdown and power loss sequencing. Therefore, the designer should consider the inclusion of an initialization signal in his start-up circuit. Initialization consists of toggling each channel either high then low or low then high, depending on the desired state. 6 IL260 IL261 Application Diagrams Figure 1 Single Channel ∆Σ Figure 1 shows a typical single channel ∆Σ ADC application. The A/D is located on the bridge with no signal conditioning electronics between the bridge sensor and the ADC. In this application, the IL717 is the best choice for isolation. It isolates the control bus from the microcontroller. The system clock is located on the isolated side of the system. Figure 2 Multi Channel ∆Σ The second ∆Σ application is where multiple ADC's are configured in a channel-to-channel isolation configuration. The problem for designers is how to control clock jitter and edge placement accuracy of the system clock for each ADC. The best solution is to use a single clock on the system side and distribute this to each ADC. The IL261 adds a 5th channel to the IL717. This 5th channel is used to distribute a single, isolated clock to multiple ADC's as shown in Figure 2. 7 IL260 IL261 Package drawings, dimensions and specifications 0.15’’ 16-pin SOIC 0.3’’ 16-pin SOIC 8 IL260 IL261 Ordering information and valid part numbers. 9 IL260 IL261 About NVE An ISO 9001 Certified Company NVE Corporation is a high technology components manufacturer having the unique capability to combine leading edge Giant Magnetoresistive (GMR) materials with integrated circuits to make high performance electronic components. Products include Magnetic Field Sensors, Magnetic Field Gradient Sensors (Gradiometer), Digital Magnetic Field Sensors, Digital Signal Isolators and Isolated Bus Transceivers. NVE is a leader in GMR research and in 1994 introduced the world’s first products using GMR material, a line of GMR magnetic field sensors that can be used for position, magnetic media, wheel speed and current sensing. NVE is located in Eden Prairie, Minnesota, a suburb of Minneapolis. Please visit our Web site at www.nve.com or call 952-8299217 for information on products, sales or distribution. NVE Corporation 11409 Valley View Road Eden Prairie, MN 55344-3617 USA Telephone: (952) 829-9217 Fax: (952) 829-9189 Internet: www.nve.com e-mail: [email protected] The information provided by NVE Corporation is believed to be accurate. However, no responsibility is assumed by NVE Corporation for its use, nor for any infringement of patents, nor rights or licenses granted to third parties, which may result from its use. No license is granted by implication, or otherwise, under any patent or patent rights of NVE Corporation. NVE Corporation does not authorize, nor warrant, any NVE Corporation product for use in life support devices or systems or other critical applications. The use of NVE Corporation’s products in such applications is understood to be entirely at the customer’s own risk. Specifications shown are subject to change without notice. ISB-DS-001-IL260/1-A January 17, 2005 10